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Proceedings Papers

A Comparative Data Center Energy Efficiency and TCO Analysis for Different Cooling Technologies

Ali Heydari, Bahareh Eslami, Uschas Chowdhury, Vahideh Radmard, Pardeep Shahi, Harold Miyamura, Mohammad Tradat, Peter Chen, Drew Tuholski, Kevin Gray, Tyler Buell, Greg Stover, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
https://doi.org/10.1115/IPACK2023-111959
View Paper titled, A Comparative Data Center Energy Efficiency and TCO Analysis for Different Cooling Technologies
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Topics: Cooling, Data centers, Energy efficiency
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters

Jackson B. Marcinichen, John R. Thome, Raffaele L. Amalfi, Filippo Cataldo
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2541
https://doi.org/10.1115/IPACK2020-2541
View Paper titled, Experimental Validation and Design Simulations of a Passive Two-Phase Cooling System for Datacenters
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Topics: Cooling systems, Design, Engineering simulation, Simulation, Cooling, Flow (Dynamics), Heat, Architecture, Boiling, Computer cooling
Proceedings Papers

Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources

Pradeep Lall, Ved Soni, Amrit Abrol, Ben Leever, Scott Miller
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6570
https://doi.org/10.1115/IPACK2019-6570
View Paper titled, Effect of Charge-Discharge Depth and Environment Use Conditions on Flexible Power Sources
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Topics: Accelerated life testing, Batteries, Cycles, Electronics, Energy efficiency, Flexible electronics, High temperature, Lithium-ion batteries, Medical devices, Regression models
Proceedings Papers

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

Devdatta P. Kulkarni, Priyanka Tunuguntla, Guixiang Tan, Casey Carte
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6530
https://doi.org/10.1115/IPACK2019-6530
View Paper titled, Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink
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Topics: Cooling, Heat sinks, Maintainability, Thermal management, Data centers, Heat pipes, Air flow, Boundary-value problems, Computers, Design
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing
Proceedings Papers

An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem

Chun Wang, Xiaoguang Sun, Jun Zhang, Nishi Ahuja
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74033
https://doi.org/10.1115/IPACK2017-74033
View Paper titled, An Advanced Energy Efficient Rack Server Design With Distributed Battery Subsystem
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Topics: Batteries, Design, Data centers, Energy efficiency, Energy consumption, Data collection, Design methodology, Lead-acid batteries, Optimization, Topology
Proceedings Papers

Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation

Viral K. Patel, Kyle R. Gluesenkamp
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74243
https://doi.org/10.1115/IPACK2017-74243
View Paper titled, Development of Packaging and Modular Control of Thermoelectric Clothes Dryer, With Performance Evaluation
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Topics: Design, Drying, Electrical resistance, Energy consumption, Energy efficiency, Engineering prototypes, Heat pumps, Heating, Modeling, Optimization
Proceedings Papers

Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations

Chin L. Ong, Raffaele L. Amalfi, Jackson B. Marcinichen, Nicolas Lamaison, John R. Thome
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74030
https://doi.org/10.1115/IPACK2017-74030
View Paper titled, Two-Phase Mini-Thermosyphon for Cooling of Datacenters: Experiments, Modeling and Simulations
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Topics: Cooling, Modeling, Simulation, Heat, Density, Energy dissipation, Flow (Dynamics), Temperature, Water, Acoustics
Proceedings Papers

Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling

Fatemeh Tavakkoli, Siavash Ebrahimi, Xiaogang Sun, Yan Cui, Ali Heydari
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74295
https://doi.org/10.1115/IPACK2017-74295
View Paper titled, Design Analysis and Performance Evaluation of a Data Center With Indirect Evaporative Cooling
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Topics: Data centers, Design, Evaporative cooling, Performance evaluation, Cooling, Computational fluid dynamics, Water, Air flow, Air pollution, Cooling systems
Proceedings Papers

