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Proceedings Papers

Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management

Faramarz Kahbandeh, Daniel Harris, Mehmet Arik
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141130
https://doi.org/10.1115/IPACK2024-141130
View Paper titled, Numerical Analysis of Immersed Confined Coaxial Liquid Jet Impingement Heat Transfer for Electronics Thermal Management
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Topics: Electronics, Heat transfer, Numerical analysis, Thermal management
Proceedings Papers

Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures

Myriam Bouzidi, Junyoung Kim, Jonathan Goldman, Yogendra Joshi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140132
https://doi.org/10.1115/IPACK2024-140132
View Paper titled, Evaporative Thermal Management of Batteries in Electric Vehicles Using Flexible Structures
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Topics: Batteries, Electric vehicles, Flexible structures, Thermal management, Temperature, Heat, Cooling, Energy dissipation, Battery life, Coolants
Proceedings Papers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
https://doi.org/10.1115/IPACK2024-140105
View Paper titled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
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Topics: Copper, Forced convection, Water, Compression, Flow (Dynamics), Metal foams, Cooling, Heat, Computer cooling, Coolants
Proceedings Papers

Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System

Bharath Ram Ravi, Jiwon Yu, Stephen Keefe, Herman Chu, Chase Wealther
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139429
https://doi.org/10.1115/IPACK2024-139429
View Paper titled, Review of Commercial One-Dimensional Thermo-Fluid Solvers for Liquid Cooled Server System
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Topics: Cooling, Thermofluids, Heat, Internet of things, Artificial intelligence, Blockchain technology, Carbon footprint, Coolants, Cooling systems, Data centers
Proceedings Papers

Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces

Yimin Zhou, Solomon Adera
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141425
https://doi.org/10.1115/IPACK2024-141425
View Paper titled, Enhanced Pool Boiling Heat Transfer Using Re-Entrant Surfaces
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Topics: Heat transfer, Heat transfer coefficients, Nucleate boiling, Pool boiling, Thermal management
Proceedings Papers

A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling

Satyam Saini, Gautam Gupta, Pratik Bansode, Pardeep Shahi, Vibin Shalom Simon, Himanshu Modi, Dereje Agonafer, Jimil Shah
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
https://doi.org/10.1115/IPACK2023-112005
View Paper titled, A Numerical Study on the Influence of Mixed Convection Heat Transfer in Single-Phase Immersion Cooling
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Topics: Cooling, Data centers, Heat sinks, Heat transfer, Mixed convection, Thermal management
Proceedings Papers

Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots

Mahdi Farahikia, Ping-Chuan Wang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111725
https://doi.org/10.1115/IPACK2023-111725
View Paper titled, Computational Analysis of Thermal Performance of Water-Cooled Cold Plate for Chips With Hotspots
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Topics: Additive manufacturing, Pressure drop, Temperature uniformity, Thermal management, Water, Temperature, Temperature distribution, Heat transfer, Integrated circuits, Laminar flow
Proceedings Papers

Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments

Bidzina Kekelia, Qianying Wu, Sreekant Narumanchi, Joshua Major, Gilbert Moreno, Mehdi Asheghi, Ercan M. Dede, James Palko, Kenneth Goodson
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113781
https://doi.org/10.1115/IPACK2023-113781
View Paper titled, Reliability of Copper Inverse Opal Surfaces for Extreme-Heat-Flux Micro-Coolers in Low-Global-Warming-Potential Refrigerant R-1233zd Pool Boiling Experiments
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Topics: Copper, Critical heat flux, Data centers, Heat, Heat transfer, Microcoolers, Pool boiling, Refrigerants, Reliability
Proceedings Papers

Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study

Joseph Oh, Kenneth Taylor
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110688
https://doi.org/10.1115/IPACK2023-110688
View Paper titled, Numerical Modeling of Forced Air Convection for Thermal Management in Automotive ECU: A Component and System Level Study
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Topics: Computer simulation, Convection, Cooling, Heat sinks, Heat transfer, Thermal management
Proceedings Papers

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111414
https://doi.org/10.1115/IPACK2023-111414
View Paper titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Convection, Cooling, Electronics, Forced convection, Thermal management, Rotors, Temperature, Electronic packaging, Fans, Flow (Dynamics)
Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Joshua Kasitz, Larry Marshall, Jr., David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
https://doi.org/10.1115/IPACK2022-97399
View Paper titled, Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability
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Topics: Cooling, Heat transfer, Nanoparticles, Phase change materials, Thermal conductivity
Proceedings Papers

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
https://doi.org/10.1115/IPACK2022-97266
View Paper titled, Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability
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Topics: Critical heat flux, Fluids, Heat transfer, Oxidation, Pool boiling
Proceedings Papers

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97446
https://doi.org/10.1115/IPACK2022-97446
View Paper titled, Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
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Topics: Additive manufacturing, Computer simulation, Cooling, Geometry, Heat, Heat sinks, Heat transfer, Manifolds, Nozzles
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Rika Nogita, Atsuyuki Mitani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-67330
https://doi.org/10.1115/IPACK2021-67330
View Paper titled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat transfer, Nanofluids, Particulate matter, Pressure, Water
Proceedings Papers

Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications

John Kim, Raffaele L. Amalfi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72618
https://doi.org/10.1115/IPACK2021-72618
View Paper titled, Machine Learning-Based Model for Optimal Operating Conditions of Thermosyphons for Electronic Cooling Applications
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Topics: Computer cooling, Heat transfer, Machine learning, Machinery, Refrigerants, Two-phase flow