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Proceedings Papers

Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam

Bolape Alade, Deogratius Kisitu, May Battleson, Denver Schaffarzick, Alfonso Ortega
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140105
https://doi.org/10.1115/IPACK2024-140105
View Paper titled, Experimental Investigation of Single-Phase Forced Convection Heat Transfer With Water in Compressed Copper Foam
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Topics: Copper, Forced convection, Water, Compression, Flow (Dynamics), Metal foams, Cooling, Heat, Computer cooling, Coolants
Proceedings Papers

Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Satyam Saini, Pratik Bansode, Harold Miyamura, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97416
https://doi.org/10.1115/IPACK2022-97416
View Paper titled, Liquid to Liquid Cooling for High Heat Density Liquid Cooled Data Centers
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Topics: Cooling, Data centers, Density, Heat, Plates (structures), Coolants, Cooling systems, Flow (Dynamics), Modeling, Server racks
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump

Ruikang Wu, Wei Lan, Xingjian Yu, Weicheng Shu, Meng Wang, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8210
https://doi.org/10.1115/IPACK2018-8210
View Paper titled, Numerical Study of the Flow Condition of the Hydrodynamic Levitated Mechanical Micropump
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Topics: Flow (Dynamics), Micropumps, Fluid dynamics, Pressure, Journal bearings, Pumps, Rotors, Bearings, Cooling, Cooling systems
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink

Ercan M. Dede, Shailesh N. Joshi, Feng Zhou
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48027
https://doi.org/10.1115/IPACK2015-48027
View Paper titled, Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
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Topics: Heat sinks, Manufacturing, Optimization, Testing, Topology, Computer-aided design, Design, Aluminum, Convection, Cooling
Proceedings Papers

Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Mehdi Asheghi, Kenneth Goodson, Tom Verstraete
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48123
https://doi.org/10.1115/IPACK2015-48123
View Paper titled, Numerical Optimization of Advanced Monolithic Microcoolers for High Heat Flux Microelectronics
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Topics: Heat flux, Microcoolers, Microelectronic devices, Optimization, Cooling, Fluids, Heat transfer, Computational fluid dynamics, Design, Engineering simulation
Proceedings Papers

Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks

Tianyi Gao, James Geer, Russell Tipton, Bruce Murray, Bahgat G. Sammakia, Alfonso Ortega, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48071
https://doi.org/10.1115/IPACK2015-48071
View Paper titled, Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks
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Topics: Cooling, Data centers, Temperature, Heat, Air flow, Computational fluid dynamics, Cooling systems, Stress, Computer simulation, Density
Proceedings Papers

Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling

Christopher M. Healey, James W. VanGilder, Zachary M. Pardey
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48424
https://doi.org/10.1115/IPACK2015-48424
View Paper titled, Perforated Tile Airflow Prediction: A Comparison of RANS CFD, Fast Fluid Dynamics, and Potential Flow Modeling
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Topics: Air flow, Computational fluid dynamics, Flow (Dynamics), Fluid dynamics, Modeling, Reynolds-averaged Navier–Stokes equations, Tiles, Data centers, Buoyancy, Friction
Proceedings Papers

Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation

Kazuaki Yazawa, Stephen D. Heister, Timothy S. Fisher
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A081, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48692
https://doi.org/10.1115/IPACK2015-48692
View Paper titled, Enhancement and Optimization of Planar Impingement Heat Transfer for Thermoelectric Power Generation
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Topics: Energy generation, Heat transfer, Optimization, Flow (Dynamics), Fluids, Design, Temperature, Heat exchangers, Generators, Orifices
Proceedings Papers

CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels

Omer Bugra Kanargi, Christopher Yap, Poh Seng Lee
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A083, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48277
https://doi.org/10.1115/IPACK2015-48277
View Paper titled, CFD Analysis of an Air-Cooled Planar Heat Sink With Cross-Connected Alternating Converging-Diverging Channels
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Topics: Computational fluid dynamics, Heat sinks, Flow (Dynamics), Cross connections, Heat transfer, Pressure, Thermal boundary layers, Air flow, Convection, Design
Proceedings Papers

A Study on Flow Boiling in Microchannel With Piranha Pin Fin

X. Yu, C. Woodcock, Y. Wang, J. Plawsky, Y. Peles
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48103
https://doi.org/10.1115/IPACK2015-48103
View Paper titled, A Study on Flow Boiling in Microchannel With Piranha Pin Fin
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Topics: Boiling, Flow (Dynamics), Microchannels, Critical heat flux, Fluid dynamics, Heat transfer, Pressure drop, Design, Energy dissipation, Fluids
Proceedings Papers

Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate

Feng Zhou, Yan Liu, Shailesh N. Joshi, Yanghe Liu, Ercan M. Dede
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48029
https://doi.org/10.1115/IPACK2015-48029
View Paper titled, Modular Flow Structure Design for a Single-Phase Manifold Microchannel Cold Plate
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Topics: Design, Flow (Dynamics), Manifolds, Microchannels, Cooling, Shapes, Coolants, Temperature, Channel flow, Computer cooling
Proceedings Papers

A Model to Guide Template-Based Nanoparticle Printing Development

David A. Rolfe, Kristen L. Dorsey, Jim C. Cheng, Albert P. Pisano
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48449
https://doi.org/10.1115/IPACK2015-48449
View Paper titled, A Model to Guide Template-Based Nanoparticle Printing Development
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Topics: Nanoparticles, Printing, Inks, Sorption, Fluid dynamics, Fluids, Molding, Vapors, Diffusion (Physics), Engineering simulation
Proceedings Papers

ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels

Gustavo R. Anjos, Norberto Mangiavacchi, Jose Pontes, John Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A026, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48441
https://doi.org/10.1115/IPACK2015-48441
View Paper titled, ALE-FEM for Two-Phase Flows With Heat and Mass Transfer in Microchannels
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Topics: Finite element methods, Heat, Mass transfer, Microchannels, Two-phase flow, Bubbles, Computer programming, Cooling, Design, Electronics
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48122
https://doi.org/10.1115/IPACK2015-48122
View Paper titled, Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow

David M. Sykes, Andrew L. Carpenter, Gregory S. Cole
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A044, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73204
https://doi.org/10.1115/IPACK2013-73204
View Paper titled, Experimental Investigation of the Effect of Synthetic Jets in Minichannels With Subcooled Boiling Flow
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Topics: Boiling, Flow (Dynamics), Jets, Subcooling, Heat transfer coefficients, Heat transfer, Microchannels, Momentum, Wall temperature, Boundary layers
Proceedings Papers

Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A039, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73187
https://doi.org/10.1115/IPACK2013-73187
View Paper titled, Analytic Optimization of Porous Medium Heat Sinks for Energy Efficiency and Minimum Mass
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Topics: Energy efficiency, Heat sinks, Optimization, Porous materials, Heat transfer, Porosity, Fluids, Density, Electrical conductivity, Energy consumption
Proceedings Papers

Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory

Sami A. Alkharabsheh, Bharathkrishnan Muralidharan, Mahmoud Ibrahim, Saurabh K. Shrivastava, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73214
https://doi.org/10.1115/IPACK2013-73214
View Paper titled, Open and Contained Cold Aisle Experimentally Validated CFD Model Implementing CRAC and Server Fan Curves for a Data Center Test Laboratory
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Topics: Computational fluid dynamics, Data centers, Tiles, Flow (Dynamics), Leakage, Containment, Errors, Calibration, Containment systems, Flow measurement