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Proceedings Papers

Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs

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Natsumi Kimura, Takashi Fukue, Haruki Yoshihiro, Koichi Hirasawa
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139742
https://doi.org/10.1115/IPACK2024-139742
View Paper titled, Fundamental Study on Practical Measurement Method of Anisotropic Thermal Conduction Performance Using Zig-Zag Jigs
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Topics: Anisotropy, Heat conduction, Jigs and fixtures, Steady state, Thermal conductivity
Proceedings Papers

Variable Area Jet Impingement for High Voltage Power Electronics

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Reece Whitt, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
https://doi.org/10.1115/IPACK2023-111996
View Paper titled, Variable Area Jet Impingement for High Voltage Power Electronics
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Topics: Electronics, Nozzles, Convection, Coolants, Cooling, Flow (Dynamics), Impingement cooling, Reliability, Temperature, Transients (Dynamics)
Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

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Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98066
https://doi.org/10.1115/IPACK2022-98066
View Paper titled, Topology Optimization of Heat Sink for 3d Integrated Power Converters
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

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Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2605
https://doi.org/10.1115/IPACK2020-2605
View Paper titled, Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

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Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

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Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8383
https://doi.org/10.1115/IPACK2018-8383
View Paper titled, Orientation Effects in Two-Phase Microgap Flow
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

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Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8212
https://doi.org/10.1115/IPACK2018-8212
View Paper titled, Effect of Interfacial Thermal Conductance Between the Nanoparticles
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Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

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Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8322
https://doi.org/10.1115/IPACK2018-8322
View Paper titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

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Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8456
https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

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Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74196
https://doi.org/10.1115/IPACK2017-74196
View Paper titled, Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

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D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74224
https://doi.org/10.1115/IPACK2017-74224
View Paper titled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips
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Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

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Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

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Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74306
https://doi.org/10.1115/IPACK2017-74306
View Paper titled, Challenges in 3D Printing of High Conductivity Copper
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

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Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74080
https://doi.org/10.1115/IPACK2017-74080
View Paper titled, State of the Art of Electronics Cooling for Radar Antenna Applications
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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

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Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48027
https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs

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Timothy J. Longson, James Maddocks, Ali Kashani
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A078, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48735
https://doi.org/10.1115/IPACK2015-48735
View Paper titled, Morphological Impact on Thermal Interface Resistance of Self Catalyzing Fecralloy MWNT TIMs
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Topics: Multi-walled nanotubes, Contact resistance, Temperature, Heat conduction, Modeling, Carbon, Catalysts, Deformation, Density, Multi-walled carbon nanotubes
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

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Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48670
https://doi.org/10.1115/IPACK2015-48670
View Paper titled, Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

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W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48522
https://doi.org/10.1115/IPACK2015-48522
View Paper titled, Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

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Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48592
https://doi.org/10.1115/IPACK2015-48592
View Paper titled, Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

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Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48770
https://doi.org/10.1115/IPACK2015-48770
View Paper titled, Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources
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Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design