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Proceedings Papers
Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
Proceedings Papers
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8300
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
Proceedings Papers
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74026
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48333
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48111
Proceedings Papers
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73280
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 307-316, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52233
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 351-356, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52258
Proceedings Papers
Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 159-170, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89329
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 749-753, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89148
Proceedings Papers
Stress Measurement Errors in Flip Chip Packages Using Multi-Element Sensor Rosettes on (111) Silicon
Richard C. Jaeger, Jeffrey C. Suhling, Safina Hussain, Jordan C. Roberts, Mohammad A. Motalab, Chun-Hyung Cho
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 15-25, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89245
Proceedings Papers
Yoshihiko Kanda, Kunihiro Zama, Yoshiharu Kariya, Takao Mikami, Takaya Kobayashi, Toshiyuki Sato, Toshiaki Enomoto, Koichi Hirata
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 755-759, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89152
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 79-85, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33204
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 719-723, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33057
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 9-12, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33562
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 117-122, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33991
Proceedings Papers
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 87-94, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33319
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1433-1440, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73213
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