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Proceedings Papers

Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current

Kazuki Hisasue, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Kotaro Miura, Yusuke Souma
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141181
https://doi.org/10.1115/IPACK2024-141181
View Paper titled, Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current
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Topics: Damage, Density, Electrodiffusion, Flexible electronics, Nanowires
Proceedings Papers

Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling

Pradeep Lall, Fatahi Musa, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A006, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141871
https://doi.org/10.1115/IPACK2024-141871
View Paper titled, Water-Based Inks and Low-Temperature Interconnects for Direct-Write Fabrication of Flexible Electronics Under Thermal Cycling
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Topics: Electronics, Flexible electronics, Low temperature, Manufacturing, Water based printing inks, Bonding, Electrical conductivity, Inks, Accelerated life testing, Additive manufacturing
Proceedings Papers

Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique

Pradeep Lall, Md Golam Sarwar, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112061
https://doi.org/10.1115/IPACK2023-112061
View Paper titled, Repairability of SMDs on 3D Printed Circuitry for Sustainable Electronics Utilizing Direct Write Technique
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Topics: Additive manufacturing, Adhesives, Electronics, Flexible electronics, Printing, Surface mount devices, Sustainability
Proceedings Papers

Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112012
https://doi.org/10.1115/IPACK2023-112012
View Paper titled, Impact of Component Interconnectivity on Mechanical and Electrical Properties of Flexible Hybrid Electronics with Printed Water-based Silver Ink Circuits
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Topics: Bonding, Circuits, Electrical properties, Electronics, Inks, Silver, Water, Adhesives, Low temperature, Solders
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97451
https://doi.org/10.1115/IPACK2022-97451
View Paper titled, SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
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Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74086
https://doi.org/10.1115/IPACK2021-74086
View Paper titled, Development of Multi-Layer Circuitry Using Electrically Conductive Adhesive and Low-Temperature Solder Material for Surface-Mount Component Attachment
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Topics: Adhesives, Flexible electronics, Inks, Low temperature, Printing, Solders, Surface mount components
Proceedings Papers

Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
https://doi.org/10.1115/IPACK2021-74060
View Paper titled, Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications
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Topics: Electronics, Reliability, Surface preparation, Stress, Adhesives, Biometry, Diluents, Dust, Finite element model, Flexible electronics
Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
https://doi.org/10.1115/IPACK2021-68902
View Paper titled, Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading
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Topics: Damage, Electrodiffusion, Flexible electronics, Stress
Proceedings Papers

Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74088
https://doi.org/10.1115/IPACK2021-74088
View Paper titled, Effect of Lamination Parameters and Mechanical Folding on SOH Degradation of Li-ion Battery Subjected to Accelerated Life Testing
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Topics: Accelerated life testing, Flexible electronics, Lamination, Lithium-ion batteries
Proceedings Papers

Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74115
https://doi.org/10.1115/IPACK2021-74115
View Paper titled, Life-Assessment for Thin Flexible Batteries Under U-Flex-to-Install and Dynamic Folding
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Topics: Batteries, Bending (Stress), Biomedical equipment, Electronics, Flexible electronics, Industrial research, Lithium-ion batteries, Regression models, Stress
Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2525
https://doi.org/10.1115/IPACK2020-2525
View Paper titled, Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices
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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data
Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2644
https://doi.org/10.1115/IPACK2020-2644
View Paper titled, Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors
Proceedings Papers

Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2661
https://doi.org/10.1115/IPACK2020-2661
View Paper titled, Effect of Flex-to-Install and Dynamic Folding on Li-Ion Battery Performance Degradation Subjected to Varying Orientations, Folding Speeds, Depths of Charge and C-Rates
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Topics: Lithium-ion batteries, Batteries, Industrial research, Reliability, Stress, Battery life, Bending (Stress), Biomedical equipment, Cycles, Electronics
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6584
https://doi.org/10.1115/IPACK2019-6584
View Paper titled, Folding-Reliability of Flexible Electronics in Wearable Applications
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6570
https://doi.org/10.1115/IPACK2019-6570
View Paper titled, Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources
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Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models
Proceedings Papers

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6579
https://doi.org/10.1115/IPACK2019-6579
View Paper titled, Flexure and Twist Test Reliability Assurance of Flexible Electronics
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Topics: Aerosols, Bending (Stress), Flexible electronics, Reliability