1-20 of 66
Flip-chip devices
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Available to Purchase

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Open the PDF for Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers in another window
Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy

Available to Purchase

Tadeh Avanessian, Jim Clatterbaugh, Robin L. Zinsmaster, Leyla Hashemi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69495
https://doi.org/10.1115/IPACK2021-69495
View Paper titled, Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
Open the PDF for Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy in another window
Topics: Bonding, Epoxy adhesives, Epoxy resins, Flip-chip, Flip-chip devices
Proceedings Papers

High Performance Computing Package With Chip Module on Substrate Solutions

Available to Purchase

Ching Chia Chen, David Lai, Vito Lin, Yu Po Wang
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
https://doi.org/10.1115/IPACK2020-2547
View Paper titled, High Performance Computing Package With Chip Module on Substrate Solutions
Open the PDF for High Performance Computing Package With Chip Module on Substrate Solutions in another window
Topics: Ball-Grid-Array packaging, Bridges (Structures), Cloud computing, Corners (Structural elements), Data centers, Deformation, Elongation, Flip-chip, Flip-chip devices, Fracture (Materials)
Proceedings Papers

Large Flip Chip Assembly Challenges and Risk Mitigation Process

Available to Purchase

Jeremy Plunkett, Suresh Subramaniam, Nokibul Islam, Kang KeonTaek, Gu SeonMo, Eric Ouyang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74026
https://doi.org/10.1115/IPACK2017-74026
View Paper titled, Large Flip Chip Assembly Challenges and Risk Mitigation Process
Open the PDF for Large Flip Chip Assembly Challenges and Risk Mitigation Process in another window
Topics: Ball-Grid-Array packaging, Copper, Cracking (Materials), Delamination, Failure, Flip-chip, Flip-chip assemblies, Flip-chip devices, Flip-chip packages, Fracture (Process)
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Available to Purchase

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
Open the PDF for The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages in another window
Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application

Available to Purchase

Hiroyuki Mori, Sayuri Kohara, Keishi Okamoto, Hirokazu Noma, Kazushige Toriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48741
https://doi.org/10.1115/IPACK2015-48741
View Paper titled, Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
Open the PDF for Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application in another window
Topics: Flip-chip packages, Thermal deformation, Warping, Finite element analysis, Manufacturing, Package on package, Shapes, Deformation, Finite element model, Flip-chip
Proceedings Papers

Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging

Available to Purchase

Azadeh Moini, Amin Nikoozadeh, Jung Woo Choe, Butrus T. Khuri-Yakub, Chienliu Chang, Doug Stephens, L. Scott Smith, David Sahn
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48611
https://doi.org/10.1115/IPACK2015-48611
View Paper titled, Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging
Open the PDF for Fabrication, Packaging, and Catheter Assembly of 2D CMUT Arrays for Endoscopic Ultrasound and Cardiac Imaging in another window
Topics: Catheters, Endoscopic devices, Imaging, Manufacturing, Packaging, Ultrasound, Biomedical imaging, Ultrasonic transducers, Bonding, Design
Proceedings Papers

Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies

Available to Purchase

Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48626
https://doi.org/10.1115/IPACK2015-48626
View Paper titled, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies
Open the PDF for Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies in another window
Topics: Flip-chip, Flip-chip devices, Laminates, Simulation, Stress, Flip-chip assemblies, Diffusion (Physics), Storage, Temperature, Absorption
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

Available to Purchase

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48088
https://doi.org/10.1115/IPACK2015-48088
View Paper titled, Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
Open the PDF for Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels in another window
Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress

Available to Purchase

Mario Gonzalez, Joeri De Vos, Geert Van der Plas, Eric Beyne
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48111
https://doi.org/10.1115/IPACK2015-48111
View Paper titled, An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress
Open the PDF for An Efficient Bump Pad Design to Mitigate the Flip Chip Package Induced Stress in another window
Topics: Design, Flip-chip packages, Stress, Copper, Columns (Structural), Polishing equipment, Solders, Finite element model, Flip-chip, Flip-chip devices
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Available to Purchase

