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Proceedings Papers

Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components

Jeho Kim, J. Michael Brown, Yogendra Joshi, Kevin O’Connor, Marcos Diaz, Zhuomin Zhang, Peiyan Yang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6391
https://doi.org/10.1115/IPACK2019-6391
View Paper titled, Vandal Glass Heat Distribution and the Effect of Glass Gap Adjustments in Outdoor Digital Display Components
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Topics: Computational fluid dynamics, Glass, Heat, Heat transfer, Liquid crystals, Solar energy, Solar radiation, Testing, Temperature, Computer software
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74190
https://doi.org/10.1115/IPACK2017-74190
View Paper titled, Knowledge Based Qualification Process to Evaluate Vibration Induced Failures in Electronic Components
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Topics: Electronic components, Failure, Vibration, Engineering standards, Reliability, Damage, Electronics, Failure mechanisms, Risk, Roads
Proceedings Papers

Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle

Toru Ikeda, Akiko Ozaki, Takuya Hatao, Noriyuki Miyazaki
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A004, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48168
https://doi.org/10.1115/IPACK2015-48168
View Paper titled, Warpage Hysteresis Estimation of an Electronic Package During a Thermal Cycle
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Topics: Cycles, Electronic packages, Warping, Heating, Package on package, Reliability, Resins, Elastic moduli, Hardening (Curing), Relaxation (Physics)
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48389
https://doi.org/10.1115/IPACK2015-48389
View Paper titled, A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures
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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics
Proceedings Papers

High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications

Vibhash Jha, Serguei Dessiatoun, Michael Ohadi, Amir Shooshtari, Ebrahim Al-Hajri
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 277-283, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52179
https://doi.org/10.1115/IPACK2011-52179
View Paper titled, High Performance Micro-Grooved Evaporative Heat Transfer Surface for Low Grade Waste Heat Recovery Applications
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Topics: Heat recovery, Heat transfer, Flow (Dynamics), Heat transfer coefficients, Pressure drop, Refrigerants, Thermal management, Absorption, Cooling, Electronic products
Proceedings Papers

Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Mandar Kulkarni, Geeta Limaye, Jeff Suhling
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 519-536, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52194
https://doi.org/10.1115/IPACK2011-52194
View Paper titled, Constitutive Behavior of SAC Leadfree Alloys at High Strain Rates
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Topics: Alloys, Shock (Mechanics), Failure, Solders, Constitutive equations, Copper, Fracture (Process), Lead-free solders, Damage, Electronic products
Proceedings Papers

Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump

Shoho Ishikawa, Hironori Tohmyoh, Masumi Saka, Satoshi Watanabe, Motohisa Kuroha, Yoshikatsu Nakano
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 207-211, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52112
https://doi.org/10.1115/IPACK2011-52112
View Paper titled, Effect of Chip Size and Thermal Amplitude on Fatigue Life of Pb-Free Solder Bump
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Topics: Fatigue life, Lead-free solders, Electronic components, Electronic packages, Electronic products, Fatigue, Fatigue damage, Fatigue failure, Finite element analysis, Reliability
Proceedings Papers

Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

F. Askari Farahani, M. Al-Bassyiouni, A. Dasgupta, S. Tolchinsky, J. Crystal
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 149-154, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89179
https://doi.org/10.1115/InterPACK2009-89179
View Paper titled, Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
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Topics: Electronic systems, Modeling, Shock (Mechanics), Simulation, Dynamic response, Batteries, Plastic housings, Circuits, Design, Dynamic testing (Materials)
Proceedings Papers

Pb-Free Process Development for a High End Storage Area Network Application

Sunil Gopakumar, Francois Billaut, Eric Fremd, Manthos Economou
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 937-943, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33857
https://doi.org/10.1115/IPACK2007-33857
View Paper titled, Pb-Free Process Development for a High End Storage Area Network Application
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Topics: Alloys, Cycles, Electronic products, Finishes, High temperature, Laminates, Lead-free solders, Lumber, Manufacturing, Optimization
Proceedings Papers

High Temperature Lead-Free Attach Reliability

Patrick McCluskey, Pedro O. Quintero
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 93-98, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33457
https://doi.org/10.1115/IPACK2007-33457
View Paper titled, High Temperature Lead-Free Attach Reliability
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Topics: High temperature, Reliability, Packaging, Temperature, Electronic products, Electronics, Failure, Manufacturing, Modeling, Physics
Proceedings Papers

Models for Shock and Vibration Survivability of Electronic and MEMS Packaging

Pradeep Lall, Dhananjay Panchagade, Prakriti Choudhary, Jeff Suhling, Sameep Gupte
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1545-1556, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73427
https://doi.org/10.1115/IPACK2005-73427
View Paper titled, Models for Shock and Vibration Survivability of Electronic and MEMS Packaging
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Topics: MEMS packaging, Shock (Mechanics), Vibration, Damage, Failure, Design, Electronic packaging, Reliability, Transients (Dynamics), Boundary-value problems
Proceedings Papers

Electrical Simulation Design Technology of Silicon Through Substrate

Takamasa Takano, Masataka Yamaguchi, Koichi Nakayama, Tomoko Maruyama, Shigeki Chujyo, Satoru Kuramochi, Yoshitaka Fukuoka
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 999-1004, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73339
https://doi.org/10.1115/IPACK2005-73339
View Paper titled, Electrical Simulation Design Technology of Silicon Through Substrate
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Topics: Design, Silicon, Simulation, Packaging, System-in-package, Transmission lines, Cables, Circuits, Clocks, Delays
Proceedings Papers

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Greg Heaslip, Jeff Punch, Bryan Rogers, Claire Ryan, Michael Reid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1283-1291, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73366
https://doi.org/10.1115/IPACK2005-73366
View Paper titled, A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
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Topics: Ball-Grid-Array packaging, Failure, Failure analysis, Lead-free solders, Solders, Stress, Testing, Data acquisition systems, Design, Electronic components
Proceedings Papers

Drop Reliability of Corner Bonded CSP in Portable Products

Guoyun Tian, Yueli Liu, Pradeep Lall, R. Wayne Johnson, Sanan Abderrahman, Mike Palmer, Nokib Islam, Jeffrey Suhling, Larry Crane
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 897-905, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35318
https://doi.org/10.1115/IPACK2003-35318
View Paper titled, Drop Reliability of Corner Bonded CSP in Portable Products
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Topics: Corners (Structural elements), Reliability, Bonding, Flow (Dynamics), Manufacturing, Cycles, Electronic products, Finite element analysis, Modeling, Shock (Mechanics)
Proceedings Papers

Chip in Polymer: 3D Integration of Active Circuitry in Polymeric Substrate

Erik Jung, Dirk Wojakowski, Alexander Neumann, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 47-51, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35025
https://doi.org/10.1115/IPACK2003-35025
View Paper titled, Chip in Polymer: 3D Integration of Active Circuitry in Polymeric Substrate
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Topics: Bricks, Electronic products, Laminates, Manufacturing, Microelectromechanical systems, Polymers, Silicon, Silicon chips, System-in-package, Thermal management
Proceedings Papers

Thermofluid Design of Energy Efficient and Compact Heat Sinks

Kazuaki Yazawa, Gary L. Solbrekken, Avram Bar-Cohen
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 509-516, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35242
https://doi.org/10.1115/IPACK2003-35242
View Paper titled, Thermofluid Design of Energy Efficient and Compact Heat Sinks
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Topics: Design, Heat sinks, Thermofluids, Fins, Convection, Cooling, Cooling systems, Design methodology, Electronic products, Energy efficiency