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Proceedings Papers

Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples

Takashi Fukue, Koichi Hirasawa
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69101
https://doi.org/10.1115/IPACK2021-69101
View Paper titled, Fundamental Investigation of Effects of Surrounding Conditions on Measurement Uncertainty in Temperature of Surface-Mounted Components by Thermocouples
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Topics: Measurement uncertainty, Temperature, Thermocouples, Temperature measurement, Electrical components, Evaluation methods, Heat, Heat transfer, Uncertainty
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

Kanji Takagi, Masaki Wakabayashi, Junichi Inoue, Qiang Yu, Takahiro Akutsu
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 143-148, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52044
https://doi.org/10.1115/IPACK2011-52044
View Paper titled, Study on High Reliability of Lead-Free Solder Joint on Metal Substrate
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Topics: Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology
Proceedings Papers

Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition

Naoya Saiki, Kazuaki Inaba, Kikuo Kishimoto, Hideo Senoo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 473-478, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52096
https://doi.org/10.1115/IPACK2011-52096
View Paper titled, Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition
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Topics: Adhesives, Reliability, Stress, Bonding, Evaluation methods, Shear (Mechanics), Corners (Structural elements), Finite element methods, Finite element model, Integrated circuit fabrication
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89145
https://doi.org/10.1115/InterPACK2009-89145
View Paper titled, In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams
Proceedings Papers

Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree

Kazuhiko Sasagawa, Akihiko Kirita, Takehiro Abo, Abdul Hafiz Nor Hassan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 119-124, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89229
https://doi.org/10.1115/InterPACK2009-89229
View Paper titled, Numerical Simulation of Threshold Current Density of Electromigration Damage in Cu Interconnect Tree
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Topics: Computer simulation, Current density, Damage, Electrodiffusion, Reliability, Atoms, Electrons, Evaluation methods, Integrated circuits, Silicon
Proceedings Papers

Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines

Kazuhiko Sasagawa, Shota Fukushi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 849-854, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33237
https://doi.org/10.1115/IPACK2007-33237
View Paper titled, Evaluation of Threshold Current Density of Electromigration Damage in Angled Bamboo Lines
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Topics: Current density, Damage, Electrodiffusion, Metals, Reliability, Atoms, Computer simulation, Corners (Structural elements), Density, Electrons
Proceedings Papers

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 855-861, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33242
https://doi.org/10.1115/IPACK2007-33242
View Paper titled, Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability
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Topics: Ball-Grid-Array packages, Design, Evaluation methods, Reliability, Ball-Grid-Array packaging, Engineers, Fatigue, Fatigue life, Printed circuit boards, Response surface methodology
Proceedings Papers

Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines

Kazuhiko Sasagawa, Shigeo Uno, Nao Yamaji, Masumi Saka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1147-1152, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73133
https://doi.org/10.1115/IPACK2005-73133
View Paper titled, Effect of Line-Shape on Threshold Current Density of Electromigration Damage in Bamboo Lines
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Topics: Current density, Damage, Electrodiffusion, Shapes, Metals, Computer simulation, Density, Evaluation methods, Reliability
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73134
https://doi.org/10.1115/IPACK2005-73134
View Paper titled, Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
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Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods
Proceedings Papers

Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness

Kazuhiko Sasagawa, Masataka Hasegawa, Naoki Yoshida, Masumi Saka, Hiroyuki Abe´
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 723-728, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35065
https://doi.org/10.1115/IPACK2003-35065
View Paper titled, Prediction of Electromigration Failure in Passivated Polycrystalline Line Considering Passivation Thickness
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Topics: Electrodiffusion, Failure, Metals, Reliability, Computer simulation, Damage, Evaluation methods