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Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

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Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil

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Takuya Nagayama, Hiroaki Yoshida, Ikuo Shohji
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A012, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73172
https://doi.org/10.1115/IPACK2013-73172
View Paper titled, Effect of Additives in an Electrolyte on Mechanical Properties of Electrolytic Copper Foil
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Topics: Copper foil, Electrolytes, Mechanical properties, Copper, Elastic moduli, Fatigue properties, Grain size, Proteins, Tensile strength
Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

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Yuji Nishimura, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
https://doi.org/10.1115/IPACK2011-52105
View Paper titled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
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Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing
Proceedings Papers

SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method

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Claire Ryan, Bryan A. Rodgers, Jeff M. Punch
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1223-1228, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73318
https://doi.org/10.1115/IPACK2005-73318
View Paper titled, SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method
Open the PDF for SnAgCu Micro-Ball Grid Array (BGA) Solder Joint Evaluation Using a Torsion Mechanical Fatigue Test Method in another window
Topics: Ball-Grid-Array packaging, Fatigue testing, Solder joints, Torsion, Cycles, Failure, Solders, Chain, Copper, Electronic equipment