1-20 of 26
Fatigue cracks
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure

Pradeep Lall, Yunli Zhang
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
https://doi.org/10.1115/IPACK2023-112070
View Paper titled, Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure
Open the PDF for Effect of Surface Treatment on the Fatigue Crack Propagation in a TIM/Copper Interface Subjected to High-Temperature Long-Term Exposure in another window
Topics: Copper, Delamination, Fatigue, Fatigue cracks, Fracture (Materials), Fracture toughness, High temperature, Stress, Surface finishing, Low cycle fatigue
Proceedings Papers

Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging

Pradeep Lall, Yunli Zhang, Jeff Suhling, Jaimal Williamson, Pat Thompson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97453
https://doi.org/10.1115/IPACK2022-97453
View Paper titled, Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging
Open the PDF for Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging in another window
Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fatigue cracks, High temperature, Molding, Reliability
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
Open the PDF for Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions in another window
Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74279
https://doi.org/10.1115/IPACK2017-74279
View Paper titled, Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading
Open the PDF for Reliability Analysis of Ultra-Low-K Large-Die Package and Wire Bond Chip Package on Varying Structural Parameter Under Thermal Loading in another window
Topics: Event history analysis, Wire, Reliability, Failure, Solders, Copper, Dielectric materials, Manufacturing, Microelectronic devices, Solder joints
Proceedings Papers

In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Junya Ooi, Takao Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74177
https://doi.org/10.1115/IPACK2017-74177
View Paper titled, In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading
Open the PDF for In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading in another window
Topics: Fatigue cracks, Synchrotron radiation, X-rays, Solders, Fracture (Materials), Nondestructive evaluation, Ceramics, Crack propagation, Cycles, Delamination
Proceedings Papers

Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Masato Hoshino, Kentaro Uesugi, Takuya Hanamura, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48553
https://doi.org/10.1115/IPACK2015-48553
View Paper titled, Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
Open the PDF for Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography in another window
Topics: Fatigue cracks, Solder joints, Synchrotron radiation, X-rays, Solders, Crack propagation, Fracture (Materials), Microcracks, Ball-Grid-Array packaging, Ceramics
Proceedings Papers

Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures

Toshihiko Sayama, Hiroyuki Tsuritani, Yoshiyuki Okamoto, Masayoshi Kinoshita, Takao Mori
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A025, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48605
https://doi.org/10.1115/IPACK2015-48605
View Paper titled, Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures
Open the PDF for Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints Using a Lap-Joint Shear Specimen With High Stiffness Fixtures in another window
Topics: Fatigue cracks, Shear (Mechanics), Solder joints, Stiffness, Cycles, Fatigue testing, Fracture (Materials), Stress, Copper, Corners (Structural elements)
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
Open the PDF for A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface in another window
Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life

Takashi Kawakami, Takahiro Kinoshita, Hirokazu Oriyama
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48136
https://doi.org/10.1115/IPACK2015-48136
View Paper titled, A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life
Open the PDF for A Study on Strain Concentration Around V Notch in Lead Free Solder Material and the Low Cycle Fatigue Life in another window
Topics: Lead-free solders, Low cycle fatigue, Stress, Simulation, Design engineering, Fatigue cracks, Fatigue life, Fatigue testing, Shapes, Solder joints
Proceedings Papers

Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Masato Hoshino, Takao Mori
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A001, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73091
https://doi.org/10.1115/IPACK2013-73091
View Paper titled, Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints
Open the PDF for Application of Synchrotron Radiation X-Ray Laminography to Nondestructive Evaluation of the Fatigue Crack Propagation Process in Flip Chip Solder Joints in another window
Topics: Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Fracture (Materials), Microcracks, Solders
Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73192
https://doi.org/10.1115/IPACK2013-73192
View Paper titled, Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
Open the PDF for Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint in another window
Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction
Proceedings Papers

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

Takahiro Akutsu, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 691-700, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52070
https://doi.org/10.1115/IPACK2011-52070
View Paper titled, Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints
Open the PDF for Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints in another window
Topics: Fatigue, Lead-free solders, Fatigue cracks, Crystals, Finite element methods, Finite element model, Solder joints, Fatigue life, Grain size, Solders
Proceedings Papers

Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 443-451, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52047
https://doi.org/10.1115/IPACK2011-52047
View Paper titled, Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Three Dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-Shaped Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, X-rays, Crack propagation, Fatigue, Fracture (Materials), Microcracks, Computerized tomography
Proceedings Papers

Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties

Yuji Nishimura, Qiang Yu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 191-194, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52105
https://doi.org/10.1115/IPACK2011-52105
View Paper titled, Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties
Open the PDF for Reliability Evaluation of Fatigue Life for Solder Joints in Chip Components Considering Dispersion of the Shape and the Properties in another window
Topics: Fatigue life, Reliability, Shapes, Solder joints, Fibers, Electronics, Fatigue, Fatigue cracks, Fatigue properties, Fatigue testing
Proceedings Papers

Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices

Shinji Hiramitsu, Hiroshi Shintani, Takahiro Satake, Hisashi Tanie
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 345-350, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52247
https://doi.org/10.1115/IPACK2011-52247
View Paper titled, Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices
Open the PDF for Effect of Heat Generation on Fatigue-Crack Propagation of Solder in Power Devices in another window
Topics: Fatigue cracks, Heat, Solders, Crack propagation, Fatigue testing, Fracture (Materials), Boundary-value problems, Heat transfer, Reliability, Thermal stresses
Proceedings Papers

Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test

Y. Sing Chan, F. B. Song, S. W. Ricky Lee, C. R. Yang, Jeffery C. C. Lo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 579-583, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52219
https://doi.org/10.1115/IPACK2011-52219
View Paper titled, Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test
Open the PDF for Comparison of Fatigue Crack Initiation/Propagation and Daisy-Chain Resistance in Lead-Free Solder Joints Under Temperature Cycling Test in another window
Topics: Chain, Fatigue cracks, Lead-free solders, Temperature, Solder joints, Electrical resistance, Failure, Fatigue, Fatigue failure, Fracture (Materials)
Proceedings Papers

Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 761-769, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89155
https://doi.org/10.1115/InterPACK2009-89155
View Paper titled, Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography
Open the PDF for Nondestructive Evaluation of Thermal Fatigue Crack Propagation in Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-Ray Micro-Tomography in another window
Topics: Fatigue cracks, Nondestructive evaluation, Solder joints, Synchrotron radiation, Tin, X-rays, Solders, Crack propagation, Cycles, Computerized tomography
Proceedings Papers

Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints

Yoshiyuki Okamoto, Takeshi Takayanagi, Toshihiko Sayama, Yasuhiro Ejiri, Hiroyuki Nakano, Takao Mori
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 809-814, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89262
https://doi.org/10.1115/InterPACK2009-89262
View Paper titled, Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints
Open the PDF for Application of Phase Growth Approach to Prediction of Thermal Fatigue Crack Initiation Lifetime in Sn-3.0Ag-0.5Cu Solder Joints in another window
Topics: Fatigue cracks, Solder joints, Tin, Cycles, Fatigue damage, Fracture (Materials), Printed circuit boards, Resistors, Scanning electron microscopes, Solders
Proceedings Papers

Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature

Hiroyuki Nakano, Yasuhiro Ejiri, Takao Mori, Toshihiko Sayama, Takeshi Takayanagi, Yoshiyuki Okamoto
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 833-839, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89275
https://doi.org/10.1115/InterPACK2009-89275
View Paper titled, Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature
Open the PDF for Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints Under Mechanical Cyclic Loading at the Same Temperature in another window
Topics: Solder joints, Temperature, Tin, Creep, Fatigue cracks, Corners (Structural elements), Cycles, Finite element analysis, Finite element methods, Fracture (Materials)
Proceedings Papers

Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takso Mori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 523-529, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33170
https://doi.org/10.1115/IPACK2007-33170
View Paper titled, Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Micro-Tomography to Nondestructive Evaluation of Thermal Fatigue Damage in Flip Chip Interconnects in another window
Topics: Fatigue damage, Flip-chip, Flip-chip devices, Nondestructive evaluation, Synchrotron radiation, X-rays, Solders, Cycles, Fatigue cracks, Computerized tomography