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Proceedings Papers

Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73313
https://doi.org/10.1115/IPACK2021-73313
View Paper titled, Performance and Durability Validation of Voltage Blocking Technologies to Enable Direct Cooled High-Voltage, High-Power Modules
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Topics: Coatings, Coolants, Cooling, Design, Durability, Electric fields, Electronics, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

Ehsan B. Haghighi, Thanh L. Phan, Vijit Wuttijumnong, Koichi Mashiko, Yuji Saito, Masataka Mochizuki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A007, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48671
https://doi.org/10.1115/IPACK2015-48671
View Paper titled, Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules
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Topics: Cooling, Heat pipes, Heat sinks, Manufacturing, Air flow, Forced convection, Heat, Heat losses, Telecommunications, Thermal management
Proceedings Papers

A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48175
https://doi.org/10.1115/IPACK2015-48175
View Paper titled, A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection
Open the PDF for A Method for Thermal Performance Characterization of Ultra-Thin Vapor Chambers Cooled by Natural Convection in another window
Topics: Natural convection, Performance characterization, Vapors, Heat, Flat heat pipes, Computer simulation, Condensers (steam plant), Energy dissipation, Heat losses, Temperature distribution
Proceedings Papers

Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures

Xi Wang, Ali Shakouri
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 293-296, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89084
https://doi.org/10.1115/InterPACK2009-89084
View Paper titled, Thermal Characterization of a Single MOSFET Transistor at Cryogenic Temperatures
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Topics: MOSFET transistors, Temperature, Thermal characterization, Temperature distribution, Gates (Closures), Design, Electrons, Flow (Dynamics), Heat, Phonons
Proceedings Papers

Natural Convection From Finned Heat Sinks

L. T. Yeh, Joseph Yeh, B. T. F. Chung
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 541-546, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33036
https://doi.org/10.1115/IPACK2007-33036
View Paper titled, Natural Convection From Finned Heat Sinks
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Topics: Heat sinks, Natural convection, Computational fluid dynamics, Dimensions, Fins, Heat transfer, Heat losses, Radiation (Physics), Temperature
Proceedings Papers

Theta_JC Metrology Development: Fixture Design Modeling

Michael Butch M. Dizon, Suzana Prstic, Sung-Won Moon
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 569-576, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73405
https://doi.org/10.1115/IPACK2005-73405
View Paper titled, Theta_JC Metrology Development: Fixture Design Modeling
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Topics: Design, Metrology, Modeling, Errors, Computational fluid dynamics, Heat losses, Insulation, Junctions, Temperature, Cavities
Proceedings Papers

Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics

Nitesh D. Nimkar, Sushil H. Bhavnani, Richard C. Jaeger
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 575-585, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35267
https://doi.org/10.1115/IPACK2003-35267
View Paper titled, Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics
Open the PDF for Benchmark Heat Transfer Data for Micro-Structured Surfaces for Immersion Cooled Microelectronics in another window
Topics: Bubbles, Cavities, Cooling, Critical heat flux, Electronics, Emissions, Fluids, Glass, Heat flux, Heat losses