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Proceedings Papers

Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System

Manasa Sahini, Chinmay Kshirsagar, Patrick McGinn, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8255
https://doi.org/10.1115/IPACK2018-8255
View Paper titled, Rack-Level Study of Hybrid Cooled Servers Using Warm Water Cooling With Variable Pumping for Centralized Coolant System
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Topics: Coolants, Cooling, Water, Data centers, Pumps, Stress, Temperature, Energy consumption, Heat exchangers, Exhaust systems
Proceedings Papers

Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8422
https://doi.org/10.1115/IPACK2018-8422
View Paper titled, Impact of Internal Design on the Efficiency of IT Equipment in a Hot Aisle Containment System: An Experimental Study
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Topics: Containment systems, Design, Air flow, Containment, Cooling, Fans, Leakage, Sensors, Control equipment, Data centers
Proceedings Papers

Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems

Manasa Sahini, Dereje Agonafer, Vijayalan Pandiyan
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74016
https://doi.org/10.1115/IPACK2017-74016
View Paper titled, Thermal Performance Evaluation of Three Types of Novel End-of-Aisle Cooling Systems
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Topics: Computational fluid dynamics, Containment, Cooling, Cooling systems, Data centers, Design, Exhaust systems, Fans, Flow (Dynamics), Hardware
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48466
https://doi.org/10.1115/IPACK2015-48466
View Paper titled, Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Thermal Modeling of Remote Radio Head Units

Manasa Sahini, Betsegaw Gebrehiwot, Dereje Agonafer, Rocky Colapietro
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A087, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48606
https://doi.org/10.1115/IPACK2015-48606
View Paper titled, Thermal Modeling of Remote Radio Head Units
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Topics: Modeling, Air flow, Temperature, Computational fluid dynamics, Cooling, Natural convection, Boundary-value problems, Design, Exhaust systems, Heat
Proceedings Papers

Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers

Dale C. Ringham, Dan J. Rice, Brian S. Granetz, Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A022, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73268
https://doi.org/10.1115/IPACK2013-73268
View Paper titled, Assessment of the Energy Performance of Cogeneration Systems for Powering and Cooling Data Centers
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Topics: Cogeneration systems, Cooling, Data centers, Electricity (Physics), Exhaust systems, Turbines, Absorption, Combined heat and power, Heat, Heat exchangers
Proceedings Papers

Impact of Cold Aisle Containment on Thermal Performance of Data Center

Bharathkrishnan Muralidharan, Saurabh K. Shrivastava, Mahmoud Ibrahim, Sami A. Alkharabsheh, Bahgat G. Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A016, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73201
https://doi.org/10.1115/IPACK2013-73201
View Paper titled, Impact of Cold Aisle Containment on Thermal Performance of Data Center
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Topics: Containment, Data centers, Cooling, Heat, Separation (Technology), Stress, Air conditioners, Computers, Containment systems, Density
Proceedings Papers

Energy Modeling of Air-Cooled Data Centers: Part I—The Optimization of Enclosed Aisle Configurations

Dustin W. Demetriou, H. Ezzat Khalifa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 385-394, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52003
https://doi.org/10.1115/IPACK2011-52003
View Paper titled, Energy Modeling of Air-Cooled Data Centers: Part I—The Optimization of Enclosed Aisle Configurations
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Topics: Data centers, Modeling, Optimization, Temperature, Energy consumption, Cooling, Flow (Dynamics), Air conditioners, Computers, Containment
Proceedings Papers

Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure

Mahmoud Ibrahim, Bahgat Sammakia, Siddharth Bhopte, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52166
https://doi.org/10.1115/IPACK2011-52166
View Paper titled, Numerical Study on the Reduction of Recirculation Using Sealed Cold Aisles and its Effect on the Efficiency of the Cooling Infrastructure
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Topics: Cooling, Electronic equipment, Temperature, Ceilings, Data centers, Energy dissipation, Heat, Sealing (Process), Air conditioning, Air flow
Proceedings Papers

Liquid Cooling Network Systems for Energy Conservation in Data Centers

Mayumi Ouchi, Yoshiyuki Abe, Masato Fukagaya, Haruhiko Ohta, Yasuhisa Shinmoto, Masahide Sato, Ken-ichi Iimura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 443-449, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52066
https://doi.org/10.1115/IPACK2011-52066
View Paper titled, Liquid Cooling Network Systems for Energy Conservation in Data Centers
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Topics: Cooling, Data centers, Energy conservation, Heat exchangers, Cooling systems, Heat, Flat heat pipes, Server racks, Air conditioning, Condensation
Proceedings Papers

Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate

Thong Dang, Carine Serreli, H. Ezzat Khalifa, Roger R. Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 451-459, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52067
https://doi.org/10.1115/IPACK2011-52067
View Paper titled, Reduced Rack Exhaust Temperature Gradient via Variable Chassis Flow Rate
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Topics: Exhaust systems, Flow (Dynamics), Temperature gradient, Temperature, Algorithms, Computational fluid dynamics, Data centers, Engineering simulation, Heat, Simulation
Proceedings Papers

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 841-850, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89203
https://doi.org/10.1115/InterPACK2009-89203
View Paper titled, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
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Topics: Data centers, Doors, Optimization, Roofs, Temperature, Air flow, Ceilings, Heat, Computers, Coolers
Proceedings Papers

Effective Thermal Management of Data Centers Using Efficient Cabinet Designs

Veerendra Mulay, Dereje Agonafer, Gary Irwin, Darshan Patell
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 993-999, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89351
https://doi.org/10.1115/InterPACK2009-89351
View Paper titled, Effective Thermal Management of Data Centers Using Efficient Cabinet Designs
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Topics: Data centers, Thermal management, Energy consumption, Design, Combined heat and power, Cooling, Environmental Protection Agency, Exhaust systems, Heat, Stress
Proceedings Papers

A Novel Airflow Management System With Redundant Fan Field Replaceable Units

Younes Shabany
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 147-154, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33886
https://doi.org/10.1115/IPACK2007-33886
View Paper titled, A Novel Airflow Management System With Redundant Fan Field Replaceable Units
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Topics: Air flow, Fans, Cooling, Computational fluid dynamics, Engineering simulation, Exhaust systems, Simulation
Proceedings Papers

Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell

Madhusudan Iyengar, Roger R. Schmidt, Hendrik Hamann, Jim VanGilder
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 819-826, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33508
https://doi.org/10.1115/IPACK2007-33508
View Paper titled, Comparison Between Numerical and Experimental Temperature Distributions in a Small Data Center Test Cell
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Topics: Data centers, Temperature distribution, Errors, Server racks, Temperature, Air conditioning, Computer simulation, Exhaust systems, Flow (Dynamics), Modeling
Proceedings Papers

High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler

Velimir Jovanovic, Saeid Ghamaty, Daniel Krommenhoek, John C. Bass
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 595-601, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33838
https://doi.org/10.1115/IPACK2007-33838
View Paper titled, High Coefficient of Performance Quantum Well Thermoelectric Nano Cooler
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Topics: Quantum wells, Cooling, Sensors, Temperature, National Institute of Standards and Technology, Thin films, Air conditioning, Compression, Compressors, Cooling systems
Proceedings Papers

Mathematical Optimization of Electronic Enclosures

D. J. De Kock, M. Nagulapally, J. A. Visser, R. Nair, J. Nigen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 253-258, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73185
https://doi.org/10.1115/IPACK2005-73185
View Paper titled, Mathematical Optimization of Electronic Enclosures
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Topics: Optimization, Design, Computational fluid dynamics, Flow (Dynamics), Lumber, Temperature, Filters, Design methodology, Electronic components, Fans
Proceedings Papers

Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced

Roger Schmidt, Ethan Cruz
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 495-508, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35241
https://doi.org/10.1115/IPACK2003-35241
View Paper titled, Raised Floor Computer Data Center: Effect of Rack Inlet Temperatures When Rack Flowrates Are Reduced
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Topics: Computers, Data centers, Temperature, Computational fluid dynamics, Flow (Dynamics), Tiles, Computer simulation, Design, Electronic equipment, Exhaust systems