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Proceedings Papers
Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74061
Proceedings Papers
Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2675
Proceedings Papers
Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
Proceedings Papers
MEMS Die Warpage During Curing of Die Attach Material
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48010
Proceedings Papers
Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52233
Proceedings Papers
Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 809-815, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35177
Proceedings Papers
BGA Reliability in Automotive Underhood Applications
Available to Purchase
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35243