Robust Data Acquisition for Building Lighting Systems

Zak Pearson, Tanya L. Crenshaw, Heather Dillon, Erik Paulson, Nick Warlen
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48445
https://doi.org/10.1115/IPACK2015-48445
View Paper titled, Robust Data Acquisition for Building Lighting Systems
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Topics: Data acquisition, Heat sinks, Cables, Data acquisition systems, Energy efficiency, Temperature, Thermal management
Proceedings Papers

Multi-Physics Driven Co-Design of 3D Multicore Architectures

He Xiao, Wen Yueh, Saibal Mukhopadhyay, Sudhakar Yalamanchili
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A038, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48533
https://doi.org/10.1115/IPACK2015-48533
View Paper titled, Multi-Physics Driven Co-Design of 3D Multicore Architectures
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Topics: Architecture, Design, Physics, Temperature, Delays, Energy efficiency, Circuits, Cycles, Energy consumption, Heat flux
Proceedings Papers

Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling

Mark E. Steinke, Vinod Kamath, Lynn Parnell
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A030, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48466
https://doi.org/10.1115/IPACK2015-48466
View Paper titled, Thermodynamic Characterization of a Server Optimized for High Performance Computing Using Water Cooling
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Topics: Cooling, Water, Design, Air flow, Heat, Energy consumption, Energy efficiency, Stress, Algorithms, Boundary-value problems
Proceedings Papers

Harvesting CPU Waste Heat Through Pyroelectric Materials

Soochan Lee, Nishant Singh, Patrick E. Phelan, Carole-Jean Wu
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A079, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48421
https://doi.org/10.1115/IPACK2015-48421
View Paper titled, Harvesting CPU Waste Heat Through Pyroelectric Materials
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Topics: Waste heat, Heat, Temperature, Materials properties, Thermal conductivity, Computation, Electric power generation, Energy dissipation, Energy efficiency, Energy generation
Proceedings Papers

The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle

Luis Silva-Llanca, Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A023, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48423
https://doi.org/10.1115/IPACK2015-48423
View Paper titled, The Effectiveness of Data Center Overhead Cooling in Steady and Transient Scenarios: Comparison of Downward Flow to a Cold Aisle Versus Upward Flow From a Hot Aisle
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Topics: Cooling, Data centers, Flow (Dynamics), Transients (Dynamics), Heat exchangers, Cooling systems, Air flow, Energy efficiency, Pressure drop, Temperature
Proceedings Papers

Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures

Kazuaki Yazawa, Ali Shakouri
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A080, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48682
https://doi.org/10.1115/IPACK2015-48682
View Paper titled, Optimum Design and Operation of Thermoelectric Heat Pump With Two Temperatures
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Topics: Design, Heat pumps, Temperature, Cooling, Heat, Heat sinks, Diluents, Energy generation, Reservoirs, Computer cooling
Proceedings Papers

Rack Server Solution in Data Center

Sheng Kang, Guofeng Chen, Chun Wang, Ruiquan Ding, Jiajun Zhang, Pinyan Zhu, Chao Liu, Nishi Ahuja
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A042, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48258
https://doi.org/10.1115/IPACK2015-48258
View Paper titled, Rack Server Solution in Data Center
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Topics: Data centers, Cooling, Energy consumption, Design, Fans, Air flow, Energy efficiency, Server racks, Cloud computing, Heat
Proceedings Papers

Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers

Levente J. Klein, Sergio A. Bermudez, Fernando J. Marianno, Hendrik F. Hamann, Prabjit Singh
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48349
https://doi.org/10.1115/IPACK2015-48349
View Paper titled, Energy Efficiency and Air Quality Considerations in Airside Economized Data Centers
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Topics: Air pollution, Data centers, Energy efficiency, Cooling, Corrosion, Temperature, Sensors, Air conditioning, Air flow, Contamination
Proceedings Papers

Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization

Caleb Serafy, Ankur Srivastava, Avram Bar-Cohen, Donald Yeung
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48344
https://doi.org/10.1115/IPACK2015-48344
View Paper titled, Design Space Exploration of 3D CPUs and Micro-Fluidic Heatsinks With Thermo-Electrical-Physical Co-Optimization
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Topics: Design, Microfluidics, Optimization, Cooling, Energy efficiency, Circuits