1-20 of 38
Epoxy resins
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors

Available to Purchase

Josef Frankhouse, Jackson Marsh, Han Hu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111922
https://doi.org/10.1115/IPACK2023-111922
View Paper titled, Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors
Open the PDF for Condition Monitoring of Semiconductors Using Wide Band Acoustic Emission Sensors in another window
Topics: Acoustic emissions, Condition monitoring, Semiconductors (Materials), Sensors, Electric vertical take-off and landing aircraft, Electronics, Aircraft, Density, Electric vehicles, Electromagnetic interference
Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Available to Purchase

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97427
https://doi.org/10.1115/IPACK2022-97427
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Open the PDF for Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure in another window
Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging

Available to Purchase

Pradeep Lall, Yunli Zhang, Jeff Suhling, Jaimal Williamson, Pat Thompson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97453
https://doi.org/10.1115/IPACK2022-97453
View Paper titled, Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging
Open the PDF for Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging in another window
Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fatigue cracks, High temperature, Molding, Reliability
Proceedings Papers

Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging

Available to Purchase

Pradeep Lall, Yunli Zhang, Haotian Wu, Jeff Suhling, Edward Davis, Jaimal Williamson
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A023, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74075
https://doi.org/10.1115/IPACK2021-74075
View Paper titled, Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
Open the PDF for Characterization of Linear Viscoelasticity Evolution of Epoxy Molding Compound Subjected to High Temperature Long Term Aging in another window
Topics: Epoxy adhesives, Epoxy resins, High temperature, Molding, Viscoelasticity
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Available to Purchase

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
https://doi.org/10.1115/IPACK2021-74062
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Open the PDF for Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation in another window
Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy

Available to Purchase

Tadeh Avanessian, Jim Clatterbaugh, Robin L. Zinsmaster, Leyla Hashemi
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69495
https://doi.org/10.1115/IPACK2021-69495
View Paper titled, Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy
Open the PDF for Epoxy Die Attach Combined With Face-Up Die Bonding for Improved XYZ Placement Accuracy in another window
Topics: Bonding, Epoxy adhesives, Epoxy resins, Flip-chip, Flip-chip devices
Proceedings Papers

Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading

Available to Purchase

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep, Ryan Lowe
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6572
https://doi.org/10.1115/IPACK2019-6572
View Paper titled, Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
Open the PDF for Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading in another window
Topics: Bending (Stress), Delamination, Electronics, Epoxy adhesives, Epoxy resins, Fatigue, Fracture (Materials), Fracture toughness
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Available to Purchase

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8408
https://doi.org/10.1115/IPACK2018-8408
View Paper titled, Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
Open the PDF for Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging in another window
Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures

Available to Purchase

Pradeep Lall, Kalyan Dornala, Jeff Suhling, John Deep
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74322
https://doi.org/10.1115/IPACK2017-74322
View Paper titled, Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures
Open the PDF for Interfacial Delamination and Fracture Properties of Potting Compounds and PCB/Epoxy Interfaces Under Flexure Loading After Exposure to Multiple Cure Temperatures in another window
Topics: Bending (Stress), Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, Temperature, Fracture (Materials), Elongation, Shock (Mechanics), Failure
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Available to Purchase

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
Open the PDF for Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging in another window
Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage

Available to Purchase

Ruiyang Liu, HoHyung Lee, Seungbae Park, Xiaojie Xue
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48086
https://doi.org/10.1115/IPACK2015-48086
View Paper titled, Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage
Open the PDF for Shrinkage of Post-Cure Die Attach Adhesives During Isothermal Storage in another window
Topics: Adhesives, Shrinkage (Materials), Storage, Finite element analysis, Sensors, Viscoelasticity, Epoxy adhesives, Epoxy resins, MEMS packaging, Microelectromechanical systems
Proceedings Papers

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

Available to Purchase

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A068, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48316
https://doi.org/10.1115/IPACK2015-48316
View Paper titled, Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages
Open the PDF for Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages in another window
Topics: Experimental characterization, Heat transfer, Complementary metal oxide semiconductors, Cooling, Epoxy adhesives, Epoxy resins, Heating, Thermal conductivity, Thermal properties, Thermal resistance
Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

Available to Purchase

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48088
https://doi.org/10.1115/IPACK2015-48088
View Paper titled, Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels
Open the PDF for Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels in another window
Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

Available to Purchase

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
Open the PDF for A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface in another window
Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

Available to Purchase

Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48738
https://doi.org/10.1115/IPACK2015-48738
View Paper titled, Pre-Applied Inter Chip Fill for 3D-IC Chip Joining
Open the PDF for Pre-Applied Inter Chip Fill for 3D-IC Chip Joining in another window
Topics: Joining, Pellet fusion, Thermal conductivity, Fillers (Materials), Aluminum, Boron, Composite materials, Cooling, Density, Epoxy adhesives
Proceedings Papers

Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole

Available to Purchase

Yu Yamayose, Tetsuya Kugimiya, Kenji Hirohata, Akihiko Happoya, Nobutada Ohno, Masao Sakane
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48247
https://doi.org/10.1115/IPACK2015-48247
View Paper titled, Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole
Open the PDF for Effects of Thermal Cycle Conditions on Thermal Fatigue Life of Substrate With Cu Through-Hole in another window
Topics: Cycles, Fatigue life, Temperature, Finite element methods, Thin films, Glass, Textiles, Constitutive equations, Creep, Epoxy resins
Proceedings Papers

Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging

Available to Purchase

Nusrat J. Chhanda, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73242
https://doi.org/10.1115/IPACK2013-73242
View Paper titled, Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging
Open the PDF for Effects of Moisture Exposure on the Mechanical Behavior of Polymer Encapsulants in Microelectronic Packaging in another window
Topics: Mechanical behavior, Microelectronic packaging, Polymers, Mechanical properties, Stress, Tension, Adhesives, Elastic moduli, Epoxy adhesives, Epoxy resins
Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Available to Purchase

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52168
https://doi.org/10.1115/IPACK2011-52168
View Paper titled, Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias
Open the PDF for Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias in another window
Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

Available to Purchase

David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52293
https://doi.org/10.1115/IPACK2011-52293
View Paper titled, Characterization of a Macrofiber Piezoelectric Composite
Open the PDF for Characterization of a Macrofiber Piezoelectric Composite in another window
Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin

Available to Purchase

Yusuke Suzuki, Yusuke Ohashi, Masato Ohnishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 381-386, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52062
https://doi.org/10.1115/IPACK2011-52062
View Paper titled, Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin
Open the PDF for Two-Dimensional Strain-Distribution Sensor Using Carbon Nanotube-Dispersed Resin in another window
Topics: Carbon, Nanotubes, Resins, Sensors, Multi-walled carbon nanotubes, Carbon nanotubes, Electrical conductivity, Electrical resistance, Rubber, Single-walled carbon nanotubes