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Proceedings Papers

Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material

Bharath Bharadwaj, Prashant Singh, Roop L. Mahajan
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69254
https://doi.org/10.1115/IPACK2021-69254
View Paper titled, Thermal Performance of Different Carbonaceous Nanoparticles as Additives to Thermal Paste as an Interface Material
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Topics: Agglomeration (Materials), Coal, Computer cooling, Electronic packages, Electronic packaging, Energy dissipation, Graphene, Graphite, Heat, Heat sinks
Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74069
https://doi.org/10.1115/IPACK2021-74069
View Paper titled, Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months
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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages
Proceedings Papers

Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures

S. M. Kamrul Hasan, Abdullah Fahim, Mohammad Al Ahsan, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A016, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74044
https://doi.org/10.1115/IPACK2021-74044
View Paper titled, Evolution of Mechanical Properties and Microstructure in SAC Bulk Solder and Solder Joints During Thermal Cycling Exposures
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Topics: Lead-free solders, Mechanical properties, Solder joints, Solders, Tensile strength, Thermal shock, Yield strength, Stress, Cycles, High temperature
Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2659
https://doi.org/10.1115/IPACK2020-2659
View Paper titled, High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging
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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials
Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2660
https://doi.org/10.1115/IPACK2020-2660
View Paper titled, High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging
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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components
Proceedings Papers

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

Dustin Pense, Hayden Carlton, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6416
https://doi.org/10.1115/IPACK2019-6416
View Paper titled, Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis
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Topics: Event history analysis, Thermomechanics, Reliability, Stress, Testing, Thermal conductivity, Adhesion, Adhesives, Cycles, Electronic packages
Proceedings Papers

Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics

Palash V. Acharya, Vaibhav Bahadur, Robert Hebner, Abdelhamid Ouroua, Shannon Strank
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6311
https://doi.org/10.1115/IPACK2019-6311
View Paper titled, Assessing the Performance of Advanced Cooling Techniques on Thermal Management of Next-Generation Power Electronics
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Topics: Cooling, Electronics, Thermal management, Heat, Electronic packages, Energy dissipation, Heat sinks, Packaging, Silicon, Copper
Proceedings Papers

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6422
https://doi.org/10.1115/IPACK2019-6422
View Paper titled, Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems
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Topics: Electrical properties, Electronic packages, Electronics, Graphene, Heat, Iron, Latent heat, Nanocomposites, Particulate matter, Phase change materials
Proceedings Papers

Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design

Mahsa Montazeri, John Harris, David R. Huitink, Adithya Venkatanarayanan, Simon S. Ang
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6424
https://doi.org/10.1115/IPACK2019-6424
View Paper titled, Thermomechanical Stress and Warpage Augmentation Using Auxetic Features in Electronic Design
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Topics: Design, Stress, Thermomechanics, Warping, Deformation, Finite element analysis, Manufacturing, Electronic packages, Reliability, Temperature
Proceedings Papers

Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages

Shrinath Ramdas, Pavan Rajmane, Tushar Chauhan, Abel Misrak, Dereje Agonafer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6568
https://doi.org/10.1115/IPACK2019-6568
View Paper titled, Impact of Immersion Cooling on Thermo-Mechanical Properties of PCB’s and Reliability of Electronic Packages
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Topics: Cooling, Electronic packages, Printed circuit boards, Reliability, Thermomechanics
Proceedings Papers

Thermal Interface Materials Enhanced by Micro and Nanostructures

Mei-Chien Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A009, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8307
https://doi.org/10.1115/IPACK2018-8307
View Paper titled, Thermal Interface Materials Enhanced by Micro and Nanostructures
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Topics: Architecture, Corners (Structural elements), Design, Electronic packages, Electronics, Energy gap, Failure, Finite element methods, High temperature, Nanostructures
Proceedings Papers

Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling

Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, Abdullah Fahim, Jeffrey C. Suhling, Sa'd Hamasha, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8414
https://doi.org/10.1115/IPACK2018-8414
View Paper titled, Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
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Topics: Solders, Fracture (Materials), Solder joints, Temperature, Damage, Electronic packages, Fatigue failure, Glass, Intermetallic compounds, Lead-free solders
Proceedings Papers

Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Torsten Hauck, Ilko Schmadlak, Nishant Lakhera, Sandeep Shantaram, David Samet, V. N. N. Trilochan Rambhatla, Suresh Sitaraman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74073
https://doi.org/10.1115/IPACK2017-74073
View Paper titled, Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging
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Topics: Delamination, Electronic packaging, Fracture (Materials), Simulation, Electronic packages, Copper, Finite element analysis, Fracture mechanics, Risk, Stress
Proceedings Papers

Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems

David Huitink
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74245
https://doi.org/10.1115/IPACK2017-74245
View Paper titled, Thermomechanical Reliability Challenges and Goals and Design for Reliability Methodologies for Electric Vehicle Systems
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Topics: Design, Electric vehicles, Reliability, Thermomechanics, Stress, Vehicles, Electronics, Failure, Physics, Batteries
Proceedings Papers

The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages

Quang Nguyen, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74273
https://doi.org/10.1115/IPACK2017-74273
View Paper titled, The Dependence of Moisture Induced Die Stresses Upon Moisture Properties of Polymer Materials in Electronic Packages
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Topics: Electronic packages, Polymers, Stress, Reliability, Simulation, Weight (Mass), Absorption, Ball-Grid-Array packaging, Corrosion, Cracking (Materials)
Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48422
https://doi.org/10.1115/IPACK2015-48422
View Paper titled, Modeling Thermal Spreading Resistance in Via Arrays
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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux
Proceedings Papers

Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages

Bahar Öner, Hakan Ertürk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A055, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48333
https://doi.org/10.1115/IPACK2015-48333
View Paper titled, Thermal Diffusion Tomography for Quantitative Non-Destructive Characterization of Electronic Packages
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Topics: Electronic packages, Nondestructive evaluation, Thermal diffusion, Heat, Acoustics, Algorithms, Contact resistance, Density, Energy dissipation, Flat heat pipes
Proceedings Papers

Reliable Integration of Microchannel Coolers for Power Electronics

David Squiller, Sumeer Khanna, Serguei Dessiatoun, Raphael Mandel, Michael Ohadi, Patrick McCluskey
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48757
https://doi.org/10.1115/IPACK2015-48757
View Paper titled, Reliable Integration of Microchannel Coolers for Power Electronics
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Topics: Coolers, Electronics, Microchannels, Corrosion, Electronic packages, Electronic systems, Erosion, Failure mechanisms, Fracture (Materials), Fracture (Process)
Proceedings Papers

Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures

Quang Nguyen, M. Kaysar Rahim, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A041, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48627
https://doi.org/10.1115/IPACK2015-48627
View Paper titled, Characterization of Die Stresses in Plastic Packages Subjected to Moisture and Thermal Exposures
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Topics: Stress, Shear stress, Molding, Storage, Weight (Mass), Computer simulation, Electronic packages, Engineering simulation, Failure, Finite element analysis
Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48655
https://doi.org/10.1115/IPACK2015-48655
View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders