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Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Paper No: IPACK2018-8337
Proceedings Papers

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 27–30, 2018
Paper No: IPACK2018-8386
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017
Paper No: IPACK2017-74016
Proceedings Papers

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Paper No: IPACK2017-74080
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A011, July 6–9, 2015
Paper No: IPACK2015-48180
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Paper No: IPACK2015-48568
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Paper No: IPACK2015-48154
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A014, July 6–9, 2015
Paper No: IPACK2015-48689
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Paper No: IPACK2011-52207
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 479-488, July 6–8, 2011
Paper No: IPACK2011-52090
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 629-635, July 6–8, 2011
Paper No: IPACK2011-52211
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 875-880, July 19–23, 2009
Paper No: InterPACK2009-89224
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 977-988, July 19–23, 2009
Paper No: InterPACK2009-89383
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 459-467, July 8–12, 2007
Paper No: IPACK2007-33067
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 751-755, July 8–12, 2007
Paper No: IPACK2007-33338
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 851-857, July 8–12, 2007
Paper No: IPACK2007-33700
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 611-616, July 17–22, 2005
Paper No: IPACK2005-73422
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 803-817, July 17–22, 2005
Paper No: IPACK2005-73015
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1499-1503, July 17–22, 2005
Paper No: IPACK2005-73291
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1593-1599, July 17–22, 2005
Paper No: IPACK2005-73302