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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Paper No: IPACK2021-74074
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Paper No: IPACK2021-74570
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Paper No: IPACK2015-48239
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Paper No: IPACK2015-48627
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Paper No: IPACK2013-73053
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Paper No: IPACK2013-73156
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Paper No: IPACK2013-73225
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 285-292, July 6–8, 2011
Paper No: IPACK2011-52188
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Paper No: IPACK2011-52063
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Paper No: InterPACK2009-89241
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Paper No: InterPACK2009-89398
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Paper No: IPACK2005-73352
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1129-1134, July 17–22, 2005
Paper No: IPACK2005-73110
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005
Paper No: IPACK2005-73112