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Open the PDF for Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints in another window
Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors

Available to Purchase

Shawn J. Cunningham, Yvonne Heng, Nabeel Idrisi, Brad Nelson, John McKillop
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A002, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73222
https://doi.org/10.1115/IPACK2013-73222
View Paper titled, Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors
Open the PDF for Flip Chip Packaging of Wafer Level Encapsulated RF MEMS Tunable Capacitors in another window
Topics: Capacitors, Flip-chip, Flip-chip devices, Microelectromechanical systems, Packaging, Semiconductor wafers, Solders, Stress, Deflection, Failure
Proceedings Papers

Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly

Available to Purchase

Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73244
https://doi.org/10.1115/IPACK2013-73244
View Paper titled, Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly
Open the PDF for Measurement of Microprocessor Die Stress due to Thermal Cycling, Power Cycling, and Second Level Assembly in another window
Topics: Flip-chip, Flip-chip devices, Manufacturing, Sensors, Stress
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

Available to Purchase

Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
https://doi.org/10.1115/IPACK2013-73104
View Paper titled, A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
Open the PDF for A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance in another window
Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging

Available to Purchase

Chang Yong Ha, Soo Il Lee
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 179-184, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52100
https://doi.org/10.1115/IPACK2011-52100
View Paper titled, Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging
Open the PDF for Topology Optimization on Targeting Frequency and Mode of Ultrasonic Bonding Tool for Microchip Packaging in another window
Topics: Bonding, Integrated circuits, Optimization, Packaging, Topology, Design, Modal assurance criterion, Vibration, Errors, Finite element model
Proceedings Papers

Lead Free Flip Chip Reliability for Various Package Types

Available to Purchase

Nokibul Islam, Miguel Jimarez, Ahmer Syed, TaeKyeong Hwang, JaeYun Gim, WonJoon Kang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52260
https://doi.org/10.1115/IPACK2011-52260
View Paper titled, Lead Free Flip Chip Reliability for Various Package Types
Open the PDF for Lead Free Flip Chip Reliability for Various Package Types in another window
Topics: Ball-Grid-Array packaging, Flip-chip, Flip-chip devices, Reliability, Warping
Proceedings Papers

Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks

Available to Purchase

Hung-Yun Lin, Abhishek Tambat, Ian Claydon, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 351-356, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52258
https://doi.org/10.1115/IPACK2011-52258
View Paper titled, Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks
Open the PDF for Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks in another window
Topics: Deformation, Fracture (Process), Risk, Temperature, Computer software, Cooling, Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages
Proceedings Papers

Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps

Available to Purchase

Kohta Nakahira, Hironori Tago, Fumiaki Endo, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 19-25, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52063
https://doi.org/10.1115/IPACK2011-52063
View Paper titled, Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps
Open the PDF for Minimization of the Local Residual Stress in 3D Flip Chip Structures by Optimizing the Mechanical Properties of Electroplated Materials and the Alignment Structure of TSVs and Fine Bumps in another window
Topics: Flip-chip, Flip-chip devices, Mechanical properties, Stress, Copper, Silicon chips, Gages, Packaging, Sensors, Strain gages
Proceedings Papers

Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique

Available to Purchase

Jie Gong, I. Charles Ume
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 95-103, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52294
https://doi.org/10.1115/IPACK2011-52294
View Paper titled, Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique
Open the PDF for Detection of Poor Wetting of Lead-Free Solder Bumps in Ball Grid Array Packages Using Laser Ultrasound Technique in another window
Topics: Ball-Grid-Array packages, Lasers, Lead-free solders, Ultrasound, Wetting, Solders, Inspection, Transients (Dynamics), Ball-Grid-Array packaging, Displacement
Proceedings Papers

Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies

Available to Purchase

Guoyun Tian, Chang Lin, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
https://doi.org/10.1115/InterPACK2009-89209
View Paper titled, Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies
Open the PDF for Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies in another window
Topics: Flip-chip, Flip-chip devices, Hardening (Curing), Laminates, Mechanical behavior, Reliability, Stress-strain curves