1-20 of 22
Finishes
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112041
https://doi.org/10.1115/IPACK2023-112041
View Paper titled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints
Open the PDF for Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints in another window
Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Fatigue life, Finishes, Finite element analysis, Reliability, Solder joints
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
Open the PDF for Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging in another window
Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling

Munshi Basit, Mohammad Motalab, Jeffrey C. Suhling, John L. Evans, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A039, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48620
https://doi.org/10.1115/IPACK2015-48620
View Paper titled, FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling
Open the PDF for FEA Based Reliability Predictions for PBGA Packages Subjected to Isothermal Aging Prior to Thermal Cycling in another window
Topics: Finite element analysis, Reliability, Failure, Lead-free solders, Temperature, Accelerated life testing, Ball-Grid-Array packaging, Fracture (Materials), Lumber, Modeling
Proceedings Papers

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

Chaobo Shen, Zhou Hai, Cong Zhao, Jiawei Zhang, M. J. Bozack, J. C. Suhling, John L. Evans
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A033, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48009
https://doi.org/10.1115/IPACK2015-48009
View Paper titled, Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling
Open the PDF for Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling in another window
Topics: Event history analysis, Solder joints, Tin, Ball-Grid-Array packaging, Fatigue failure, Finishes, Intermetallic compounds, Solders
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
Open the PDF for Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions in another window
Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions

Ruander Cardenas, Vinod Narayanan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 95-106, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52043
https://doi.org/10.1115/IPACK2011-52043
View Paper titled, Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions
Open the PDF for Critical Heat Flux During Submerged Jet Impingement Boiling of Saturated Water at Sub-Atmospheric Conditions in another window
Topics: Boiling, Critical heat flux, Water, Errors, Nozzles, Finishes, Fluids, Reynolds number, Temperature
Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

G. Srinivasan, R. Murcko, K. Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
https://doi.org/10.1115/InterPACK2009-89241
View Paper titled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
Open the PDF for Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes in another window
Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability
Proceedings Papers

Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies

Bankeem V. Chheda, Sathishkumar Sakthivelan, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 309-316, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89321
https://doi.org/10.1115/InterPACK2009-89321
View Paper titled, Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies
Open the PDF for Thermal Shock and Drop Test Behaviour of Area Array Packages in Forward and Backward Compatible Assemblies in another window
Topics: Thermal shock, Solders, Alloys, Failure, Chain, Manufacturing, Solder joints, Ball-Grid-Array packaging, Finishes, Lead-free solders
Proceedings Papers

Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints

Feng Gao, Jianping Jing, Frank Z. Liang, Richard L. Williams, Jianmin Qu
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 729-736, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89098
https://doi.org/10.1115/InterPACK2009-89098
View Paper titled, Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints
Open the PDF for Plastic Strain Distribution as a Precursor for Transition From Ductile to Brittle Failure in Lead-Free Solder Joints in another window
Topics: Brittleness, Failure, Lead-free solders, Solders, Solder joints, Brittle fracture, Failure mechanisms, Design, Dynamic testing (Materials), Finite element analysis
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
Open the PDF for Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages in another window
Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication

Junehyeon Ahn, Hongkwon Kim, Kangho Byun, Youngmin Lee, Donghoon Jang, Byungsung Kim
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 929-935, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89339
https://doi.org/10.1115/InterPACK2009-89339
View Paper titled, Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication
Open the PDF for Drop Test for Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Treatment Application That is Suitable to a Low-Cost, Fine Pitch and Easy Fabrication in another window
Topics: Manufacturing, Nickel, Palladium, Surface finishing, Ball-Grid-Array packaging, Solder joints, Chain, Data acquisition, Data acquisition systems, Failure
Proceedings Papers

Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials

Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33629
https://doi.org/10.1115/IPACK2007-33629
View Paper titled, Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials
Open the PDF for Evaluation of and Inspection Metrology for Lid Attach for Advanced Thermal Packaging Materials in another window
Topics: Delamination, Inspection, Metrology, Nondestructive evaluation, Packaging, X-rays, Silicones, Acoustics, Finishes, Adhesion
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
Open the PDF for Pb-Free Process Development for a High End Storage Area Network Application in another window
Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

Die Stress Variation During Thermal Cycling Reliability Tests

M. Kaysar Rahim, Jordan Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 481-492, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33548
https://doi.org/10.1115/IPACK2007-33548
View Paper titled, Die Stress Variation During Thermal Cycling Reliability Tests
Open the PDF for Die Stress Variation During Thermal Cycling Reliability Tests in another window
Topics: Reliability, Stress, Sensors, Temperature, Cycles, Packaging, Electronic packaging, Solders, Accelerated life testing, Constitutive equations
Proceedings Papers

Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses

Pradeep Lall, Madhura Hande, Chandan Bhat, Jeff Suhling
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 101-116, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33876
https://doi.org/10.1115/IPACK2007-33876
View Paper titled, Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses
Open the PDF for Leading Prognostic Indicators for Health Management of Electronics Under Thermo-Mechanical Stresses in another window
Topics: Electronics, Packaging, Reliability, Stress, Thermomechanics, Failure, Damage, Algorithms, Architecture, Automotive safety
Proceedings Papers

Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes

Guhan Subbarayan, Robert Kinyanjui, Pei Fang Tsai, Krishnaswami Srihari
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 43-49, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33666
https://doi.org/10.1115/IPACK2007-33666
View Paper titled, Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes
Open the PDF for Mechanical Reliability Evaluation of Stripped and Replated Component Termination Finishes in another window
Topics: Finishes, Reliability, Tin, Testing, Hazardous substances, Integrated circuits, Intermetallic compounds, Lumber, Nickel, Optical microscopes
Proceedings Papers

Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes

Anand Kannabiran, Sreekanth Varma Penmatsa, S. Manian Ramkumar, Reza Ghaffarian
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 945-952, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33963
https://doi.org/10.1115/IPACK2007-33963
View Paper titled, Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes
Open the PDF for Effect of Forward and Backward Compatibility of Solder Paste and Component Finish on Fine-Pitch Component Assemblies Using ENIG and IMAG PWB Finishes in another window
Topics: Finishes, Printed circuit boards, Solders, Tin, Manufacturing, Solder joints, Testing, Design, Intermetallic compounds, Surface mount packaging
Proceedings Papers

Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow

Felipe E. Ortega Gutierrez, Alfonso Ortega, Guoping Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 315-327, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73228
https://doi.org/10.1115/IPACK2005-73228
View Paper titled, Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow
Open the PDF for Experiments on the Flow and Heat Transfer in Fine Pitch Parallel Plate Heat Sinks With Side Inlet Side Exit Flow in another window
Topics: Flow (Dynamics), Heat sinks, Heat transfer, Heat, Temperature measurement, Boundary-value problems, Clearances (Engineering), Copper, Cross-flow, Finishes
Proceedings Papers

Indentation Induced Tin Whisker Formation on Tin Plated Component Leads

Jin Liang, Xiaodong Li, Zhi-Hui Xu, Dongkai Shangguan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1199-1205, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73233
https://doi.org/10.1115/IPACK2005-73233
View Paper titled, Indentation Induced Tin Whisker Formation on Tin Plated Component Leads
Open the PDF for Indentation Induced Tin Whisker Formation on Tin Plated Component Leads in another window
Topics: Coating processes, Coatings, Deformation, Elastic moduli, Finishes, Finite element analysis, Nanoindentation, Nucleation (Physics), Plating, Reliability
Proceedings Papers

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

Don-Son Jiang, Joe Hung, Yu-Po Wang, C. S. Hsiao
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1109-1113, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73063
https://doi.org/10.1115/IPACK2005-73063
View Paper titled, Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability
Open the PDF for Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability in another window
Topics: Finishes, Lead-free solders, Reliability, Solders