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Proceedings Papers

Weather Analysis Using Neural Networks for Modular Data Centers

Feyisola Adejokun, Ashwin Siddarth, Abhishek Guhe, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8253
https://doi.org/10.1115/IPACK2018-8253
View Paper titled, Weather Analysis Using Neural Networks for Modular Data Centers
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Topics: Artificial neural networks, Data centers, Cooling, Evaporative cooling, Cooling systems, Neural network models, Temperature, Algorithms, Computation, Control systems
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8456
https://doi.org/10.1115/IPACK2018-8456
View Paper titled, Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers

Mullaivendhan Varadharasan, Dereje Agonafer, Ahmed Al Khazraji, Jimil Shah, Ashwin Siddarth, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8378
https://doi.org/10.1115/IPACK2018-8378
View Paper titled, A Thermo-Mechanical Study on Vertically Split Distribution-Wet Cooling Media Used in Data Centers
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Topics: Cooling, Data centers, Thermomechanics, Flow (Dynamics), Incrustations, Temperature, Wetting, Air flow, Evaporative cooling, Water
Proceedings Papers

Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling

Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74295
https://doi.org/10.1115/IPACK2017-74295
View Paper titled, Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
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Topics: Data centers, Design, Evaporative cooling, Performance evaluation, Cooling, Computational fluid dynamics, Water, Air flow, Air pollution, Cooling systems
Proceedings Papers

Theoretical and Empirical Energy Impacts of Economization in Data Centers

Dan Comperchio, Sameer Behere
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A018, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48274
https://doi.org/10.1115/IPACK2015-48274
View Paper titled, Theoretical and Empirical Energy Impacts of Economization in Data Centers
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Topics: Data centers, Compressors, Energy consumption, Air conditioners, Computers, Cooling, Electronic systems, Evaporative cooling, System architecture, System monitoring
Proceedings Papers

Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A085, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48370
https://doi.org/10.1115/IPACK2015-48370
View Paper titled, Reduced Order Modeling for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Microchannel flow, Modeling, Cooling, Cavities, Convection, Engineering simulation, Evaporative cooling, Fluids, Heat
Proceedings Papers

A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling

Devesh Chugh, Rasool Nasr Isfahani, Kyle Gluesenkamp, Omar Abdelaziz, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48816
https://doi.org/10.1115/IPACK2015-48816
View Paper titled, A Hybrid Absorption Cycle for Water Heating, Dehumidification, and Evaporative Cooling
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Topics: Absorption, Cycles, Dehumidification, Evaporative cooling, Hot water heating, Water, Heat, Heating, Hot water, Water vapor
Proceedings Papers

Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling

Pritish R. Parida, Hsin-Hua Tsuei, Timothy J. Chainer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A027, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48489
https://doi.org/10.1115/IPACK2015-48489
View Paper titled, Eulerian Multiphase Conjugate Model for Chip-Embedded Micro-Channel Flow Boiling
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Topics: Boiling, Cavities, Coolants, Cooling, Density, Evaporative cooling, Flow (Dynamics), Fluids, Heat transfer, Integrated circuits
Proceedings Papers

Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces

Zezhi Zeng, Gopinath Warrier, Y. Sungtaek Ju
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48149
https://doi.org/10.1115/IPACK2015-48149
View Paper titled, Flow and Heat Transfer in Liquid Films Flowing Over Highly Curved Surfaces
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Topics: Flow (Dynamics), Heat transfer, Liquid films, Heat exchangers, Cooling, Design, String, Shapes, Computer simulation, Evaporative cooling
Proceedings Papers

CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications

Betsegaw Gebrehiwot, Nikhil Dhiman, Kasturi Rajagopalan, Dereje Agonafer, Naveen Kannan, James Hoverson, Mike Kaler
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A054, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73302
https://doi.org/10.1115/IPACK2013-73302
View Paper titled, CFD Modeling of Indirect/Direct Evaporative Cooling Unit for Modular Data Center Applications
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Topics: Computational fluid dynamics, Data centers, Evaporative cooling, Modeling, Climate, Containers, Cooling, Cooling systems, Air conditioning, Air filters
Proceedings Papers

Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers

Madhusudan Iyengar, Roger Schmidt
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 623-627, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52210
https://doi.org/10.1115/IPACK2011-52210
View Paper titled, Energy Efficient Data Centers Using Evaporative Cooling and Air Side Economizers
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Topics: Data centers, Evaporative cooling, Cooling, Temperature, Climate, Computers, Energy consumption, Air conditioning, Evaporation, Filtration
Proceedings Papers

Perspiration Nano-Patch for Hot Spot Thermal Management

Shankar Narayanan, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 493-500, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33156
https://doi.org/10.1115/IPACK2007-33156
View Paper titled, Perspiration Nano-Patch for Hot Spot Thermal Management
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Topics: Thermal management, Heat, Cooling, Evaporative cooling, Flux (Metallurgy), Heat transfer, Boiling, Design, Electrical measurement, Evaporation
Proceedings Papers

The Maisotsenko Cycle for Electronics Cooling

Valeriy Maisotsenko, Ilya Reyzin
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 415-424, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73283
https://doi.org/10.1115/IPACK2005-73283
View Paper titled, The Maisotsenko Cycle for Electronics Cooling
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Topics: Computer cooling, Cycles, Electronics, Evaporative cooling
Proceedings Papers

The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72

Adam G. Pautsch, Timothy A. Shedd
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 455-460, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35227
https://doi.org/10.1115/IPACK2003-35227
View Paper titled, The Effects of Nozzle Configuration and Coolant Flow Rate on Spray Evaporative Cooling in a Multi-Chip Module Using FC-72
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Topics: Coolants, Evaporative cooling, Flow (Dynamics), Multi-chip modules, Nozzles, Sprays, Heat, Cooling, Critical heat flux, Computers