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Proceedings Papers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

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Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
https://doi.org/10.1115/IPACK2024-140105
View Paper titled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
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Topics: Copper, Forced convection, Water, Compression, Flow (Dynamics), Metal foams, Cooling, Heat, Computer cooling, Coolants
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

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Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
Open the PDF for Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers in another window
Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

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Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48535
https://doi.org/10.1115/IPACK2015-48535
View Paper titled, Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

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Mahmood R. S. Shirazy, Luc G. Fréchette
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73106
https://doi.org/10.1115/IPACK2013-73106
View Paper titled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
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Topics: Copper, Foams (Chemistry), Evaporation, Computer cooling, Containers, Ethanol, Flux (Metallurgy), Heat, Heat conduction, Heat pipes
Proceedings Papers

A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics

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Minhua Lu, Larry Mok, R. J. Bezama
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 233-238, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73170
https://doi.org/10.1115/IPACK2005-73170
View Paper titled, A Vapor Chamber Using Graphite Foams as Wicks for Cooling High Heat Flux Electronics
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Topics: Cooling, Electronics, Foams (Chemistry), Graphite, Heat flux, Vapors, Fluids, Water, Ethanol, Thermal conductivity
Proceedings Papers

Pool Boiling of Water and FC-72 on Copper and Graphite Foams

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Saeed Moghaddam, Michael Ohadi, Jianwei Qi
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 675-680, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35316
https://doi.org/10.1115/IPACK2003-35316
View Paper titled, Pool Boiling of Water and FC-72 on Copper and Graphite Foams
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Topics: Copper, Foams (Chemistry), Graphite, Pool boiling, Water, Boiling, Porosity, Heat, Heat transfer, Metals
Proceedings Papers

Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins

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John Klein, George Gilchrist, Jim Karanik, Noe Arcas, Richard Yurman, James Whiteside, Bill Shields, Tony Bartilucci
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 395-400, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35187
https://doi.org/10.1115/IPACK2003-35187
View Paper titled, Thermal Management of Airbourne Early Warning and Electronic Warfare Systems Using Foam Metal Fins
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Topics: Fins, Metals, Thermal management, Warfare, Heat exchangers, Heat transfer, Cooling, Heat transfer coefficients, Aircraft, Electronics