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Proceedings Papers
Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength
Available to Purchase
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111951
Proceedings Papers
Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Available to Purchase
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
Proceedings Papers
Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
Proceedings Papers
Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
Available to Purchase
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
Proceedings Papers
Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
Available to Purchase
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48627
Proceedings Papers
Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48239
Proceedings Papers
Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73053
Proceedings Papers
Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73156
Proceedings Papers
Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators
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Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73225
Proceedings Papers
Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 285-292, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52188
Proceedings Papers
Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52063
Proceedings Papers
Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
Proceedings Papers
Joint Development of a Package-Level Thermal Interface Material Test System
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Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89398
Proceedings Papers
Determination of the Anand Viscoplasticity Model Constants for SnAgCu
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73352
Proceedings Papers
Experimental and Numerical Evaluation of Residual Stress in IC Chips
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1129-1134, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73110
Proceedings Papers
Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip
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Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73112