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Proceedings Papers

Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors

Devdatta Kulkarni, John Gulick, Jeff King, Brian Jarrett, Paul George, Yoav Feldman
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141367
https://doi.org/10.1115/IPACK2024-141367
View Paper titled, Thermal Performance of Common Cold Plate for Pumped Single- and Two-Phase Direct Liquid Cooling for Next Generation High Power Server Processors
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Topics: Cooling, Heat flux, Heat, Data centers, Design, Flux (Metallurgy), Climate change, Construction, Design methodology, Energy consumption
Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms

Myunghoon Lee, Lindo Arimpoor Pallan Ouseph, Vamsi Krishna Yaddanapudi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A015, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141171
https://doi.org/10.1115/IPACK2024-141171
View Paper titled, Advanced Thermal Aware Mobile SoC Floorplan Design Optimization by Integrating Proactive Design Rule Check Process and Evolutionary Algorithms
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Topics: Computational fluid dynamics, Design, Evolutionary algorithms, Optimization, Workflow, Delays, Energy consumption, Intellectual property, Temperature, Thermal analysis
Proceedings Papers

Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement

Qianying Wu, Zheng Gong, Chih-Yao Chan, Heungdong Kwon, Kenneth Goodson, Tiwei Wei
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-109944
https://doi.org/10.1115/IPACK2023-109944
View Paper titled, Experimental Characterization of Confined, Package-Level Direct Two-Phase Jet Impingement Cooling With Micro-Pin Fin Surface Enhancement
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Topics: Boiling, Bubbles, Computer cooling, Coolants, Cooling, Cooling systems, Drying, Energy consumption, Experimental characterization, Flow (Dynamics)
Proceedings Papers

Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates

Matthew Law, Sin Liang Soh, Wei Wang, Poh Seng Lee, Wen Feng Lu
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111575
https://doi.org/10.1115/IPACK2023-111575
View Paper titled, Thermal and Hydraulic Performance Analyses of Machined and Hybrid Printed Oblique-Fin Cold Plates
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Topics: Additive manufacturing, Fins, Plates (structures), Printing, Surface roughness, Thermal resistance, Cooling, Graphics processing units, Copper, Machining
Proceedings Papers

Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server

Vibin Shalom Simon, Bhavana Reddy Mandadi, Pardeep Shahi, Himanshu Modi, Pratik Vithoba Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112084
https://doi.org/10.1115/IPACK2023-112084
View Paper titled, Compact Modeling and Thermal Analysis of Immersion Based Hybrid Cooled Server
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Topics: Cloud computing, Computational fluid dynamics, Coolants, Cooling, Cooling systems, Data centers, Design, Electronic components, Electronics, Energy consumption
Proceedings Papers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
https://doi.org/10.1115/IPACK2022-97587
View Paper titled, Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server
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Topics: Cooling, Design, Air flow, Heat sinks, Temperature, Cloud computing, Energy consumption, Flow (Dynamics), Graphics processing units, Heat
Proceedings Papers

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Li Chen, Aaron P. Wemhoff
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-92005
https://doi.org/10.1115/IPACK2022-92005
View Paper titled, Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction
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Topics: Carbon, Data centers, Energy consumption, Stress, Water
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97456
https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
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Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97447
https://doi.org/10.1115/IPACK2022-97447
View Paper titled, Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center
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Topics: Cooling, Data centers, Density, Energy consumption, Temperature, Computational fluid dynamics, Design, Flow (Dynamics), Carbon, Cooling systems
Proceedings Papers

Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies

Chris May, Jordan Mizerak, David Earley, Bernard Malouin
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74016
https://doi.org/10.1115/IPACK2021-74016
View Paper titled, Thermal Performance of Modular Microconvective Heat Sinks for Multi-Die Processor Assemblies
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Topics: Cooling, Data centers, Heat sinks, Power density, Heat, Semiconductors (Materials), Temperature, Density, Energy consumption, Flow (Dynamics)
Proceedings Papers

Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers

Filippo Cataldo, Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A008, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72621
https://doi.org/10.1115/IPACK2021-72621
View Paper titled, Novel Air-Cooled Thermosyphon Cooling System for Desktop Computers
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Topics: Computer cooling, Computers, Cooling systems, Cooling, Energy consumption, Climate change, Condensers (steam plant), Flow (Dynamics), Fluids, Heat
Proceedings Papers

A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems

Eric Peterson, Seth Morris, Husam Alissa, Nicholas Keehn, Bharath Ramakrishnan, Vaidehi Oruganti, Ioannis Manousakis, Noah Mckay
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A009, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72682
https://doi.org/10.1115/IPACK2021-72682
View Paper titled, A Novel Concept for Air Removal in Two-Phase Immersion Cooling Systems
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Topics: Boilers, Carbon, Condensers (steam plant), Cooling, Cooling systems, Emissions, Energy consumption, Film thickness, Fluids, Gases
Proceedings Papers

Design and Application of Innovative 3DVC in AI Server System

Xianguang Tan, Yongzhan He, Bin Liu, Jiang Yu, Ahuja Nishi, Wenbin Tian
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69723
https://doi.org/10.1115/IPACK2021-69723
View Paper titled, Design and Application of Innovative 3DVC in AI Server System
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Topics: Cooling, Design, Graphics processing units, Energy consumption, Artificial intelligence, Cloud computing, Energy dissipation, Heat, Heat pipes, Heat sinks
Proceedings Papers

Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers

Raffaele L. Amalfi, Cong H. Hoang, Ryan Enright, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72612
https://doi.org/10.1115/IPACK2021-72612
View Paper titled, Operational Map and Thermal Performance of a Thermosyphon Cooling System for Compact Servers
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Topics: Cooling systems, Cooling, Heat, Heat flux, Computer cooling, Containment systems, Coolants, Copper, Density, Design
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets

Eduardo Sepúlveda Jiménez, Jean Paul d’Alençon, Luis Silva-Llanca
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6585
https://doi.org/10.1115/IPACK2019-6585
View Paper titled, Data Center Thermal Efficiency Improvement by Cooling Flow Vectoring Using Synthetic Jets
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Topics: Cooling, Data centers, Flow (Dynamics), Jets, Thermal efficiency, Energy consumption, Exergy, Tiles, Computer cooling, Computer software
Proceedings Papers

Design of Passive Two-Phase Thermosyphons for Server Cooling

Raffaele L. Amalfi, Jackson B. Marcinichen, John R. Thome, Filippo Cataldo
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A003, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6386
https://doi.org/10.1115/IPACK2019-6386
View Paper titled, Design of Passive Two-Phase Thermosyphons for Server Cooling
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Topics: Cooling, Design, Energy consumption, Heat, Cooling systems, Artificial intelligence, Condensers (steam plant), Coolants, Databases, Electric vehicles
Proceedings Papers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8432
https://doi.org/10.1115/IPACK2018-8432
View Paper titled, Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time
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Topics: Temperature, Pumps, Cooling, Fluids, Failure, Operating temperature, Air pollution, Condensation, Corrosion, Data centers
Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8305
https://doi.org/10.1115/IPACK2018-8305
View Paper titled, Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling
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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing