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Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
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Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2542
https://doi.org/10.1115/IPACK2020-2542
View Paper titled, Ultra-Compact Micro-Scale Heat Exchanger for Advanced Thermal Management in Datacenters
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Topics: Heat exchangers, Microscale devices, Thermal management, Cooling, Heat, Pressure drop, Density, Flow (Dynamics), Heat transfer, Refrigerants
Proceedings Papers

Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)

Peter deBock, Rinaldo Miorini, Cathleen Hoel, Darin Sharar, Bryan Whalen
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2606
https://doi.org/10.1115/IPACK2020-2606
View Paper titled, Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO)
Open the PDF for Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO) in another window
Topics: Electronics, Experimental characterization, Heat transfer, Swirling flow, Thermal energy storage, Transients (Dynamics), Two-phase flow
Proceedings Papers

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A068, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48316
https://doi.org/10.1115/IPACK2015-48316
View Paper titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages
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Topics: Experimental characterization, Heat transfer, Complementary metal oxide semiconductors, Cooling, Epoxy adhesives, Epoxy resins, Heating, Thermal conductivity, Thermal properties, Thermal resistance
Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48377
https://doi.org/10.1115/IPACK2015-48377
View Paper titled, Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers
Proceedings Papers

Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems

Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48375
https://doi.org/10.1115/IPACK2015-48375
View Paper titled, Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Flow (Dynamics), Temperature, Circuits, Cooling
Proceedings Papers

Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning

Promod R. Chowdhury, Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48622
https://doi.org/10.1115/IPACK2015-48622
View Paper titled, Experimental Characterization of Underfill Materials Exposed to Moisture Including Preconditioning
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Topics: Creep, Elastic moduli, Experimental characterization, Flip-chip assemblies, Hardening (Curing), Machinery, Materials properties, Mechanical properties, Microscale devices, Production equipment
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52207
https://doi.org/10.1115/IPACK2011-52207
View Paper titled, Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 749-761, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52209
https://doi.org/10.1115/IPACK2011-52209
View Paper titled, Experimental Characterization and Viscoplastic Modeling of the Temperature Dependent Material Behavior of Underfill Encapsulants
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Topics: Creep, Experimental characterization, Modeling, Temperature, Stress, Testing, Tension, Constitutive equations, Engineering simulation, Finite element analysis
Proceedings Papers

An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History

John Brueckner, Rainer Dudek, Sven Rzepka, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 139-145, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89270
https://doi.org/10.1115/InterPACK2009-89270
View Paper titled, An Integrated Experimental and Theoretical Approach to Evaluate Si Strength Dependent on the Processing History
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Topics: Anisotropy, Brittleness, Ceramics, Damage, Experimental characterization, Failure, Finite element analysis, Fracture (Process), Grinding, Grinding wheels
Proceedings Papers

Experimental Characterization of Bonded Microcoolers for Hot Spot Removal

Yan Zhang, Gehong Zeng, Christine Hoffman, Ali Shakouri, Peng Wang, Avram Bar-Cohen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2189-2197, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73466
https://doi.org/10.1115/IPACK2005-73466
View Paper titled, Experimental Characterization of Bonded Microcoolers for Hot Spot Removal
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Topics: Experimental characterization, Microcoolers, Cooling, Coolers, Flow (Dynamics), Heat, Heat flux, Integrated circuits, Microelectronic devices, Power density
Proceedings Papers

Analytical and Experimental Characterization of Bonding Over Active Circuitry

Li Zhang, Vijaylaxmi Gumaste, Anindya Poddar, Luu Nguyen, Gary Schulze
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 983-991, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73328
https://doi.org/10.1115/IPACK2005-73328
View Paper titled, Analytical and Experimental Characterization of Bonding Over Active Circuitry
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Topics: Bonding, Experimental characterization, Stress, Fracture (Materials), Wire bonding, Aluminum, Computer simulation, Cracking (Materials), Damage, Design