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Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy

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Yiran Li, Yuvraj Singh, Ganesh Subbarayan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74201
https://doi.org/10.1115/IPACK2017-74201
View Paper titled, Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy
Open the PDF for Effect of Static and Dynamic Aging on Fatigue Behavior of Sn3.0Ag0.5Cu Solder Alloy in another window
Topics: Alloys, Fatigue, Solders, Damage, Tin, Creep, Constitutive equations, Energy dissipation, Entropy, Fatigue damage
Proceedings Papers

A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material

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Hirokazu Oriyama, Takashi Kawakami, Takahiro Kinoshita
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48138
https://doi.org/10.1115/IPACK2015-48138
View Paper titled, A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material
Open the PDF for A Basic Study on Creep-Fatigue Damages Interaction for Sn-3.0Ag-0.5Cu as Lead Free Solder Material in another window
Topics: Creep, Damage, Fatigue, Lead-free solders, Tin, Solder joints, Electronics, Design engineering, Fatigue damage, Stress
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

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Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
Open the PDF for Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation in another window
Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

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Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

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Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73161
https://doi.org/10.1115/IPACK2013-73161
View Paper titled, Large-Scale Damage Path Simulation for Solder Joints in a BGA Package
Open the PDF for Large-Scale Damage Path Simulation for Solder Joints in a BGA Package in another window
Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

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Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52112
https://doi.org/10.1115/IPACK2011-52112
View Paper titled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
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Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

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Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89262
https://doi.org/10.1115/InterPACK2009-89262
View Paper titled, Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints
Open the PDF for Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders
Proceedings Papers

PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics

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Pradeep Lall, Aniket Shirgaokar, Dineshkumar Arunachalam, Jeff Suhling, Mark Strickland, Jim Blanche
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 159-170, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89329
https://doi.org/10.1115/InterPACK2009-89329
View Paper titled, PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics
Open the PDF for PCR for Derivation of Parameter Dependencies, Thermo-Mechanical Norris-Landzberg Acceleration Factors, Goldmann Fatigue Constants for Leadfree Electronics in another window
Topics: Electronics, Fatigue, Thermomechanics, Temperature, Ball-Grid-Array packages, Cycles, Reliability, Alloys, Architecture, Copper
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

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Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33170
https://doi.org/10.1115/IPACK2007-33170
View Paper titled, Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects in another window
Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography
Proceedings Papers

An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature

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Takehiko Takahashi, Susumu Hioki, Ikuo Shohji, Osamu Kamiya
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1811-1817, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73152
https://doi.org/10.1115/IPACK2005-73152
View Paper titled, An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature
Open the PDF for An Evaluation of Fatigue Damage in Low-Cycle Range for Sn-3.5Ag, Sn-0.7Cu Lead-Free Solders and Sn-Pb Eutectic Solder Using Image Processing to Surface Feature in another window
Topics: Cycles, Fatigue damage, Image processing, Lead-free solders, Solders, Tin, Low cycle fatigue, Fatigue life, Surface deformation, Fatigue
Proceedings Papers

Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G rms )

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Ivan Straznicky
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 763-766, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35056
https://doi.org/10.1115/IPACK2003-35056
View Paper titled, Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G rms )
Open the PDF for Comparing Random Vibration Inputs: Power Spectral Density (PSD) Versus Root Mean-Square Acceleration (G rms ) in another window
Topics: Random vibration, Spectral energy distribution, Damage, Circuits, Defense industry, Electronics, Fatigue damage, Manufacturing, Vehicles, Vibration