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Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
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Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems

Alexander V. Korobko, Sana Fateh
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68121
https://doi.org/10.1115/IPACK2021-68121
View Paper titled, An Assessment of Effects of Nanofluids on Heat Transfer Performance of Two-Phase Cooling Systems
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Topics: Cooling systems, Heat transfer, Nanofluids, Heat, Critical heat flux, Data centers, Fluids, Thermal management, Boiling, Computation
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2605
https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6307
https://doi.org/10.1115/IPACK2019-6307
View Paper titled, Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
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Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8383
https://doi.org/10.1115/IPACK2018-8383
View Paper titled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8311
https://doi.org/10.1115/IPACK2018-8311
View Paper titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes

Kunrong Shen, Zhichuan Sun, Xiaolong Yan, Wei Li, David J. Kukulka, Jianxin Zhou, Deyu Luan, Yan He, Bin Zhang
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A023, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8449
https://doi.org/10.1115/IPACK2018-8449
View Paper titled, Comparison of Evaporation and Condensation Characteristics Among Three Enhanced Tubes
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Topics: Condensation, Evaporation, Heat transfer, Heat transfer coefficients, Refrigerants, Pressure drop, Temperature, Vapors, Climate change, Flux (Metallurgy)
Proceedings Papers

Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes

Wei Li, Chuancai Zhang, Zhichuan Sun, Zhichun Liu, Lianxiang Ma, Yan He, Bin Zhang, Wei Chen, David J. Kukulka
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A024, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8454
https://doi.org/10.1115/IPACK2018-8454
View Paper titled, Experimental Study on Flow Evaporation Heat Transfer Characteristics Inside Horizontal Three-Dimensional Enhanced Tubes
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Topics: Evaporation, Flow (Dynamics), Heat transfer, Heat transfer coefficients, Temperature, Turbulence, Vapors
Proceedings Papers

Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model

Sriram Chandrasekaran, Sushil Bhavnani
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74025
https://doi.org/10.1115/IPACK2017-74025
View Paper titled, Flow Distribution and Nucleation Suppression in a Small Form Factor Liquid Immersion Cooled Server Model
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Topics: Flow (Dynamics), Nucleation (Physics), Cooling, Boiling, Data centers, Fluids, Silicon, Bubbles, Electronics, Energy consumption
Proceedings Papers

Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Chi Zhang, Michael Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74090
https://doi.org/10.1115/IPACK2017-74090
View Paper titled, Copper Inverse Opal Surfaces for Enhanced Boiling Heat Transfer
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Topics: Boiling, Copper, Heat transfer, Bubbles, Critical heat flux, Cooling, Heat transfer coefficients, Microscale devices, Nucleation (Physics), Optical images
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74080
https://doi.org/10.1115/IPACK2017-74080
View Paper titled, State of the Art of Electronics Cooling for Radar Antenna Applications
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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet

Muhammad Ikhlaq, Baris Dogruoz, Omidreza Ghaffari, Mehmet Arik
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48094
https://doi.org/10.1115/IPACK2015-48094
View Paper titled, A Computational Study on the Momentum and Heat Transfer Distribution of a Low Frequency Round Impinging Synthetic Jet
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Topics: Heat transfer, Momentum, Nozzles, Boundary-value problems, Flow (Dynamics), Temperature, Computational fluid dynamics, Cooling, Diaphragms (Mechanical devices), Diaphragms (Structural)
Proceedings Papers

Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management

Kevin Bennion, Gilberto Moreno
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48382
https://doi.org/10.1115/IPACK2015-48382
View Paper titled, Convective Heat Transfer Coefficients of Automatic Transmission Fluid Jets With Implications for Electric Machine Thermal Management
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Topics: Convection, Jets, Machinery, Thermal management, Transmission fluids, Heat transfer coefficients, Temperature, Automotive industry, Cooling, Cooling systems
Proceedings Papers

Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A017, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48393
https://doi.org/10.1115/IPACK2015-48393
View Paper titled, Local Thermal Measurements of Impinging Liquid Jets With an Angled Confining Wall for Power Electronics Cooling
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Topics: Computer cooling, Jets, Flow (Dynamics), Heat transfer coefficients, Reynolds number, Copper, Electronics, Heat flux, Impingement cooling, Sensors
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48123
https://doi.org/10.1115/IPACK2015-48123
View Paper titled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)

Raphael Mandel, Serguei Dessiatoun, Patrick McCluskey, Michael Ohadi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48496
https://doi.org/10.1115/IPACK2015-48496
View Paper titled, Embedded Two-Phase Cooling of High Flux Electronics via Micro-Enabled Surfaces and Fluid Delivery Systems (FEEDS)
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Topics: Cooling, Electronics, Fluids, Vapors, Heat flux, Pressure drop, Computational fluid dynamics, Engineering simulation, Experimental design, Heat transfer
Proceedings Papers

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

X. Yu, C. Woodcock, Y. Wang, J. Plawsky, Y. Peles
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48103
https://doi.org/10.1115/IPACK2015-48103
View Paper titled, A Study on Flow Boiling in Microchannel With Piranha Pin Fin
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Topics: Boiling, Flow (Dynamics), Microchannels, Critical heat flux, Fluid dynamics, Heat transfer, Pressure drop, Design, Energy dissipation, Fluids
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48685
https://doi.org/10.1115/IPACK2015-48685
View Paper titled, Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods