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Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
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Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
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Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97430
https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
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Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment

Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Scott Miller
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74073
https://doi.org/10.1115/IPACK2021-74073
View Paper titled, Printed Flexible LC Filter Using Additive Micro-Dispensing With Silver Conductive Paste and ECA for Component Attachment
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Topics: Adhesives, Filters, Printing, Silver, Sintering
Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8436
https://doi.org/10.1115/IPACK2018-8436
View Paper titled, Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73252
https://doi.org/10.1115/IPACK2013-73252
View Paper titled, Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability
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Topics: Algorithms, Reliability, Kalman filters, Ball-Grid-Array packaging, Failure, Filters, Particulate matter, Printed circuit boards, Service life (Equipment), Solder joints
Proceedings Papers

Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter

Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A024, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73305
https://doi.org/10.1115/IPACK2013-73305
View Paper titled, Assessment of Lumen Degradation and Remaining Life of LEDs Using Particle Filter
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Topics: Filters, Light-emitting diodes, Particulate matter
Proceedings Papers

PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 549-562, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52197
https://doi.org/10.1115/IPACK2011-52197
View Paper titled, PHM of Leadfree Interconnects Using Resistance Spectroscopy Based Particle Filter Models for Shock and Vibration Environments
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Topics: Filters, Particulate matter, Shock (Mechanics), Spectroscopy, Vibration, Damage, Failure, Service life (Equipment), Algorithms, Electronics
Proceedings Papers

Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters

Jupyo Hong, Shan Gao, Job Ha, Sijoong Yang, Ingoo Kang, Taehoon Kim, Seogmoon Choi, Sung Yi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 1-5, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33031
https://doi.org/10.1115/IPACK2007-33031
View Paper titled, Design Optimization of a Wafer Level Package for Surface Acoustic Wave Filters
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Topics: Design, Filters, Optimization, Semiconductor wafers, Surface acoustic waves, Finite element methods, Reliability, Packaging, Copper, Stress
Proceedings Papers

Analytical Solution of Whispering-Gallery Modes

Haiyong Quan, Zhixiong Guo
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 489-497, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33124
https://doi.org/10.1115/IPACK2007-33124
View Paper titled, Analytical Solution of Whispering-Gallery Modes
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Topics: Boundary-value problems, Cavities, Electric fields, Filters, Microelectromechanical systems, Nanoelectromechanical systems, Nanosensors, Resonance, Separation (Technology), Wave equations
Proceedings Papers

Effect of Underfilling Materials and Processes on the Reliability of System in Package

Tae Hyun Kim, Sung Yi, Jae Ky Roh, Chang Mu Jung, Yan Shuang Guo, Jae Chun Do, Jin Gu Kim, Shan Guo, Jupyo Hong
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1-8, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33034
https://doi.org/10.1115/IPACK2007-33034
View Paper titled, Effect of Underfilling Materials and Processes on the Reliability of System in Package
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Topics: Reliability, System-in-package, Manufacturing, Solders, Adhesion, Computer simulation, Crystals, Delamination, Dimensions, Failure mechanisms
Proceedings Papers

3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies

J.-H. Lee, S. Sarkar, S. Pinel, J. Papapolymerou, J. Laskar, M. M. Tentzeris
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1607-1611, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73127
https://doi.org/10.1115/IPACK2005-73127
View Paper titled, 3D-SOP Millimeter-Wave Functions for High Data Rate Wireless Systems Using LTCC and LCP Technologies
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Topics: Millimeter waves, Design, Ceramics, Filters, Dimensions, Electromagnetic spectrum, Filtration, Internet, Liquid crystalline polymers, Low temperature
Proceedings Papers

Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula

Xiangyin Zeng, Jiangqi He, Baoshu Xu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1969-1972, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73308
https://doi.org/10.1115/IPACK2005-73308
View Paper titled, Accelerated Convergence for Lumped-Elements Based on-Package RF Passives Design by Using Curve Fitted Formula
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Topics: Capacitors, Design, Inductors, Capacitance, Computer software, Curve fitting, Errors, Filters, Q-factor, Tolerance analysis
Proceedings Papers

Embedded RF Filters for WLAN and Bluetooth Applications

Telesphor Kamgaing, Jiangqi He, Rockwell Hsu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1621-1624, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73319
https://doi.org/10.1115/IPACK2005-73319
View Paper titled, Embedded RF Filters for WLAN and Bluetooth Applications
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Topics: Filters, Wireless LAN, Ceramics, Design, Low-pass filters, Manufacturing
Proceedings Papers

Integrated Passives for Commercial Wireless Applications (Invited Paper)

Rashaunda M. Henderson, Michael F. Petras
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1995-1998, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73499
https://doi.org/10.1115/IPACK2005-73499
View Paper titled, Integrated Passives for Commercial Wireless Applications (Invited Paper)
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Topics: Capacitors, Ceramics, Circuits, Density, Design, Filters, Inductors, Integrated circuits, Low temperature, Modeling
Proceedings Papers

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
https://doi.org/10.1115/IPACK2005-73185
View Paper titled, Mathematical Optimization of Electronic Enclosures
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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans
Proceedings Papers

Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry

Daniel J. Hyman, Roger Kuroda
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2053-2056, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73419
https://doi.org/10.1115/IPACK2005-73419
View Paper titled, Flip-Chip Assembly of RF MEMS for Microwave Hybrid Circuitry
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Topics: Flip-chip assemblies, Microelectromechanical systems, Microwaves, Packaging, Flip-chip, Reliability, Filters, Performance characterization, Yield strength
Proceedings Papers

Chip Scale Package for Image Sensor Device

Yung-Ching Chao, John Liu, Yao-Jung Lee, De-Shin Liu, Jeff Wang, Ching-Yang Chen, Sam Huang, Alex Lu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 993-998, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73329
https://doi.org/10.1115/IPACK2005-73329
View Paper titled, Chip Scale Package for Image Sensor Device
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Topics: Sensors, Bonding, Flip-chip, Flip-chip devices, Manufacturing, Metals, Optical glass, Reliability, Sealing (Process), Semiconductor wafers
Proceedings Papers

Planar Waveguide: Utility in Amino Acid Detection

David R. Wulfman, Tracey Baas, Ronald McGlennen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 681-686, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35300
https://doi.org/10.1115/IPACK2003-35300
View Paper titled, Planar Waveguide: Utility in Amino Acid Detection
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Topics: Waveguides, Biomedicine, Design, Fluorescence, Glass, DNA, Engineering prototypes, Excitation, Filters, Instrumentation
Proceedings Papers

RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems

M. Tentzeris, J. Laskar
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 19-24, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35360
https://doi.org/10.1115/IPACK2003-35360
View Paper titled, RF System-on-Package (SOP) Development for Compact Low Cost Wireless Front-End Systems
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Topics: Architecture, Cavities, Filters, Finite difference time-domain analysis, Inductors, Manufacturing, Microelectromechanical systems, Modeling, Q-factor, Simulation