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Proceedings Papers

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

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Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97220
https://doi.org/10.1115/IPACK2022-97220
View Paper titled, High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering
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Topics: Brightness (Photometry), Diffusion (Physics), Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics)
Proceedings Papers

The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study

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Fernan Saiz, Cristina H. Amon
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48114
https://doi.org/10.1115/IPACK2015-48114
View Paper titled, The Prediction of the Thermal Conductivity of Gallium Arsenide: A Molecular Dynamics Study
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Topics: Gallium arsenide, Molecular dynamics, Thermal conductivity, Temperature, Acoustics, Density, Design, Electromagnetic scattering, Equilibrium (Physics), Heat
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

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Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73173
https://doi.org/10.1115/IPACK2013-73173
View Paper titled, Heat Transfer in Nanoelectronics by Quantum Mechanics
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Spectral Detail of Phonon Conduction and Scattering in Graphene

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Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 329-343, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52243
https://doi.org/10.1115/IPACK2011-52243
View Paper titled, Spectral Detail of Phonon Conduction and Scattering in Graphene
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Topics: Electromagnetic scattering, Graphene, Heat conduction, Phonons, Radiation scattering, Scattering (Physics), Thermal conductivity, Probability, Algorithms, Approximation
Proceedings Papers

Frequency Resolved Phonon Transport in Si/Ge Nanocomposites

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Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 757-768, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52244
https://doi.org/10.1115/IPACK2011-52244
View Paper titled, Frequency Resolved Phonon Transport in Si/Ge Nanocomposites
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Topics: Nanocomposites, Phonons, Thermal conductivity, Mean free path, Acoustics, Approximation, Density, Electromagnetic scattering, Engineering simulation, Equilibrium (Physics)
Proceedings Papers

Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages

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Nobuyuki Shishido, Satoru Matsumoto, Chuantong Chen, Hisashi Sato, Masaki Omiya, Shoji Kamiya, Masahiro Nishida, Takeshi Nokuo, Tadahiro Nagasawa, Takashi Suzuki, Tomoji Nakamura
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 425-428, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52270
https://doi.org/10.1115/IPACK2011-52270
View Paper titled, Interface Toughness Evaluation With Specimens Fabricated by Focused Ion Beam for Micro Scale Devices and Packages
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Topics: Electromagnetic scattering, Focused ion beams, Fracture toughness, Microscale devices, Resolution (Optics), Uncertainty, Vapors
Proceedings Papers

Thermal Conductivity Reduction in Few-Layer Graphene

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Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 769-778, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52245
https://doi.org/10.1115/IPACK2011-52245
View Paper titled, Thermal Conductivity Reduction in Few-Layer Graphene
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Topics: Graphene, Thermal conductivity, Phonons, Acoustics, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Accounting, Graphite, Harmonics (Music)
Proceedings Papers

A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method

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Zhiting Tian, Sang Kim, Ying Sun, Bruce White
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 607-615, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89272
https://doi.org/10.1115/InterPACK2009-89272
View Paper titled, A Molecular Dynamics Study of Thermal Conductivity in Nanocomposites via the Phonon Wave Packet Method
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Topics: Molecular dynamics, Nanocomposites, Phonons, Thermal conductivity, Wave packets, Molecular dynamics simulation, Electromagnetic scattering, Equilibrium (Physics), Flow (Dynamics), Heat
Proceedings Papers

Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices

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Tomoyuki Hatakeyama, Kazuyoshi Fushinobu, Ken Okazaki, Masaru Ishizuka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 135-141, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89156
https://doi.org/10.1115/InterPACK2009-89156
View Paper titled, Electro-Thermal Analysis and Monte Carlo Simulation for Thermal Issue in Si Devices
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Topics: Simulation, Relaxation (Physics), Heat, Electromagnetic scattering, Energy conservation, Momentum, Radiation scattering, Scattering (Physics), Semiconductor devices, Approximation
Proceedings Papers

Multiscale Modeling of Hot Spots in GaN High Electron Mobility Transistors

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Adam Christensen, Samuel Graham
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 535-541, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89073
https://doi.org/10.1115/InterPACK2009-89073
View Paper titled, Multiscale Modeling of Hot Spots in GaN High Electron Mobility Transistors
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Topics: Electron mobility, Gallium nitride, Multiscale modeling, Transistors, Phonons, Heat, Diffusion (Physics), Dimensions, Electromagnetic scattering, Lattice Boltzmann methods
Proceedings Papers

Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package

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Hisashi Tanie, Nobuhiko Chiwata, Motoki Wakano, Masaru Fujiyoshi, Takeyuki Itabashi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 797-802, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89232
https://doi.org/10.1115/InterPACK2009-89232
View Paper titled, Fracture Life Evaluation of Cu-Cored Solder Joint in BGA Package
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Topics: Ball-Grid-Array packages, Fracture (Materials), Solder joints, Solders, Crack propagation, Shapes, Finite element analysis, Particulate matter, Stiffness, Deformation
Proceedings Papers

Coupled Electro-Thermal Simulation of MOSFETs

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Chunjian Ni, Zlatan Aksamija, Jayathi Y. Murthy, Umberto Ravaioli
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 161-173, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89182
https://doi.org/10.1115/InterPACK2009-89182
View Paper titled, Coupled Electro-Thermal Simulation of MOSFETs
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Topics: Simulation, Phonons, Electrons, Heat, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Acoustics, Anisotropy, Heat conduction
Proceedings Papers

Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces

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Dhruv Singh, Jayathi Y. Murthy, Timothy S. Fisher
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 575-591, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89208
https://doi.org/10.1115/InterPACK2009-89208
View Paper titled, Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces
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Topics: Heat conduction, Phonons, Superlattices, Engineering simulation, Simulation, Thermal conductivity, Acoustics, Electromagnetic scattering, Equilibrium (Physics), Germanium
Proceedings Papers

Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties

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T. D. Musho, D. G. Walker
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 171-175, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89332
https://doi.org/10.1115/InterPACK2009-89332
View Paper titled, Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties
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Topics: Composite materials, Simulation, Alloys, Bulk solids, Density, Design, Electromagnetic scattering, Nanoscale phenomena, Phonons, Radiation scattering
Proceedings Papers

Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times

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Chunjian Ni, Jayathi Y. Murthy
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 99-109, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89181
https://doi.org/10.1115/InterPACK2009-89181
View Paper titled, Improved Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
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Topics: Anisotropy, Modeling, Phonons, Relaxation (Physics), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Silicon, Accounting, Equilibrium (Physics)
Proceedings Papers

Thermal Contact Resistance of a Silicon Nanowire on a Substrate

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Dhruv Singh, Timothy S. Fisher, Jayathi Y. Murthy
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 1007-1017, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33431
https://doi.org/10.1115/IPACK2007-33431
View Paper titled, Thermal Contact Resistance of a Silicon Nanowire on a Substrate
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Topics: Contact resistance, Nanowires, Silicon, Wire, Acoustics, Computation, Electromagnetic scattering, Finite volume methods, Fluids, Heat
Proceedings Papers

Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests

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Fubin Song, S. W. Ricky Lee
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 889-894, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33933
https://doi.org/10.1115/IPACK2007-33933
View Paper titled, Effects of Tooling Tip Wear and Fixture Rigidity on Solder Ball Shear and Ball Pull Tests
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Topics: Shear (Mechanics), Solders, Stiffness, Tooling, Wear, Failure mechanisms, Fracture (Materials), Gluing, Brittleness, Electromagnetic scattering
Proceedings Papers

Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module

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Y. Ezzahri, R. Singh, K. Fukutani, Z. Bian, A. Shakouri, G. Zeng, J. E. Bowers, J. M. Zide, A. C. Gossard
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 277-281, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33880
https://doi.org/10.1115/IPACK2007-33880
View Paper titled, Transient Thermal Characterization of ErAs/In 0.53 Ga 0.47 As Thermoelectric Module
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Topics: Thermal characterization, Transients (Dynamics), Electrons, Nanoparticles, Semiconductors (Materials), Crystals, Electromagnetic scattering, Heat, Heat transfer, Metals
Proceedings Papers

Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride

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Thomas Beechem, Samuel Graham
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 171-177, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33305
https://doi.org/10.1115/IPACK2007-33305
View Paper titled, Temperature Dependent Phonon Lifetimes and Decay Pathways in Hexagonal Gallium Nitride
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Topics: Gallium nitride, Phonons, Temperature, Electromagnetic scattering, Radiation scattering, Scattering (Physics), Uncertainty
Proceedings Papers

Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors

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Keivan Etessam-Yazdani, Rozana Hussin, Mehdi Asheghi
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 2087-2095, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73182
https://doi.org/10.1115/IPACK2005-73182
View Paper titled, Impact of Thermal Sub-Continuum Effects on Electrical Performance of Silicon-on-Insulator Transistors
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Topics: Silicon-on-insulator, Transistors, Heating, Gates (Closures), Electromagnetic scattering, Phonons, Radiation scattering, Scattering (Physics), Silicon, Simulation