1-6 of 6
Electronic circuits
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits

Pradeep Lall, Ved Soni, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
https://doi.org/10.1115/IPACK2023-112060
View Paper titled, Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits
Open the PDF for Evaluation of Thermoformability of Additively Printed Circuits Printed Using Gravure Offset Printing Technique and Investigation of In-Mold Electronic Circuits in another window
Topics: Circuits, Electronic circuits, Electronics, Offset printing
Proceedings Papers

Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114686
https://doi.org/10.1115/IPACK2023-114686
View Paper titled, Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform
Open the PDF for Investigation of Performance and Repairability of Additively Printed Functional Circuits With Water-Based Silver Ink on an Inkjet Platform in another window
Topics: Circuits, Inks, Silver, Water, Printing, Manufacturing, Adhesives, Electronic circuits, Electronics, Filters
Proceedings Papers

Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques

Pradeep Lall, Fatahi Musa, Ved Soni, Scott Miller
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112001
https://doi.org/10.1115/IPACK2023-112001
View Paper titled, Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques
Open the PDF for Sustainable Silver Ink Flexible Circuits Fabrication Using Direct Write Additive Manufacturing Techniques in another window
Topics: Additive manufacturing, Filters, Flexible electronics, Inks, Manufacturing, Silver, Sustainability, Circuits, Surface mount components, Biodegradable materials
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
Open the PDF for Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures in another window
Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle

Ce´dric P. R. Dockendorf, Tae-Youl Choi, Dimos Poulikakos, C. P. Grigoropoulos
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1959-1961, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73497
https://doi.org/10.1115/IPACK2005-73497
View Paper titled, Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle
Open the PDF for Multilayer Direct-Writing of Electrical Conductors With Gold Nanoinks Using the Fountain-Pen Principle in another window
Topics: Circuits, Electronic circuits, Flexible electronics, Inks, Manufacturing, Melting point, Nanoparticles, Plastics, Probes, Silicon
Proceedings Papers

The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models

Clemens J. M. Lasance, Mohamed-Nabil Sabry
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35167
https://doi.org/10.1115/IPACK2003-35167
View Paper titled, The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models
Open the PDF for The Use of Time-Dependent Temperature Response Curves for the Generation of (Dynamic) Compact Thermal Models in another window
Topics: Ball-Grid-Array packaging, Design, Electronic circuits, Modeling, Reliability, Steady state, Temperature, Temperature effects, Thermal analysis, Transients (Dynamics)