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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 26–28, 2021
Paper No: IPACK2021-72976
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Paper No: IPACK2020-2658
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Paper No: IPACK2019-6429
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A073, July 6–9, 2015
Paper No: IPACK2015-48302
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A011, July 6–9, 2015
Paper No: IPACK2015-48069
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Paper No: IPACK2015-48364
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Paper No: IPACK2015-48600
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A015, July 6–9, 2015
Paper No: IPACK2015-48176
Proceedings Papers

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A082, July 6–9, 2015
Paper No: IPACK2015-48205
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A020, July 16–18, 2013
Paper No: IPACK2013-73089
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T01A001, July 16–18, 2013
Paper No: IPACK2013-73029
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 577-583, July 6–8, 2011
Paper No: IPACK2011-52165
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 585-593, July 6–8, 2011
Paper No: IPACK2011-52166
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 527-533, July 19–23, 2009
Paper No: InterPACK2009-89277
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 201-210, July 19–23, 2009
Paper No: InterPACK2009-89034
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Paper No: InterPACK2009-89218
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 221-228, July 19–23, 2009
Paper No: InterPACK2009-89010
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Paper No: InterPACK2009-89052
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009
Paper No: InterPACK2009-89103