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Proceedings Papers
Standardized Approach for Assessing Fiber Device Resiliency
Available to Purchase
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141204
Proceedings Papers
Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers
Available to PurchaseShidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97455
Proceedings Papers
Demonstration of a Compliant Micro-Spring Array As a Thermal Interface Material for Pluggable Optoelectronic Transceiver Modules
Available to Purchase
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6389
Proceedings Papers
Hot Spot Elimination by Thin and Smart Heat Spreader
Available to Purchase
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A049, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48019
Proceedings Papers
Formation Characteristics of Bio-Coke Produced From Waste Agricultural Biomass
Available to Purchase
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48767
Proceedings Papers
Micro Cryogenic Coolers With Mixed Refrigerants
Available to Purchase
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73290
Proceedings Papers
High Performance Thermal Conductive Sheets Made of Carbon Fibers
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 305-309, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52218
Proceedings Papers
An Innovative Way to Measure Temperature by Using the Faraday Effect
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 293-296, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52202
Proceedings Papers
Characterization of a Macrofiber Piezoelectric Composite
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
Proceedings Papers
Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
Available to Purchase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
Proceedings Papers
Impact of Double Walled Telecommunication Cabinet on Solar Load: Natural and Forced Convection
Available to PurchaseBharathkrishnan Muralidharan, Feroz Ahamed Iqbal Mariam, Veerendra Mulay, Dereje Agonafer, Mark Hendrix
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 985-991, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89340
Proceedings Papers
Angular Offset Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 277-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89233
Proceedings Papers
Evaluation and Improvement of Micro-Drilled-Hole Wall Quality in Printed Wiring Boards Made of Glass Fiber-Reinforced Plastics
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89034
Proceedings Papers
Study on CAM System for Drilling in Printed Wiring Boards: Optimization of Stacking Sheet Considering Drill Processing Temperature
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 219-227, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89060
Proceedings Papers
Splicing of Polarization Maintained (PANDA) Optical Fibers in an Electronics Manufacturing Environment
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 261-265, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89221
Proceedings Papers
Weibull Analysis Method Applied to Optical Fiber Breaking Stress Data
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 673-683, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89217
Proceedings Papers
Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
Available to Purchase
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1025-1032, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89377
Proceedings Papers
Prediction of Microelectronic Substrate Warpage Using Homogenized Thermomechanical Finite Element Models
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1141-1145, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73122
Proceedings Papers
Flat Miniature Heat Pipe With Composite Fibre Wick Structure for Cooling of Mobile Handheld Devices
Available to PurchaseRandeep Singh, Aliakbar Akbarzadeh, Mastaka Mochizuki, Yuji Saito, Thang Nguyen, Bob Kao, Tanaphan Sataphan, Eiji Takenaka, Vijit Wuttijumnong
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 409-414, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73278
Proceedings Papers
High Resolution Characterization of Materials Used in Packages Through Digital Image Correlation
Available to Purchase
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1471-1478, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73258
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