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Proceedings Papers

Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework

Pradeep Lall, Padmanava Choudhury, Aathi Raja Ram Pandurangan
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112014
https://doi.org/10.1115/IPACK2023-112014
View Paper titled, Assessment of Propensity for Pad Cratering at the Board Resin-Glass Interface Under Assembly and Rework
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Topics: Elastic moduli, Glass, Manufacturing, Resins, Stress, Tensile strength
Proceedings Papers

Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application

Chu-Pao (Otis) Hung, Yu-Po Wang, Steven Chen, Katch Wan
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2528
https://doi.org/10.1115/IPACK2020-2528
View Paper titled, Fan-Out MCM Solutions Study for Heterogeneous Integration on Intelligent Computing Application
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Topics: Computers, Design, Diluents, Glass, Internet, Manufacturing, Packaging, Semiconductor wafers, Semiconductors (Materials), Smart appliances
Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application

Lanbing Liu, David Nam, Ben Guo, Rolando Burgos, Guo-quan Lu
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6393
https://doi.org/10.1115/IPACK2019-6393
View Paper titled, Evaluation of a Lead Glass for Encapsulating High-Temperature Power Modules for Aerospace Application
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Topics: Aerospace industry, Glass, High temperature, Packaging, Stress
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
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Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8225
https://doi.org/10.1115/IPACK2018-8225
View Paper titled, All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes
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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering
Proceedings Papers

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74098
https://doi.org/10.1115/IPACK2017-74098
View Paper titled, Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
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Topics: Manufacturing, Materials properties, Warping, Copper, Design, Finite element analysis, Simulation, Young's modulus, Errors, Flip-chip
Proceedings Papers

Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver

Ruth H. Reed, Justin Raade, Benjamin Elkin, Van P. Carey
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48532
https://doi.org/10.1115/IPACK2015-48532
View Paper titled, Modeling of Flow and Heat Transfer in a Molten Glass Mini-Film for High Temperature Heat Collection in a Falling-Film Solar Central Receiver
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Topics: Flow (Dynamics), Glass, Heat, Heat transfer, High temperature, Modeling, Solar energy, Temperature, Viscosity, Fluids
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Thermal Performance Enhancement of Glass Interposer

Sangbeom Cho, Yogendra K. Joshi
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48563
https://doi.org/10.1115/IPACK2015-48563
View Paper titled, Thermal Performance Enhancement of Glass Interposer
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Topics: Glass, Electronics, Packaging, Brittleness, Computer simulation, Cooling, Copper, Design, Electrical resistivity, Modeling
Proceedings Papers

Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics

Liang Xue, Claire R. Coble, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73291
https://doi.org/10.1115/IPACK2013-73291
View Paper titled, Dynamic Analysis of Thin Glass Under Ball Drop Impact With New Metrics
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Topics: Dynamic analysis, Finite element analysis, Glass, Impact testing, Momentum
Proceedings Papers

An Experimental and Numerical Study of the Dynamic Fracture of Glass

Liang Xue, Yuling Niu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73292
https://doi.org/10.1115/IPACK2013-73292
View Paper titled, An Experimental and Numerical Study of the Dynamic Fracture of Glass
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Topics: Finite element analysis, Fracture (Materials), Fracture (Process), Glass
Proceedings Papers

An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact

Liang Xue, Dapeng Liu, Hohyung Lee, Da Yu, Satish Chaparala, Seungbae Park
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73293
https://doi.org/10.1115/IPACK2013-73293
View Paper titled, An Experimental and Numerical Study of the Behavior of the Thin Glass Edge Under Ball Drop Impact
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Topics: Glass
Proceedings Papers

Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration

Gi Hwan Kwon, Sung Jin Kim
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73056
https://doi.org/10.1115/IPACK2013-73056
View Paper titled, Study on the Flow and Heat Transfer Characteristics of Pulsating Heat Pipe With Asymmetric Configuration
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Topics: Flow (Dynamics), Heat pipes, Heat transfer, Fluids, Heat, Oscillations, Condensation, Evaporation, Glass, Visualization
Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52168
https://doi.org/10.1115/IPACK2011-52168
View Paper titled, Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias
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Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins
Proceedings Papers

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 517-520, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89058
https://doi.org/10.1115/InterPACK2009-89058
View Paper titled, Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films
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Topics: Chain, Electric fields, Electrodes, Film thickness, Glass, Irradiation (Radiation exposure), Microscopy, Polymer films, Resonance, Silicon
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
https://doi.org/10.1115/InterPACK2009-89034
View Paper titled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Hygro-Mechanical Analysis of LCD Panels

Toru Ikeda, Tomonori Mizutani, Noriyuki Miyazaki
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 815-824, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89267
https://doi.org/10.1115/InterPACK2009-89267
View Paper titled, Hygro-Mechanical Analysis of LCD Panels
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Topics: Adhesives, Boundary layers, Deformation, Diffusion (Physics), Finite element methods, Gas laws (Thermodynamics), Glass, Liquid crystals, Manufacturing, Plates (structures)
Proceedings Papers

Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics

Pedro O. Quintero-Aguilo´, Pablo Ca´ceres-Valencia, Ricky Valenti´n, Alfredo Di´az
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 347-352, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89029
https://doi.org/10.1115/InterPACK2009-89029
View Paper titled, Combinatorial Studies for the Minimization of Tin Whiskers Growth in Lead Free Electronics
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Topics: Electronics, Glass, Compressive stress, Diffusion (Physics), Heat treating (Metalworking), Intermetallic compounds, Manufacturing, Materials science, Nickel, Scanning electron microscopy
Proceedings Papers

An Experimental Study of Onset Condition for Electrohydrodynamic Jetting

Hyojun Kim, Junyoung Song, Jaeik Jeong, Jaewon Chung
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 183-186, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89387
https://doi.org/10.1115/InterPACK2009-89387
View Paper titled, An Experimental Study of Onset Condition for Electrohydrodynamic Jetting
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Topics: Electrohydrodynamics, Nozzles, Pressure, Printing, Reservoirs, Drops, Electric fields, Electrodes, Flow (Dynamics), Fluids