1-7 of 7
Glass transition
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Paper No: IPACK2021-74061
DOI: https://doi.org/10.1115/IPACK2021-74061
View Paper
PDF
Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties
Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Paper No: IPACK2020-2675
DOI: https://doi.org/10.1115/IPACK2020-2675
View Paper
PDF
Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Paper No: IPACK2018-8338
DOI: https://doi.org/10.1115/IPACK2018-8338
View Paper
PDF
Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Paper No: IPACK2015-48010
DOI: https://doi.org/10.1115/IPACK2015-48010
View Paper
PDF
Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

Jae B. Kwak, Da Yu, Tung T. Nguyen, Seungbae Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Paper No: IPACK2011-52233
DOI: https://doi.org/10.1115/IPACK2011-52233
View Paper
PDF
Topics: Flip-chip packages, Reliability, Solder joints, Solders, Finite element analysis, Corners (Structural elements), Stress, Thermomechanics, Chemical etching, Damage
Proceedings Papers

Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications

M. Sandor, S. Agarwal, D. Peters, M. S. Cooper
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 809-815, July 6–11, 2003
Paper No: IPACK2003-35177
DOI: https://doi.org/10.1115/IPACK2003-35177
View Paper
PDF
Topics: Glass transition, Reliability, Molding, Proton exchange membranes, Temperature, Chemistry, Epoxy adhesives, Epoxy resins, Flame retardants, Manufacturing
Proceedings Papers

BGA Reliability in Automotive Underhood Applications

Pradeep Lall, Nokibul Islam, Jeffrey Suhling, Robert Darveaux
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003
Paper No: IPACK2003-35243
DOI: https://doi.org/10.1115/IPACK2003-35243
View Paper
PDF
Topics: Ball-Grid-Array packaging, Reliability, Crack propagation, Damage, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition