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Proceedings Papers

Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages

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Ibaad Gandikota, Aniket Bharamgonda, Abhijit Dasgupta, Patrick McCluskey
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A016, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141249
https://doi.org/10.1115/IPACK2024-141249
View Paper titled, Reliability Analysis of SAC Solder Under Thermal Fatigue for Encapsulated GaN Packages
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Topics: Event history analysis, Fatigue, Gallium nitride, Solders, Failure, Creep, Delamination, Failure mechanisms, Fatigue life, Finite element analysis
Proceedings Papers

Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q

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Bart Vandevelde, Chinmay Nawghane, Riet Labie, Ralph Lauwaert, Daniel Werkhoven
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73456
https://doi.org/10.1115/IPACK2021-73456
View Paper titled, Enhanced Processability and Thermal Fatigue Reliability With Low Melting Point SnBi Solder Alloy LMPA-Q
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Topics: Alloys, Fatigue, Melting point, Reliability, Solders, Temperature, Ball-Grid-Array packaging, Contamination, Failure, Failure analysis
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

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Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Open the PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter in another window
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices

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Alex Davila-Frias, Val Marinov, Om Prakash Yadav, Yuriy Atanasov
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2525
https://doi.org/10.1115/IPACK2020-2525
View Paper titled, Design of Accelerated Degradation Test Method and Failure Analysis of Flexible Hybrid Electronic Devices
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Topics: Design, Electronics, Failure analysis, Temperature, Stress, Failure, Testing, Accelerated life testing, Chain, Failure data
Proceedings Papers

Folding-Reliability of Flexible Electronics in Wearable Applications

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Pradeep Lall, Hyesoo Jang, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6584
https://doi.org/10.1115/IPACK2019-6584
View Paper titled, Folding-Reliability of Flexible Electronics in Wearable Applications
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Topics: Fatigue life, Flexible electronics, Reliability, Electronics, Stress, Failure mechanisms, Experimental analysis, Failure analysis, Robustness, Skin
Proceedings Papers

Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices

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Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Dag Andersson, Zsolt Toth-Pal, Mattias Forslund, Samer Shisha
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A016, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8385
https://doi.org/10.1115/IPACK2018-8385
View Paper titled, Failure Mechanism Assessment of TO-247 Packaged SiC Power Devices
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Topics: Failure mechanisms, Electronics, Reliability, Acoustics, Automotive industry, Cooling, Elastic moduli, Failure analysis, Heating, High temperature
Proceedings Papers

Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers

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Sami Alkharabsheh, Udaya L. N. Puvvadi, Bharath Ramakrishnan, Kanad Ghose, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8443
https://doi.org/10.1115/IPACK2018-8443
View Paper titled, Facility Cooling Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling, Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Heat
Proceedings Papers

Failure Analysis of Direct Liquid Cooling System in Data Centers

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Sami Alkharabsheh, Bharath Ramakrishnan, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74174
https://doi.org/10.1115/IPACK2017-74174
View Paper titled, Failure Analysis of Direct Liquid Cooling System in Data Centers
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Topics: Cooling systems, Data centers, Failure analysis, Failure, Temperature, Coolants, Cooling, Fans, High temperature, Leakage
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

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Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling

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Uschas Chowdhury, Manasa Sahini, Ashwin Siddarth, Dereje Agonafer, Steve Branton
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74028
https://doi.org/10.1115/IPACK2017-74028
View Paper titled, Characterization of an Isolated Hybrid Cooled Server With Failure Scenarios Using Warm Water Cooling
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Topics: Cooling, Failure, Water, Energy consumption, Fans, Pumps, Data centers, Density, Heat, Redundancy (Engineering)
Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

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Pradeep Lall, Amrit Abrol, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74252
https://doi.org/10.1115/IPACK2017-74252
View Paper titled, Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone
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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms
Proceedings Papers

Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs

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Pradeep Lall, Shantanu Deshpande, Luu Nguyen
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48638
https://doi.org/10.1115/IPACK2015-48638
View Paper titled, Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded With Different EMCs
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Topics: Aluminum, Copper, Wire, Temperature, Chemistry, Compression, Failure analysis, Image processing, Metals, Molding
Proceedings Papers

Transient Liquid Phase Sintered Joints for Power Electronic Modules

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Hannes Greve, F. Patrick McCluskey
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A004, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73209
https://doi.org/10.1115/IPACK2013-73209
View Paper titled, Transient Liquid Phase Sintered Joints for Power Electronic Modules
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Topics: Transients (Dynamics), Melting point, Metals, Shear strength, Sinter (Metallurgy), Temperature, Copper, Shear (Mechanics), Tension-leg platforms, Binders (Materials)
Proceedings Papers

A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance

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Kazuaki Yazawa, Dustin Kendig, James Christofferson, Ali Shakouri
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A023, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73104
https://doi.org/10.1115/IPACK2013-73104
View Paper titled, A Method for Failure Analysis for Devices With Simultaneous Imaging of Electron Emission and Near IR Thermoreflectance
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Topics: Electron emission, Failure analysis, Imaging, Thermoreflectance, Circuits, Emissions, Failure, Electrons, Silicon, Temperature
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

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Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73278
https://doi.org/10.1115/IPACK2013-73278
View Paper titled, Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Proceedings Papers

Effects of TSV Interposer on the Reliability of 3D IC Integration SiP

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John H. Lau, Xiaowu Zhang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 65-73, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52205
https://doi.org/10.1115/IPACK2011-52205
View Paper titled, Effects of TSV Interposer on the Reliability of 3D IC Integration SiP
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Topics: Reliability, Corners (Structural elements), Creep, Cycles, Density, Failure analysis, Silicon, Solder joints, Stress, System-in-package
Proceedings Papers

Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling

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Da Yu, Tung Nguyen, Ho H. Lee, Namseo Goo, S. B. Park
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 603-608, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52232
https://doi.org/10.1115/IPACK2011-52232
View Paper titled, Effect of Compressive Loading on the Interconnect Reliability Under Thermal Cycling
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Topics: Reliability, Heat, Heat sinks, Power density, Solder joints, Circuits, Computer simulation, Cycles, Energy dissipation, Experimental methods
Proceedings Papers

Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes

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G. Srinivasan, R. Murcko, K. Srihari
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 283-292, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89241
https://doi.org/10.1115/InterPACK2009-89241
View Paper titled, Evaluation of Secondary Wire Bond Integrity on Ag Plated and Ni/Pd Based Lead Frame Plating Finishes
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Topics: Finishes, Plating, Wire, Nickel, Palladium, Silver, Failure analysis, High temperature, Manufacturing, Reliability
Proceedings Papers

Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages

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Salil Pradhan, Francois Billaut, Sunil Gopakumar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 321-328, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89405
https://doi.org/10.1115/InterPACK2009-89405
View Paper titled, Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
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Topics: Manufacturing, Reliability, Lumber, Pins (Engineering), Ball-Grid-Array packaging, Construction, Cross section (Physics), Design, Experimental design, Failure analysis
Proceedings Papers

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

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Kayleen L. E. Helms, Ketan R. Shah, Dan Gerbus, Vasu S. Vasudevan, Jagadeesh Radhakrishnan, Will Berry
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 945-951, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89347
https://doi.org/10.1115/InterPACK2009-89347
View Paper titled, The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading
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Topics: Ball-Grid-Array packaging, Damage, Electronic packages, Flip-chip, Shock (Mechanics), Design, Risk, Solder joints, Accelerated life testing, Alloys