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Proceedings Papers

Passive Direct Liquid Cooling for High-Power Processors

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Alexei Tyryshkin, John Kim, Raffaele Luca Amalfi, Ryan Enright
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141022
https://doi.org/10.1115/IPACK2024-141022
View Paper titled, Passive Direct Liquid Cooling for High-Power Processors
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Topics: Cooling, Refrigerants, Cooling systems, Design, Computer cooling, Condensation, Density, Electronic equipment, Electronics, Energy dissipation
Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

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Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Thermal Performance of Low GWP Dielectric Fluid for Two-Phase Immersion Cooling

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Anil Yuksel, Gustavo Pottker, Abigail Van Wassen, Drew Brandt
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141608
https://doi.org/10.1115/IPACK2024-141608
View Paper titled, Thermal Performance of Low GWP Dielectric Fluid for Two-Phase Immersion Cooling
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Topics: Cooling, Fluids
Proceedings Papers

A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling

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Gustavo Pottker, Abigail Van Wassen, Drew R. Brandt
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111743
https://doi.org/10.1115/IPACK2023-111743
View Paper titled, A New Low-GWP Dielectric Fluid for Two-Phase Immersion Cooling
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Topics: Cooling, Data centers, Fluids
Proceedings Papers

Convection Cooling of Power Electronics Operating in Deep-Space

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Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111414
https://doi.org/10.1115/IPACK2023-111414
View Paper titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Convection, Cooling, Electronics, Forced convection, Thermal management, Rotors, Temperature, Electronic packaging, Fans, Flow (Dynamics)
Proceedings Papers

Optimization of a Air-Cooled Heatsink for Immersion Cooling Application

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Gautam Gupta, Vivek Nair, Sai Abhideep Pundla, Pratik Bansode, Rohit Suthar, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112054
https://doi.org/10.1115/IPACK2023-112054
View Paper titled, Optimization of a Air-Cooled Heatsink for Immersion Cooling Application
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Topics: Cooling, Fluids, Heat sinks, Optimization
Proceedings Papers

Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage

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Michael Shanks, Uduak Inyang-Udoh, Neera Jain
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111816
https://doi.org/10.1115/IPACK2023-111816
View Paper titled, Experimental Validation of a Heuristic Control Strategy for a Transient Thermal Management System With Latent Thermal Energy Storage
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Topics: Thermal energy storage, Thermal management, Transients (Dynamics), Control equipment, Heat, Simulation, Architecture, Computer cooling, Feedback, Fluids
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

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Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength

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Bryan Tunon, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111951
https://doi.org/10.1115/IPACK2023-111951
View Paper titled, Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength
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Topics: Coolants, Flow (Dynamics), Human failure events, Fluids, Electrodes, Needles, Cooling, Pressure, Electronics, Gages
Proceedings Papers

Power Density in the Context of Two-Phase Immersion Cooling

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Jimil M. Shah, Phillip E. Tuma
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A021, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96370
https://doi.org/10.1115/IPACK2022-96370
View Paper titled, Power Density in the Context of Two-Phase Immersion Cooling
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Topics: Cooling, Fluids, Power density
Proceedings Papers

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

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Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97429
https://doi.org/10.1115/IPACK2022-97429
View Paper titled, Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations
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Topics: Building renovation, Computational fluid dynamics, Coolants, Cooling, Data centers, Flow (Dynamics), Fluids, Geometry, Heat, Heat transfer
Proceedings Papers

Dual Converging Jets for Enhanced Liquid Impingement Cooling

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Reece Whitt, Rafael Estrella, David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-96635
https://doi.org/10.1115/IPACK2022-96635
View Paper titled, Dual Converging Jets for Enhanced Liquid Impingement Cooling
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Topics: Additive manufacturing, Electronics, Impingement cooling, Jets, Heat transfer, Nozzles, Turbulence, Aluminum, Cooling, Fluids
Proceedings Papers

Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model

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Alfonso Ortega, Carol Caceres, Umut Uras, Deogratius Kisitu, Uschas Chowdhury, Vahideh Radmard, Ali Heydari
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97421
https://doi.org/10.1115/IPACK2022-97421
View Paper titled, Determination of the Thermal Performance Limits for Single Phase Liquid Cooling Using an Improved Effectiveness-NTU Cold Plate Model
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Topics: Cooling, Plates (structures), Thermal resistance, Flow (Dynamics), Pressure drop, Computational fluid dynamics, Coolants, Cooling systems, Engineering simulation, Fluids
Proceedings Papers

CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server

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Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97402
https://doi.org/10.1115/IPACK2022-97402
View Paper titled, CFD Simulation-Based Comparative Study of Forced Convection Single-Phase Liquid Immersion Cooling for a High-Powered Server
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Topics: Computational fluid dynamics, Cooling, Fluids, Forced convection, Power density, Simulation, Temperature, Thermal conductivity
Proceedings Papers

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

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Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97266
https://doi.org/10.1115/IPACK2022-97266
View Paper titled, Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability
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Topics: Critical heat flux, Fluids, Heat transfer, Oxidation, Pool boiling
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

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Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

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Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97283
https://doi.org/10.1115/IPACK2022-97283
View Paper titled, Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module
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Topics: Bridges (Structures), Electronics, Energy gap, Optimization, Silicon, Design, Thermal resistance, Computational fluid dynamics, Heat exchangers, Fluids
Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

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Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97412
https://doi.org/10.1115/IPACK2022-97412
View Paper titled, Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
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Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

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Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

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Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72682
https://doi.org/10.1115/IPACK2021-72682
View Paper titled, A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases