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Proceedings Papers

Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment

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Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141881
https://doi.org/10.1115/IPACK2024-141881
View Paper titled, Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment
Open the PDF for Comparative Performance Analysis of Screen-Printed Structures on PET and BPET Substrates Utilizing Low-Temperature ECA and MACA for SMD Component Attachment in another window
Topics: Biodegradation, Cellulose, Circuits, Electronics, Errors, Low temperature, Manufacturing, Printing, Sanitary landfills, Stability
Proceedings Papers

Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process

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Stewart Christie, Anna Prakash, Elaina Ashton, Veronica Tanner
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111936
https://doi.org/10.1115/IPACK2023-111936
View Paper titled, Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process
Open the PDF for Enhancing Manual Visual Inspection Process by Using OpenCV AI and Anomalib for Defect Detection in Automotive Assembly and Manufacturing Process in another window
Topics: Artificial intelligence, Flaw detection, Manufacturing, Optical quality control, Errors, Computers, Electronics, Flat heat pipes, Inspection, Laptop computers
Proceedings Papers

Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates

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Alfonso Ortega, Victor A. Martinez, Carol Caceres, Ali Heydari, Uschas Chowdhury
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A019, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113883
https://doi.org/10.1115/IPACK2023-113883
View Paper titled, Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates
Open the PDF for Development of Thermal Metrology Standards for Experimental Characterization of Thermal Resistance for Single-Phase Liquid Cold Plates in another window
Topics: Experimental characterization, Metrology, Plates (structures), Temperature, Thermal resistance, Engineering simulation, Errors, Simulation, Uncertainty, Boundary-value problems
Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

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Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97451
https://doi.org/10.1115/IPACK2022-97451
View Paper titled, SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
Open the PDF for SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates in another window
Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

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Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Open the PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter in another window
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers

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Jun Chen, R. C. Jaeger, J. C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A019, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6461
https://doi.org/10.1115/IPACK2019-6461
View Paper titled, Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers
Open the PDF for Piezoresistive Theory for 4H Silicon Carbide Stress Sensors on Four-Degree Off-Axis Wafers in another window
Topics: Semiconductor wafers, Sensors, Silicon, Stress, Calibration, Errors, Approximation, Design, Electronics, High temperature
Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

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Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8337
https://doi.org/10.1115/IPACK2018-8337
View Paper titled, On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties
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Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors
Proceedings Papers

Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations

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Keishi Okamoto, Sayuri Kohara, Hiroyuki Mori
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A018, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74098
https://doi.org/10.1115/IPACK2017-74098
View Paper titled, Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations
Open the PDF for Effects of Build-Up Material Properties on Warpage Dispersion of Organic Substrates Caused by Manufacturing Variations in another window
Topics: Manufacturing, Materials properties, Warping, Copper, Design, Finite element analysis, Simulation, Young's modulus, Errors, Flip-chip
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

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Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
https://doi.org/10.1115/IPACK2017-74030
View Paper titled, Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
Open the PDF for Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations in another window
Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Measuring Moisture Leakage Out of Water Cooling Hardware

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Prabjit Singh, Michael Ellsworth
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48154
https://doi.org/10.1115/IPACK2015-48154
View Paper titled, Measuring Moisture Leakage Out of Water Cooling Hardware
Open the PDF for Measuring Moisture Leakage Out of Water Cooling Hardware in another window
Topics: Cooling, Hardware, Leakage, Water, Computers, Cooling systems, Electronics, Acoustics, Coolants, Errors
Proceedings Papers

Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet

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Kourosh Nemati, Husam A. Alissa, Bruce T. Murray, Bahgat Sammakia, Mark Seymour
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48244
https://doi.org/10.1115/IPACK2015-48244
View Paper titled, Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet
Open the PDF for Experimentally Validated Numerical Model of a Fully-Enclosed Hybrid Cooled Server Cabinet in another window
Topics: Computer simulation, Cooling, Data centers, Heat, Air flow, Energy dissipation, Leakage, Water, Boundary-value problems, Computational fluid dynamics
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

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Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48641
https://doi.org/10.1115/IPACK2015-48641
View Paper titled, Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples
Open the PDF for Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples in another window
Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs
Proceedings Papers

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

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Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48568
https://doi.org/10.1115/IPACK2015-48568
View Paper titled, Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed
Open the PDF for Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed in another window
Topics: Hardware, Temperature, Phase change materials, Thermal management, Complementary metal oxide semiconductors, Computation, Cooling, Design, Errors, Heat
Proceedings Papers

Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications

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Rick Beyerle, Gary Shives
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48523
https://doi.org/10.1115/IPACK2015-48523
View Paper titled, Development of Heat Transfer Tools for Sizing Flexible Graphite Spreaders in Mobile Applications
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Topics: Graphite, Heat transfer, Computer software, Errors, Flat heat pipes, Heat, Thermal conductivity, Accounting, Adhesives, Computational fluid dynamics
Proceedings Papers

A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels

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Zhenhai Pan, Justin A. Weibel, Suresh V. Garimella
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48178
https://doi.org/10.1115/IPACK2015-48178
View Paper titled, A Cost-Effective Modeling Approach for Simulating Phase Change and Flow Boiling in Microchannels
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Topics: Boiling, Flow (Dynamics), Microchannels, Modeling, Vapors, Bubbles, Simulation, Currents, Errors, Evaporation
Proceedings Papers

Prognostics Health Management Model for LED Package Failure Under Contaminated Environment

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Pradeep Lall, Hao Zhang, Lynn Davis
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48724
https://doi.org/10.1115/IPACK2015-48724
View Paper titled, Prognostics Health Management Model for LED Package Failure Under Contaminated Environment
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Topics: Errors, Failure, Kalman filters, Maintenance, Organic compounds, Phosphors, Reliability, Robustness, Service life (Equipment), Stability
Proceedings Papers

On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)

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Toshio Tomimura, Yasushi Koito, Taewan Do, Masaru Ishizuka, Tomoyuki Hatakeyama
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48302
https://doi.org/10.1115/IPACK2015-48302
View Paper titled, On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model)
Open the PDF for On Simple Prediction Method for Thermal Contact Resistance Between Wavy Surfaces With Thermal Interface Material Under Low Mean Nominal Contact Pressure (Fundamental Study Based on 1-D Model) in another window
Topics: Contact resistance, Pressure, Heat, Surface roughness, Temperature, Bearings, Control systems, Electronic equipment, Errors, Satellites
Proceedings Papers

A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems

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Feng Sheng, Dan Jiao
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73177
https://doi.org/10.1115/IPACK2013-73177
View Paper titled, A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems
Open the PDF for A Minimal Order Model From Zero to High Frequencies for Finite-Element Based Analysis of General 3-D Electromagnetic Problems in another window
Topics: Finite element analysis, Design, Finite element methods, Algorithms, Approximation, Errors, Frequency-domain analysis, Integrated circuits, Linear systems, Modeling
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

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Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73264
https://doi.org/10.1115/IPACK2013-73264
View Paper titled, Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics

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Pradeep Lall, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A014, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73251
https://doi.org/10.1115/IPACK2013-73251
View Paper titled, Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics
Open the PDF for Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Leadfree Electronics in another window
Topics: Damage, Electronics, Cycles, Failure, Alloys, Elastic moduli, Electronic systems, Errors, High temperature, Reliability