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Proceedings Papers

Standardized Approach for Assessing Fiber Device Resiliency

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Conor Galligan, Daniel Alves
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141204
https://doi.org/10.1115/IPACK2024-141204
View Paper titled, Standardized Approach for Assessing Fiber Device Resiliency
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Topics: Fibers, Resilience, Testing, Governments, Photonic equipment, Engineering prototypes, Failure, Lasers, Manufacturing, Photonics
Proceedings Papers

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

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Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
https://doi.org/10.1115/IPACK2022-97455
View Paper titled, Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
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Topics: Cables, Construction, Copper, Cycles, Density, Elastomers, Fibers, Flat heat pipes, Flip-chip, Flip-chip devices
Proceedings Papers

Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules

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Jin Cui, Liang Pan, Justin A. Weibel
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
https://doi.org/10.1115/IPACK2019-6389
View Paper titled, Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
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Topics: Compression, Contact resistance, Cycles, Fibers, Heat sinks, Microscale devices, Polymers, Pressure, Springs, Surface roughness
Proceedings Papers

Hot Spot Elimination by Thin and Smart Heat Spreader

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Mohammad Shahed Ahamed, Yuji Saito, Masataka Mochizuki, Koichi Mashiko
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48019
https://doi.org/10.1115/IPACK2015-48019
View Paper titled, Hot Spot Elimination by Thin and Smart Heat Spreader
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Topics: Flat heat pipes, Heat pipes, Heat, Clocks, Computer cooling, Metals, Aerospace industry, Cooling, Data centers, Experimental analysis
Proceedings Papers

Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass

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Satoru Mizuno, Tamio Ida, Manabu Fuchihata, Edmundo Sanchez, Jr., Koji Yoshikuni
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48767
https://doi.org/10.1115/IPACK2015-48767
View Paper titled, Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass
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Topics: Biomass, Coke, Compressive strength, Density, Compression, High temperature, Temperature, Water, Coal, Fibers
Proceedings Papers

Micro Cryogenic Coolers With Mixed Refrigerants

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Ryan Lewis, Yunda Wang, Paul Schroeder, Collin Coolidge, Ray Radebaugh, Y. C. Lee
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73290
https://doi.org/10.1115/IPACK2013-73290
View Paper titled, Micro Cryogenic Coolers With Mixed Refrigerants
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Topics: Coolers, Refrigerants, Microelectromechanical systems, Flow (Dynamics), Heat exchangers, Low temperature, Microchannel flow, Pressure, Temperature, Valves
Proceedings Papers

High Performance Thermal Conductive Sheets Made of Carbon Fibers

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Keisuke Aramaki, Hiroyuki Ryoson, Yuichi Ishida
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52218
https://doi.org/10.1115/IPACK2011-52218
View Paper titled, High Performance Thermal Conductive Sheets Made of Carbon Fibers
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Topics: Carbon fibers, Resins, Thermal conductivity, Compressibility, Cooling systems, Fibers, Particulate matter, Aluminum, ASTM International, Contact resistance
Proceedings Papers

An Innovative Way to Measure Temperature by Using the Faraday Effect

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Pranav Limaye, Anisur Rehman
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 293-296, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52202
https://doi.org/10.1115/IPACK2011-52202
View Paper titled, An Innovative Way to Measure Temperature by Using the Faraday Effect
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Topics: Faraday effect, Temperature, Magnetic fields, Cables, Electromagnetic interference, Fibers, Insulation, Magnets, Optical fiber, Permanent magnets
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

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David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

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Yuji Nishimura, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
https://doi.org/10.1115/IPACK2011-52105
View Paper titled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
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Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing
Proceedings Papers

Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection

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Bharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
https://doi.org/10.1115/InterPACK2009-89340
View Paper titled, Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
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Topics: Mixed convection, Solar energy, Stress, Telecommunications, Construction, Cooling systems, Electronics, Optical instruments, Acoustics, Air conditioning
Proceedings Papers

Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

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Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89233
https://doi.org/10.1115/InterPACK2009-89233
View Paper titled, Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Light), Fibers, Displacement, Polarization (Electricity), Polarization (Waves), Electric discharge, Experimental design
Proceedings Papers

Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics

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Keiji Ogawa, Heisaburo Nakagawa, Masatoshi Matsudaira
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
https://doi.org/10.1115/InterPACK2009-89034
View Paper titled, Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
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Topics: Fiber reinforced plastics, Glass, Printed circuit boards, Drilling, Drills (Tools), Surface roughness, Temperature, Circuits, Delamination, Glass fibers
Proceedings Papers

Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature

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Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa, Tsuyoshi Okawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 219-227, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89060
https://doi.org/10.1115/InterPACK2009-89060
View Paper titled, Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature
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Topics: Drilling, Drills (Tools), Optimization, Printed circuit boards, Temperature, Fibers, Glass reinforced plastics
Proceedings Papers

Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment

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Rohan Kulkarni, Krishnaswami Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89221
https://doi.org/10.1115/InterPACK2009-89221
View Paper titled, Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
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Topics: Electronics, Manufacturing, Optical fiber, Polarization (Electricity), Polarization (Light), Polarization (Waves), Fibers, Engineering design processes, Experimental design, Manufacturing technology
Proceedings Papers

Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data

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Paul J. Huspeni, Ly Le, Wei Liu, Elli Saravanos, Shannon Adkins
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 673-683, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89217
https://doi.org/10.1115/InterPACK2009-89217
View Paper titled, Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data
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Topics: Optical fiber, Stress, Fibers, Manufacturing, Maximum likelihood estimation, Failure, Reliability, Statistical analysis, Coating processes, Coatings
Proceedings Papers

Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment

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Lang Yuan, Jignesh Patel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89377
https://doi.org/10.1115/InterPACK2009-89377
View Paper titled, Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
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Topics: Acoustics, Air filters, Design, Fibers, Noise (Sound), Telecommunications, Thermal management
Proceedings Papers

Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models

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Parsaoran Hutapea, Joachim L. Grenestedt, Mitul Modi, Michael Mello, Kristopher Frutschy
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1141-1145, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73122
https://doi.org/10.1115/IPACK2005-73122
View Paper titled, Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models
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Topics: Finite element model, Thermomechanics, Warping, Adhesion, Copper, Curve fitting, Density, Fibers, Finite element analysis, Polymers
Proceedings Papers

Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices

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Randeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73278
https://doi.org/10.1115/IPACK2005-73278
View Paper titled, Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices
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Topics: Composite materials, Cooling, Fibers, Heat pipes
Proceedings Papers

High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation

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V. Srinivasan, S. Radhakrishnan, X. Zhang, G. Subbarayan, T. Baughn, L. Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1471-1478, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73258
https://doi.org/10.1115/IPACK2005-73258
View Paper titled, High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation
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Topics: Materials characterization, Resolution (Optics), Composite materials, Computer software, Displacement, B-splines, Fibers, High temperature, Mechanical testing, Packaging