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Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69254
https://doi.org/10.1115/IPACK2021-69254
View Paper titled, Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material
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Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6422
https://doi.org/10.1115/IPACK2019-6422
View Paper titled, Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems
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Topics: Electrical properties, Electronic packages, Electronics, Graphene, Heat, Iron, Latent heat, Nanocomposites, Particulate matter, Phase change materials
Proceedings Papers

MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore

Takumu Kitani, Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48298
https://doi.org/10.1115/IPACK2015-48298
View Paper titled, MD Evaluation of the IR Spectra of DNA Bases in the Process of Transport Through Graphene Nanopore
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Topics: DNA, Graphene, Infrared spectra, Nanopores, Atoms, Spectra (Spectroscopy), Resolution (Optics), Spectroscopy, Density, Fingerprints
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48239
https://doi.org/10.1115/IPACK2015-48239
View Paper titled, Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48297
https://doi.org/10.1115/IPACK2015-48297
View Paper titled, Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating
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Topics: Graphene, Heating, Phonons, Thermal conductivity, Transients (Dynamics), Equilibrium (Physics), High temperature, Density, Dispersion relations, Dynamics (Mechanics)
Proceedings Papers

Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method

David B. Brown, Thomas L. Bougher, Baratunde A. Cola, Satish Kumar
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48444
https://doi.org/10.1115/IPACK2015-48444
View Paper titled, Thermal Boundary Conductance at Metal-Graphene-Metal Interfaces Using Time-Domain Thermoreflectance Method
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Topics: Electrical conductance, Graphene, Metals, Thermoreflectance, Chemical vapor deposition, Copper foil
Proceedings Papers

Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices

Richard C. Ordonez, Noah Acosta, Jordan Melcher, Nackieb Kamin, David Garmire
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48567
https://doi.org/10.1115/IPACK2015-48567
View Paper titled, Investigation of Liquid Metal Ohmic Contacts for Graphene Photonic Devices
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Topics: Graphene, Liquid metals, Ohmic contacts, Photonic equipment, Contact resistance, Carbon, Engineering standards, Overlays (Materials engineering), Oxidation, Pressure
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52243
https://doi.org/10.1115/IPACK2011-52243
View Paper titled, Spectral Detail of Phonon Conduction and Scattering in Graphene
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field

Masato Ohnishi, Yusuke Suzuki, Yusuke Ohashi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 457-462, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52057
https://doi.org/10.1115/IPACK2011-52057
View Paper titled, Change of the Electronic Conductivity of Carbon Nanotube and Graphene Sheets Caused by a Three-Dimensional Strain Field
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Topics: Carbon nanotubes, Electrical conductivity, Graphene, Thermal conductivity, Buckling, Cylinders, Deformation, Shapes, Density functional theory, Electrical resistivity
Proceedings Papers

Thermal Conductivity Reduction in Few-Layer Graphene

Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 769-778, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52245
https://doi.org/10.1115/IPACK2011-52245
View Paper titled, Thermal Conductivity Reduction in Few-Layer Graphene
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Topics: Graphene, Thermal conductivity, Phonons, Acoustics, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Accounting, Graphite, Harmonics (Music)
Proceedings Papers

Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages

Erkan Oterkus, Abigail Agwai, Ibrahim Guven, Erdogan Madenci
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 63-68, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89107
https://doi.org/10.1115/InterPACK2009-89107
View Paper titled, Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages
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Topics: Electronic packages, Failure mechanisms, Simulation, Crack propagation, Graphene, Thin films, Molecular dynamics, Nanoindentation, Simulation results