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Proceedings Papers

Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Jeff Suhling, Edward Davis
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74061
https://doi.org/10.1115/IPACK2021-74061
View Paper titled, Property Evolution and Reliability of Underfills Under Sustained High Temperature Storage
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Topics: High temperature, Relaxation (Physics), Reliability, Storage, Temperature, Viscoelasticity, Electronics, Glass transition, Materials properties, Mechanical properties
Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2675
https://doi.org/10.1115/IPACK2020-2675
View Paper titled, Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation
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Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

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Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

MEMS Die Warpage During Curing of Die Attach Material

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Hohyung Lee, Ruiyang Liu, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48010
https://doi.org/10.1115/IPACK2015-48010
View Paper titled, MEMS Die Warpage During Curing of Die Attach Material
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Topics: Hardening (Curing), Microelectromechanical systems, Warping, Materials properties, Finite element analysis, Manufacturing, Shrinkage (Materials), Stress, Adhesives, Glass transition
Proceedings Papers

Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)

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Jae B. Kwak, Da Yu, Tung T. Nguyen, Seungbae Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52233
https://doi.org/10.1115/IPACK2011-52233
View Paper titled, Solder Joint Reliability in Underfilled Flip Chip Package With a Consideration of Chip-Package-Interaction (CPI)
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Topics: Flip-chip packages, Reliability, Solder joints, Solders, Finite element analysis, Corners (Structural elements), Stress, Thermomechanics, Chemical etching, Damage
Proceedings Papers

Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications

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M. Sandor, S. Agarwal, D. Peters, M. S. Cooper
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 809-815, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35177
https://doi.org/10.1115/IPACK2003-35177
View Paper titled, Reliability of Low Glass Transition Temperature COTS PEM’s for Space Applications
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Topics: Glass transition, Reliability, Molding, Proton exchange membranes, Temperature, Chemistry, Epoxy adhesives, Epoxy resins, Flame retardants, Manufacturing
Proceedings Papers

BGA Reliability in Automotive Underhood Applications

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Pradeep Lall, Nokibul Islam, Jeffrey Suhling, Robert Darveaux
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 823-830, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35243
https://doi.org/10.1115/IPACK2003-35243
View Paper titled, BGA Reliability in Automotive Underhood Applications
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Topics: Ball-Grid-Array packaging, Reliability, Crack propagation, Damage, High temperature, Surface mount devices, Temperature, Errors, Fatigue, Glass transition