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Proceedings Papers

Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration

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Nozomi Shimamura, Qiang Yu
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140880
https://doi.org/10.1115/IPACK2024-140880
View Paper titled, Effects of Package Position and Constraint Conditions on Fatigue Life of QFP Interconnect Structure Under Random Vibration
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Topics: Fatigue life, Finite element methods, Random vibration
Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

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Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

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Ibaad Gandikota, Aniket Bharamgonda, Abhijit Dasgupta, Patrick McCluskey
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141249
https://doi.org/10.1115/IPACK2024-141249
View Paper titled, Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages
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Topics: Event history analysis, Fatigue, Gallium nitride, Solders, Failure, Creep, Delamination, Failure mechanisms, Fatigue life, Finite element analysis
Proceedings Papers

Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints

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Souvik Chakraborty, Debabrata Mondal, Golam Rakib Mazumder, Mahbub Alam Maruf, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112041
https://doi.org/10.1115/IPACK2023-112041
View Paper titled, Comparative Finite Element Analyses of the Thermal Cycling Performances of BGA Packages With SAC, LTS, and Mixed SAC-LTS Solder Joints
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Fatigue life, Finishes, Finite element analysis, Reliability, Solder joints
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

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Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
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Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

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Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97253
https://doi.org/10.1115/IPACK2022-97253
View Paper titled, A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Surface mount devices
Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

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Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2644
https://doi.org/10.1115/IPACK2020-2644
View Paper titled, Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

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Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6584
https://doi.org/10.1115/IPACK2019-6584
View Paper titled, Folding-Reliability of Flexible Electronics in Wearable Applications
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties

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Promod R. Chowdhury, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
https://doi.org/10.1115/IPACK2019-6561
View Paper titled, Modeling of Underfilled PBGA Assemblies Using Both Viscoelastic and Elastic Material Properties
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Topics: Fatigue life, Finite element analysis, Materials properties, Modeling, Stress, Viscoelasticity, Temperature, Polymers, Simulation, Relaxation (Physics)
Proceedings Papers

Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs

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Kourosh M. Kalayeh, Natalie Hernandez, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6347
https://doi.org/10.1115/IPACK2019-6347
View Paper titled, Automated Method Using Finite Element Analysis to Identify Plated Through Holes and Microvia Stacks at Failure Risk in Complex PCB Designs
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Topics: Failure, Finite element analysis, Risk, Reliability, Engineering simulation, Finite element methods, Finite element model, Simulation, Algorithms, Circuits
Proceedings Papers

Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads

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Travis Dale, Yuvraj Singh, Ian Bernander, Ganesh Subbarayan, Carol Handwerker, Peng Su, Bernard Glasauer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6507
https://doi.org/10.1115/IPACK2019-6507
View Paper titled, Fatigue Life of Sn3.0Ag0.5Cu Solder Alloys Under Combined Shear and Compressive Loads
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Topics: Alloys, Fatigue life, Shear (Mechanics), Solders, Stress, Solder joints, Fatigue, Bending (Stress), Compression, Cycles
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

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Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

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Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74249
https://doi.org/10.1115/IPACK2017-74249
View Paper titled, Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

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David Huitink
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74245
https://doi.org/10.1115/IPACK2017-74245
View Paper titled, Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries
Proceedings Papers

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

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Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48136
https://doi.org/10.1115/IPACK2015-48136
View Paper titled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
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Topics: Lead-free solders, Low cycle fatigue, Stress, Simulation, Design engineering, Fatigue cracks, Fatigue life, Fatigue testing, Shapes, Solder joints
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

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Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
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Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

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Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
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Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

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Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

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Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73062
https://doi.org/10.1115/IPACK2013-73062
View Paper titled, Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs
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Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy

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Takuma Sato, Yoshiharu Kariya, Kazuma Fukui
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73193
https://doi.org/10.1115/IPACK2013-73193
View Paper titled, Effect of Temperature and Strain Rate on Low-Cycle Fatigue Life of Bi-Sn Eutectic Alloy
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Topics: Eutectic alloys, Low cycle fatigue, Temperature, Tin, Fatigue life, Deformation, Ductility, Fatigue, Metals, Temperature effects