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Proceedings Papers
Microvia Geometry Assessment at High-Stress Substrate Locations in Printed Circuit Boards Under Thermomechanical Stresses
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-139572
Proceedings Papers
Quick Turn Methodology for High Temperature Solder Fatigue Reliability
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
Proceedings Papers
Variable Area Jet Impingement for High Voltage Power Electronics
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111996
Proceedings Papers
Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
Available to PurchaseKrishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
Proceedings Papers
Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
Proceedings Papers
Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
Available to PurchaseAlfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
Proceedings Papers
Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
Available to PurchaseGilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
Proceedings Papers
Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97446
Proceedings Papers
Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
Proceedings Papers
Confined Transducer Geometries to Enhance Sensitivity to Thermal Boundary Conductance in Frequency-Domain Thermoreflectance Measurements
Available to PurchaseRonald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Andy Clark, Xuemei Cheng, Lu An, Ezra Lee, Xiaosong Liu, Gang Feng
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-66842
Proceedings Papers
Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
Available to Purchase
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
Proceedings Papers
Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8211
Proceedings Papers
Numerical Investigation of Shape Effect on Microdroplet Evaporation
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8311
Proceedings Papers
Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage
Available to Purchase
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8357
Proceedings Papers
Impact of Tile Design on Thermal Performance of Open and Enclosed Aisles
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74339
Proceedings Papers
Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
Proceedings Papers
Geometry Effects on Two-Phase Flow Regimes in a Diabatic Manifolded Microgap Channel
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A025, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74287
Proceedings Papers
Color Uniformity Enhancement of White Light-Emitting Diodes With Novel Bell Shape Phosphor Layer
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74195
Proceedings Papers
Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74264
Proceedings Papers
Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy
Available to Purchase
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74201
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