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Proceedings Papers

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

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Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-94505
https://doi.org/10.1115/IPACK2022-94505
View Paper titled, Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints
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Topics: Anisotropy, Crystals, Electron backscatter diffraction, Shear (Mechanics), Solder joints
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

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Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
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Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Proceedings Papers

Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries

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Takahiro Nakanishi, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A006, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48200
https://doi.org/10.1115/IPACK2015-48200
View Paper titled, Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries
Open the PDF for Improvement of the Long-Term Reliability of Interconnection by Controlling the Crystallinity of Grain Boundaries in another window
Topics: Grain boundaries, Reliability, Copper, Thin films, Electrical resistivity, Electron backscatter diffraction, Brittleness, Diffusion (Physics), Dislocations, Focused ion beams
Proceedings Papers

Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints

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Md Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A008, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48623
https://doi.org/10.1115/IPACK2015-48623
View Paper titled, Characterization of the Effects of Silver Content on the Aging Resistance of SAC Solder Joints
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Topics: Silver, Solder joints, Creep, Alloys, Solders, Nanoindentation, Testing, Crystal structure, Crystals, Stress
Proceedings Papers

Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit

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Yusuke Watanabe, Yuji Ichikawa, Kazuhiro Ogawa, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73150
https://doi.org/10.1115/IPACK2013-73150
View Paper titled, Microtexture and Electrical and Mechanical Properties of the Cold-Sprayed Copper Deposit
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Topics: Copper, Mechanical properties, Particulate matter, Brittle fracture, Ceramics, Coating processes, Coatings, Dielectric materials, Electrical properties, Electron backscatter diffraction
Proceedings Papers

Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection

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Chuanhong Fan, Ryosuke Furuya, Osamu Asai, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A005, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73147
https://doi.org/10.1115/IPACK2013-73147
View Paper titled, Effect of the Lattice Mismatch Between Copper Thin-Film Interconnection and Base Material on the Crystallinity of the Interconnection
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Topics: Copper, Thin films, Design, Diffraction, Electron backscatter diffraction, Electrons, Ruthenium, Semiconductor devices
Proceedings Papers

Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films

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Osamu Asai, Ryosuke Furuya, Chuanhong Fan, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73149
https://doi.org/10.1115/IPACK2013-73149
View Paper titled, Improvement of the Reliability of Thin-Film Interconnections Based on the Control of the Crystallinity of the Thin Films
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Topics: Reliability, Thin films, Electroplating, Copper, Annealing, Current density, Electrical properties, Electron backscatter diffraction, Electrical resistivity, Grain boundaries
Proceedings Papers

Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

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Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A013, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73192
https://doi.org/10.1115/IPACK2013-73192
View Paper titled, Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint
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Topics: Damage, Low cycle fatigue, Solder joints, Tin, Grain boundaries, Fracture (Materials), Stress concentration, Crack propagation, Cycles, Electron backscatter diffraction
Proceedings Papers

Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging

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Mohammad Hasnine, Muhannad Mustafa, Jing Zou, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, Pradeep Lall
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73234
https://doi.org/10.1115/IPACK2013-73234
View Paper titled, Nanomechanical Characterization of Aging Effects in Solder Joints in Microelectronic Packaging
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Topics: Creep, Electron backscatter diffraction, Microelectronic packaging, Nanoindentation, Solder joints
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

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Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

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Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 677-684, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52048
https://doi.org/10.1115/IPACK2011-52048
View Paper titled, Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections
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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress
Proceedings Papers

Localized High-Resolution Stress Measurements on MEMS Structures

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Dietmar Vogel, Astrid Gollhardt, Bernd Michel
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 743-747, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89106
https://doi.org/10.1115/InterPACK2009-89106
View Paper titled, Localized High-Resolution Stress Measurements on MEMS Structures
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Topics: Microelectromechanical systems, Resolution (Optics), Stress, Electron backscatter diffraction, Focused ion beams, Milling, Raman spectroscopy
Proceedings Papers

Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films

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Kenichi Shimizu, Tasiyuki Torii
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1703-1708, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73134
https://doi.org/10.1115/IPACK2005-73134
View Paper titled, Quantitative Evaluation of Crystal Rotation Behavior Around the Fatigue Crack in Copper Films
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Topics: Copper, Crystals, Fatigue cracks, Rotation, Crystal structure, Fatigue testing, Fracture (Materials), Electron backscatter diffraction, Annealing, Evaluation methods