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Proceedings Papers

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

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Matthew Norris, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
https://doi.org/10.1115/IPACK2023-113999
View Paper titled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability
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Topics: Fatigue, High temperature, Lead-free solders, Reliability, Solders, Cycles, Failure, Geometry, Temperature, Thermal shock
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

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Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6507
https://doi.org/10.1115/IPACK2019-6507
View Paper titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

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Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

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Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48136
https://doi.org/10.1115/IPACK2015-48136
View Paper titled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
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Topics: Lead-free solders, Low cycle fatigue, Stress, Simulation, Design engineering, Fatigue cracks, Fatigue life, Fatigue testing, Shapes, Solder joints
Proceedings Papers

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

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Takahiro Akutsu, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 691-700, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52070
https://doi.org/10.1115/IPACK2011-52070
View Paper titled, Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints
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Topics: Fatigue, Lead-free solders, Fatigue cracks, Crystals, Finite element methods, Finite element model, Solder joints, Fatigue life, Grain size, Solders
Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

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Yuji Nishimura, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
https://doi.org/10.1115/IPACK2011-52105
View Paper titled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
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Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing
Proceedings Papers

Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices

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Shinji Hiramitsu, Hiroshi Shintani, Takahiro Satake, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 345-350, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52247
https://doi.org/10.1115/IPACK2011-52247
View Paper titled, Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices
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Topics: Fatigue cracks, Heat, Solders, Crack propagation, Fatigue testing, Fracture (Materials), Boundary-value problems, Heat transfer, Reliability, Thermal stresses
Proceedings Papers

Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films

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Vu Le Huy, Joao Gaspar, Oliver Paul, Shoji Kamiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 409-415, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52250
https://doi.org/10.1115/IPACK2011-52250
View Paper titled, Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films
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Topics: Fatigue, Polysilicon, Thin films, Fracture (Materials), Fracture (Process), Shapes, Fatigue testing, Stress, Stress concentration, Weibull distribution
Proceedings Papers

Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection

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Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 353-359, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89079
https://doi.org/10.1115/InterPACK2009-89079
View Paper titled, Micro Texture Dependence of Mechanical Properties of Electroplated Copper Thin Films Used for Thin Film Interconnection
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Topics: Copper, Mechanical properties, Texture (Materials), Thin films, Fracture (Materials), Fatigue strength, Grain boundaries, Brittle fracture, Ductile fracture, Fatigue testing
Proceedings Papers

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

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Claire Ryan, Bryan A. Rodgers, Jeff M. Punch
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1223-1228, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73318
https://doi.org/10.1115/IPACK2005-73318
View Paper titled, SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method
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Topics: Ball-Grid-Array packaging, Fatigue testing, Solder joints, Torsion, Cycles, Failure, Solders, Chain, Copper, Electronic equipment
Proceedings Papers

Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint

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Doseop Kim, Qiang Yu, Yusuke Kobayashi, Tadahiro Shibutani
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1643-1648, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73136
https://doi.org/10.1115/IPACK2005-73136
View Paper titled, Effect of Voids on Thermal Fatigue Reliability of Lead Free Solder Joint
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Topics: Fatigue, Fatigue strength, Fatigue testing, Finite element methods, Lead-free solders, Reliability, Solder joints, Shear (Mechanics), Tin, Crack propagation
Proceedings Papers

A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures

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Hisashi Tanie, Takeshi Terasaki, Yasuhiro Naka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1229-1235, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73331
https://doi.org/10.1115/IPACK2005-73331
View Paper titled, A New Method for Evaluating Fatigue Life of Micro-Solder Joints in Semiconductor Structures
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Topics: Fatigue life, Semiconductors (Materials), Solders, Crack propagation, Fracture (Materials), Ball-Grid-Array packaging, Solder joints, Surface mount devices, Diluents, Damage
Proceedings Papers

Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications

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Kazuki Takashima, Timothy P. Halford, Yakichi Higo
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1679-1683, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73038
https://doi.org/10.1115/IPACK2005-73038
View Paper titled, Fracture and Fatigue Testing of Micro-Sized Materials for MEMS Applications
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Topics: Fatigue testing, Fracture (Materials), Microelectromechanical systems, Fatigue cracks, Alloys, Fatigue, Fatigue life, Fracture mechanics, Fracture toughness, Machinery
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

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Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73134
https://doi.org/10.1115/IPACK2005-73134
View Paper titled, Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
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Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods
Proceedings Papers

Fatigue Test of Al-3%Ti Using Axial Loading Testing Machine for MEMS Materials

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Jun-Hyub Park, Hyeon Chang Choi, Chang Seung Lee, Sung-Hoon Choa, Man Sik Myung, Yun-Jae Kim
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1725-1730, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73195
https://doi.org/10.1115/IPACK2005-73195
View Paper titled, Fatigue Test of Al-3%Ti Using Axial Loading Testing Machine for MEMS Materials
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Topics: Fatigue testing, Machinery, Microelectromechanical systems, Testing, Fatigue strength, High cycle fatigue, Thin films, Switches, Tensile strength
Proceedings Papers

Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint

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Do-Seop Kim, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 837-843, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35250
https://doi.org/10.1115/IPACK2003-35250
View Paper titled, Nonlinear Behavior Study on Effect of Hardening Rule of Lead Free Solder Joint
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Topics: Hardening, Lead-free solders, Finite element methods, Stress, Fatigue testing, Kinematics, Solder joints, Solders, Tin, Work hardening
Proceedings Papers

COTS BGA Thermal Fatigue Test for Avionics Applications

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H. S. Fenger, T. E. Wong
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 693-699, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35017
https://doi.org/10.1115/IPACK2003-35017
View Paper titled, COTS BGA Thermal Fatigue Test for Avionics Applications
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Topics: Avionics, Ball-Grid-Array packaging, Fatigue testing, Solder joints, Temperature
Proceedings Papers

Vibration Fatigue Test of Surface Mount Electronic Components

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T. E. Wong, H. S. Fenger
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 287-293, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35031
https://doi.org/10.1115/IPACK2003-35031
View Paper titled, Vibration Fatigue Test of Surface Mount Electronic Components
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Topics: Ball-Grid-Array packaging, Electronic components, Fatigue testing, Solder joints, Surface mount packaging, Vibration