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Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A028, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142108
https://doi.org/10.1115/IPACK2024-142108
View Paper titled, Sequential High-Temperature Aging and High Humidity Exposure of Chip/Underfill Interfaces to Investigate the Evolution of Interfacial Stress Intensity Factor in FCBGA Stress Intensity
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Topics: Delamination, Fracture (Materials), Fracture toughness, High temperature, Stress
Proceedings Papers

Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure

Pradeep Lall, Aathi Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A029, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-142109
https://doi.org/10.1115/IPACK2024-142109
View Paper titled, Investigation of Interfacial Reliability and Comparison Non-PFAS Underfills in FCBGAs Under Humidity and High-Temperature Exposure
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Topics: Delamination, Fracture toughness, High temperature, Reliability, Failure mechanisms, Semiconductors (Materials), Automobiles, Ball-Grid-Array packaging, Durability, Electronics
Proceedings Papers

Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model

Pradeep Lall, Aathi Raja Ram Pandurangan, Madhu Katsuri
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
https://doi.org/10.1115/IPACK2023-111937
View Paper titled, Prediction of Failure at FCBGA Interfaces Under Thermo-Mechanical Loads Using a Competing Risk Cohesive Zone Model
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Topics: Architecture, Automobiles, Ball-Grid-Array packaging, Delamination, Electronics, Engines, Failure, Failure mechanisms, Fatigue, Finite element model
Proceedings Papers

Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows

Pradeep Lall, Aathi Raja Ram Pandurangan, Padmanava Choudhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111925
https://doi.org/10.1115/IPACK2023-111925
View Paper titled, Prediction of Pad Cratering Performance at Copper-Resin Interfaces With Multiple Reflows
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Topics: Copper, Fracture (Materials), Fracture (Process), Resins
Proceedings Papers

Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling

Pradeep Lall, Madhu Kasturi
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111977
https://doi.org/10.1115/IPACK2023-111977
View Paper titled, Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling
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Topics: Copper, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading

Pradeep Lall, Madhu Kasturi
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111976
https://doi.org/10.1115/IPACK2023-111976
View Paper titled, Effect of Thermal Cycling on Interfacial Fracture Toughness of Electronic Mold Compound-to-Substrate Interface Subjected to Monotonic and Fatigue Loading
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Topics: Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
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Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
https://doi.org/10.1115/IPACK2022-97440
View Paper titled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
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Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97382
https://doi.org/10.1115/IPACK2022-97382
View Paper titled, Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level
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Topics: Durability, Failure, Domes (Structural elements), Cantilever beams, Disks, Silver, Additive manufacturing, Bending (Stress), Clamps (Tools), Damage
Proceedings Papers

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Pradeep Lall, Padmanava Choudhury, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97448
https://doi.org/10.1115/IPACK2022-97448
View Paper titled, Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading
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Topics: Bending (Stress), Cycles, Failure, Fatigue, Fracture (Materials), Fracture (Process), Stress
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
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Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2598
https://doi.org/10.1115/IPACK2020-2598
View Paper titled, Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
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Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6507
https://doi.org/10.1115/IPACK2019-6507
View Paper titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6572
https://doi.org/10.1115/IPACK2019-6572
View Paper titled, Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
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Topics: Bending (Stress), Delamination, Electronics, Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
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Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8257
https://doi.org/10.1115/IPACK2018-8257
View Paper titled, Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP
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Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics