1-17 of 17
Graphics processing units
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs

Akshith Narayanan, Qingyang Wang, Serdar Ozguc, Richard W. Bonner, III
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141261
https://doi.org/10.1115/IPACK2024-141261
View Paper titled, Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs
Open the PDF for Investigation of Server Level Direct-To-Chip Two Phase Cooling Solution for High Power GPUs in another window
Topics: Cooling, Graphics processing units, Vehicles
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
Open the PDF for Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates in another window
Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97434
https://doi.org/10.1115/IPACK2022-97434
View Paper titled, A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads
Open the PDF for A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads in another window
Topics: Coolants, Cooling, Data centers, Fluctuations (Physics), Heat, Plates (structures), Stress, Temperature, Failure, Flow control
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
Open the PDF for Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers in another window
Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
Open the PDF for Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server in another window
Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing

Alec Nordlund, Rachel McAfee, Rebecca Ledsham, Joshua Gess
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74108
https://doi.org/10.1115/IPACK2021-74108
View Paper titled, Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing
Open the PDF for Cooling of High Powered GPUs Using Liquid Nitrogen Cold Plates Made With Additive Manufacturing in another window
Topics: Additive manufacturing, Cooling, Graphics processing units, Nitrogen, Plates (structures)
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69723
https://doi.org/10.1115/IPACK2021-69723
View Paper titled, Design and Application of Innovative 3DVC in AI Server System
Open the PDF for Design and Application of Innovative 3DVC in AI Server System in another window
Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants

Shuai Shao, Tianyi Gao, Huawei Yang, Jie Zhao, Jiajun Zhang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2670
https://doi.org/10.1115/IPACK2020-2670
View Paper titled, Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants
Open the PDF for Evaluation of Single Phase Immersion Cooling System for High Performance Server Chassis Using Dielectric Coolants in another window
Topics: Coolants, Cooling, Cooling systems, Fluids, Graphics processing units, Power density, Data centers, Temperature, Decision making, Density
Proceedings Papers

Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922

Anil Yuksel, Vic Mahaney, Chris Marroquin, Shurong Tian, Mark Hoffmeyer, Mark Schultz, Todd Takken
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6444
https://doi.org/10.1115/IPACK2019-6444
View Paper titled, Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922
Open the PDF for Thermal and Mechanical Design of the Fastest Supercomputer of the World in Cognitive Systems: IBM POWER AC 922 in another window
Topics: Cooling, Design, Design engineering, Thermal management, Water, Graphics processing units, Electronic components, Flow (Dynamics), Artificial intelligence, Data centers
Proceedings Papers

Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package

Pavan Rajmane, Fahad Mirza, Hassaan Khan, Dereje Agonafer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48811
https://doi.org/10.1115/IPACK2015-48811
View Paper titled, Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package
Open the PDF for Chip Package Interaction Study to Analyze the Mechanical Integrity of a 3-D TSV Package in another window
Topics: Circuits, Damage, Electronics, Energy dissipation, Gates (Closures), Graphics processing units, Heating, Joules, Manufacturing, Modeling
Proceedings Papers

Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs

Ridvan A. Sahan, Rahima K. Mohammed, Amy Xia, Ying-Feng Pang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 311-318, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52225
https://doi.org/10.1115/IPACK2011-52225
View Paper titled, Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs
Open the PDF for Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs in another window
Topics: Cooling, Graphics processing units, Diamonds, Fins, Water, Design, Flow (Dynamics), Coolers, Electrolytic corrosion, Metals
Proceedings Papers

An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator

Z. R. Lin, Z. Y. Lee, L. W. Zhang, S. F. Wang, A. A. Merrikh, G. Refai-Ahmed
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 19-27, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52017
https://doi.org/10.1115/IPACK2011-52017
View Paper titled, An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator
Open the PDF for An Experimental Study of Heat Transfer Characteristics in Miniature Loop Heat Pipes With Rectangular Shaped Evaporator in another window
Topics: Cooling, Graphics processing units, Heat pipes, Heat transfer
Proceedings Papers

Robust Thermal Management for Embedded CPU and GPUs in Displays

Sung Ki Kim, Woo Young Kan, Sang Hak Kim, Vincent Tan, Gamal Refai-Ahmed, Ali Akbar Merrikh
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 7-11, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52014
https://doi.org/10.1115/IPACK2011-52014
View Paper titled, Robust Thermal Management for Embedded CPU and GPUs in Displays
Open the PDF for Robust Thermal Management for Embedded CPU and GPUs in Displays in another window
Topics: Graphics processing units, Thermal management, Design, Reliability, Brightness (Photometry), Circuits, Corners (Structural elements), Energy dissipation, Heat, Manufacturing
Proceedings Papers

Closed Loop Liquid Cooling for High Performance Computer Systems

Sukhvinder Kang, David Miller, John Cennamo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 509-515, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33870
https://doi.org/10.1115/IPACK2007-33870
View Paper titled, Closed Loop Liquid Cooling for High Performance Computer Systems
Open the PDF for Closed Loop Liquid Cooling for High Performance Computer Systems in another window
Topics: Computers, Cooling, Heat, Cooling systems, Copper, Fluids, Graphics processing units, Stress, Temperature, Coolants
Proceedings Papers

Future of Thermal Management of High End Video Cards in ATX and BTX

Gamal Refai-Ahmed, Mohammed Tantoush, Colin Novak
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 287-290, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73219
https://doi.org/10.1115/IPACK2005-73219
View Paper titled, Future of Thermal Management of High End Video Cards in ATX and BTX
Open the PDF for Future of Thermal Management of High End Video Cards in ATX and BTX in another window
Topics: Thermal management, Graphics processing units, Cooling, Power density, Roads, Thermomechanics
Proceedings Papers

Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise

Colin Novak, Helen Ule, Robert Gaspar, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 373-378, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73264
https://doi.org/10.1115/IPACK2005-73264
View Paper titled, Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise
Open the PDF for Use of Psychoacoustic Metrics for the Analysis of Next Generation Computer Graphic Card Noise in another window
Topics: Computers, Noise (Sound), Cooling, Graphics processing units, Sound quality, Energy dissipation, Acoustics, Fans, Heat, Heat flux
Proceedings Papers

Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics

Helen Ule, Colin Novak, Robert Gaspar, Arunima Panigrahy, Gamal Refai-Ahmed
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 239-243, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73180
https://doi.org/10.1115/IPACK2005-73180
View Paper titled, Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics
Open the PDF for Effect of Next Generation Computer Graphic Card Blower Fan Speed on Thermal Performance and Acoustic Noise With Psychoacoustic Metrics in another window
Topics: Acoustics, Computers, Noise (Sound), Fans, Cooling, Flow (Dynamics), Graphics processing units, Air flow, Axial flow, Design