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Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

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Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6372
https://doi.org/10.1115/IPACK2019-6372
View Paper titled, Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone

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Pradeep Lall, Amrit Abrol, David Locker
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A022, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74252
https://doi.org/10.1115/IPACK2017-74252
View Paper titled, Effects of Sustained Exposure to Temperature and Humidity on the Reliability and Performance of MEMS Microphone
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Topics: Microelectromechanical systems, Microphones, Reliability, Temperature, High temperature, Service life (Equipment), Analytical methods, Engineers, Failure analysis, Failure mechanisms
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

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Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices

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Hafiz M. Hashim, Baris Dogruoz, Mehmet Arik, Murat Parlak
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A040, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48024
https://doi.org/10.1115/IPACK2015-48024
View Paper titled, An Investigation Into Performance Characteristics of an Axial Flow Fan Using CFD for Electronic Devices
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Topics: Axial flow, Computational fluid dynamics, Performance characterization, Flow (Dynamics), Engineering simulation, Engineers, Fans, Pressure, Pressure drop, Simulation
Proceedings Papers

Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules

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Joshua Gess, Tyler Dreher, Sushil Bhavnani, Wayne Johnson
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A047, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48771
https://doi.org/10.1115/IPACK2015-48771
View Paper titled, Effect of Flow Guide Integration on the Thermal Performance of High Performance Liquid Cooled Immersion Server Modules
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Topics: Flow (Dynamics), Coolants, Pressure drop, Temperature, Energy dissipation, Fluids, Boiling, Cooling, Data centers, Design
Proceedings Papers

A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System

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Chang-Woo Han, You-Lim Moon, Seung-Boong Jeong, Jong-Hee Han
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48085
https://doi.org/10.1115/IPACK2015-48085
View Paper titled, A Study on the Thermo-Fluid Simulation Model Using Porous Media in the Power Conversion System
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Topics: Porous materials, Power conversion systems, Simulation models, Thermofluids, Heat sinks, Air flow, Power semiconductor devices, Temperature, Computation, Computer simulation
Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

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Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48685
https://doi.org/10.1115/IPACK2015-48685
View Paper titled, Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane
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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods
Proceedings Papers

Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations

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Carin Lundquist Ruiz
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A022, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48769
https://doi.org/10.1115/IPACK2015-48769
View Paper titled, Correlated OLED Thermal Modeling Methods and Thermal Design Recommendations
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Topics: Design, Modeling, Cutting, Engineers, Light-emitting diodes, Simulation, Structural design
Proceedings Papers

Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination

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Tejeshkumar Bagul, Kanan Pujara, Jimil Shah, Oluwaseun Awe, Dereje Agonafer
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A034, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48049
https://doi.org/10.1115/IPACK2015-48049
View Paper titled, Computational Study of Behavior of Gas Absorption in Data Center Equipment and its Effects on the Rate of Corrosion/Contamination
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Topics: Absorption, Contamination, Corrosion, Data centers, Air conditioning, Gases, Reliability, Wheels, China, Circuits
Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

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Frank Fan Wang
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73262
https://doi.org/10.1115/IPACK2013-73262
View Paper titled, Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation
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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions
Proceedings Papers

Integrating an Electronics Component Database Into a Thermal Design Tool

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Patrick Loney
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 731-740, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89080
https://doi.org/10.1115/InterPACK2009-89080
View Paper titled, Integrating an Electronics Component Database Into a Thermal Design Tool
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Topics: Databases, Design, Electronics, Engineers, Junctions, Lumber, Temperature, Computer software, Cooling, Electrical conductivity
Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

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Michael K. Patterson, Don Atwood, John G. Miner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89358
https://doi.org/10.1115/InterPACK2009-89358
View Paper titled, Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
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Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating
Proceedings Papers

Modelling Reliability of Power Electronics Packaging

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Chris Bailey, Hua Lu, Chunyan Yin
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 215-220, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89430
https://doi.org/10.1115/InterPACK2009-89430
View Paper titled, Modelling Reliability of Power Electronics Packaging
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Topics: Electronic packaging, Modeling, Reliability, Electronics, Semiconductors (Materials), Aluminum, Design, Electric vehicles, Electricity (Physics), Energy management
Proceedings Papers

Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction

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Nihad Dukhan
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 881-886, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89231
https://doi.org/10.1115/InterPACK2009-89231
View Paper titled, Approximate Analysis for Darcy-Flow Convection in Porous Media With Zero Fluid Conduction
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Topics: Convection, Flow (Dynamics), Fluids, Heat conduction, Porous materials, Electrical conductivity, Heat, Thermal conductivity, Cooling, Design
Proceedings Papers

Vapor Chambers in Blade Server CPU Cooling Solutions

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Matt Connors
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 703-705, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33779
https://doi.org/10.1115/IPACK2007-33779
View Paper titled, Vapor Chambers in Blade Server CPU Cooling Solutions
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Topics: Blades, Computer cooling, Vapors, Heat sinks, Aluminum, Copper, Computational fluid dynamics, Cooling, Design, Dimensions
Proceedings Papers

Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability

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Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 855-861, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33242
https://doi.org/10.1115/IPACK2007-33242
View Paper titled, Evaluation Method of Interaction Relation Between Design Factors and Simple Assessment Approach for BGA Package Reliability
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Topics: Ball-Grid-Array packages, Design, Evaluation methods, Reliability, Ball-Grid-Array packaging, Engineers, Fatigue, Fatigue life, Printed circuit boards, Response surface methodology
Proceedings Papers

Using Linear Superposition to Solve Multiple Heat Source Transient Thermal Problems

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David T. Billings, Roger P. Stout
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 791-799, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33576
https://doi.org/10.1115/IPACK2007-33576
View Paper titled, Using Linear Superposition to Solve Multiple Heat Source Transient Thermal Problems
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Topics: Heat, Transients (Dynamics), Circuits, Design, Engineers, Steady state
Proceedings Papers

Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles

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Vijay Sarihan, Steven Xu, Beth Keser
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 965-969, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33312
https://doi.org/10.1115/IPACK2007-33312
View Paper titled, Engineering New Package Ideal Materials Using Polymer Resins and Nanoparticles
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Topics: Nanoparticles, Polymers, Resins, Reliability, Materials properties, Packaging, Particulate matter, Simulation, Composite materials, Diluents
Proceedings Papers

Mold Adhesion Force Measurement

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Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, Yeong-Jyh Lin
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 51-58, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33826
https://doi.org/10.1115/IPACK2007-33826
View Paper titled, Mold Adhesion Force Measurement
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Topics: Adhesion, Force measurement, Coatings, Molding, Engineers, Instrumentation, Temperature, Foundry coatings, Surface finishing, Cavities
Proceedings Papers

Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China

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Xiu-Lan Cheng, Yu-Zhuo Fu, Cheng Yang, Yan Chen
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 429-433, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33334
https://doi.org/10.1115/IPACK2007-33334
View Paper titled, Development of an Industry-Oriented Graduate Course on Microelectronic Packaging in China
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Topics: China, Microelectronic packaging, Packaging, Students, Design, Engineers, Failure analysis, Flow (Dynamics), Manufacturing, Printed circuit board assemblies