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Proceedings Papers

Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength

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Bryan Tunon, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111951
https://doi.org/10.1115/IPACK2023-111951
View Paper titled, Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength
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Topics: Coolants, Flow (Dynamics), Human failure events, Fluids, Electrodes, Needles, Cooling, Pressure, Electronics, Gages
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

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Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads

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Pradeep Lall, Tony Thomas, Jinesh Narangaparambil
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74074
https://doi.org/10.1115/IPACK2021-74074
View Paper titled, Performance Characteristics of Additively Printed Strain Gauges Under Different Conditions of Temperature and High Stress Loads
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Topics: Performance characterization, Strain gages, Stress, Temperature, Inks, Printing, Sensors, Printed circuit boards, Silver, Vibration
Proceedings Papers

Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions

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Pradeep Lall, Jinesh Narangaparambil, Tony Thomas, Kyle Schulze
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74570
https://doi.org/10.1115/IPACK2021-74570
View Paper titled, Repeatability and Extended Time Stability Study of an Additively Printed Strain Gauge Under Different Load Conditions
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Topics: Failure, Gages, Inks, Printing, Shear (Mechanics), Stability, Strain gages, Stress
Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

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Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48627
https://doi.org/10.1115/IPACK2015-48627
View Paper titled, Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
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Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis
Proceedings Papers

Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons

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Meng Yang, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48239
https://doi.org/10.1115/IPACK2015-48239
View Paper titled, Effect of Three Dimensional Strain on the Electronic Properties of Graphene Nanoribbons
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Topics: Graphene, Strain sensors, Chemical vapor deposition, Copper foil, Deformation, Energy gap, Reactive-ion etching, Tensile deformation, Density functional theory, Electron configuration
Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

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Michael James Martin, Harish Manohara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73053
https://doi.org/10.1115/IPACK2013-73053
View Paper titled, Thermo-Electric Modeling of Nanotube-Based Environmental Sensors
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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity
Proceedings Papers

Highly Sensitive 2D Strain Sensor Using Carbon Nanotube

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Hiroshi Kawakami, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73156
https://doi.org/10.1115/IPACK2013-73156
View Paper titled, Highly Sensitive 2D Strain Sensor Using Carbon Nanotube
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Topics: Carbon nanotubes, Strain sensors, Multi-walled carbon nanotubes, Electrical conductivity, Shapes, Chemical vapor deposition, Electrical resistance, Single-walled carbon nanotubes, Catalysts, Design
Proceedings Papers

Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators

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Siyi Zhou, Bahgat G. Sammakia, Bruce White, Peter Borgesen, Cheng Chen
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73225
https://doi.org/10.1115/IPACK2013-73225
View Paper titled, Enhancement of the Power-Conversion Efficiency for Thermoelectric Generators
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Topics: Energy conversion, Generators, Water, Flow (Dynamics), Heat exchangers, Energy budget (Physics), Energy generation, Finite element analysis, Gages, Heat
Proceedings Papers

Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance

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Cong Yue, Jun Lu, Xiaotian Zhang, Yueh-Se Ho
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 285-292, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52188
https://doi.org/10.1115/IPACK2011-52188
View Paper titled, Experimental and Simulation Study of the Effect of Power Package Configuration on its Thermal Performance
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Topics: Simulation, Wire, Thermal resistance, Finite element model, Gages, Junctions, Natural convection, Power semiconductor devices, Testing, Transistors
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

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Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52063
https://doi.org/10.1115/IPACK2011-52063
View Paper titled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
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Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

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G. Srinivasan, R. Murcko, K. Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
https://doi.org/10.1115/InterPACK2009-89241
View Paper titled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
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Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability
Proceedings Papers

Joint Development of a Package-Level Thermal Interface Material Test System

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Yanshu Susan Chen, Stanley Pecavar, Vadim Gektin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 615-618, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89398
https://doi.org/10.1115/InterPACK2009-89398
View Paper titled, Joint Development of a Package-Level Thermal Interface Material Test System
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Topics: ASTM International, Design, Gages, Heat, Junctions, Materials properties, Microelectromechanical systems, Microelectronic devices, Pressure, Stress
Proceedings Papers

Determination of the Anand Viscoplasticity Model Constants for SnAgCu

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Bryan Rodgers, Ben Flood, Jeff Punch, Finbarr Waldron
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1263-1270, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73352
https://doi.org/10.1115/IPACK2005-73352
View Paper titled, Determination of the Anand Viscoplasticity Model Constants for SnAgCu
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Topics: Alloys, ASTM International, Ball-Grid-Array packaging, Bone, Computer software, Constitutive equations, Displacement, Fatigue life, Finite element model, Fittings
Proceedings Papers

Experimental and Numerical Evaluation of Residual Stress in IC Chips

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Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1129-1134, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73110
https://doi.org/10.1115/IPACK2005-73110
View Paper titled, Experimental and Numerical Evaluation of Residual Stress in IC Chips
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Topics: Stress, Electronic packages, Finite element methods, Resins, Semiconductors (Materials), Temperature, Elastic analysis, Failure, Gages, Numerical analysis
Proceedings Papers

Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip

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Nobuki Ueta, Hideo Miura
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1135-1140, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73112
https://doi.org/10.1115/IPACK2005-73112
View Paper titled, Measurement of Local Residual Stress of a Flip Chip Structure Using a Stress Sensing Chip
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Topics: Flip-chip, Flip-chip devices, Stress, Sensors, Silicon chips, Strain gages, Finite element analysis, Gages, Polysilicon, Semiconductor wafers