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Proceedings Papers

Comparing Wire Bonding Strategies for High Power Applications

Whit Vinson, Frida Torres, David Huitink
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-140965
https://doi.org/10.1115/IPACK2024-140965
View Paper titled, Comparing Wire Bonding Strategies for High Power Applications
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Topics: Alloys, Aluminum, Current density, Electrical resistivity, Electrodiffusion, Failure, Heating, Intermetallic compounds, Joules, Nickel
Proceedings Papers

Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current

Kazuki Hisasue, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Kotaro Miura, Yusuke Souma
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141181
https://doi.org/10.1115/IPACK2024-141181
View Paper titled, Effect of Passivation Layer and Line Thickness on Damage Mechanism of Flexible Ag Nanowire Interconnects Under High Density Current
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Topics: Damage, Density, Electrodiffusion, Flexible electronics, Nanowires
Proceedings Papers

Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing

Whit Vinson, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111909
https://doi.org/10.1115/IPACK2023-111909
View Paper titled, Performance of SAC305 Solder Joints Under Simultaneous Tensile and Electromigration Stressing
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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress
Proceedings Papers

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97338
https://doi.org/10.1115/IPACK2022-97338
View Paper titled, Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation
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Topics: Computer simulation, Electrodiffusion, Physics
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-69882
https://doi.org/10.1115/IPACK2021-69882
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-68902
https://doi.org/10.1115/IPACK2021-68902
View Paper titled, Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading
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Topics: Damage, Electrodiffusion, Flexible electronics, Stress
Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2598
https://doi.org/10.1115/IPACK2020-2598
View Paper titled, Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects
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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance
Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2556
https://doi.org/10.1115/IPACK2020-2556
View Paper titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model
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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress
Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6408
https://doi.org/10.1115/IPACK2019-6408
View Paper titled, Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density
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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability
Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6521
https://doi.org/10.1115/IPACK2019-6521
View Paper titled, Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects
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Topics: Electrodiffusion, Failure, Lead-free solders
Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6413
https://doi.org/10.1115/IPACK2019-6413
View Paper titled, Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures
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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire
Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74059
https://doi.org/10.1115/IPACK2017-74059
View Paper titled, Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line
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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons
Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74092
https://doi.org/10.1115/IPACK2017-74092
View Paper titled, Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line
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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation
Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48386
https://doi.org/10.1115/IPACK2015-48386
View Paper titled, Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs
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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization
Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48334
https://doi.org/10.1115/IPACK2015-48334
View Paper titled, Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program
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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride
Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48744
https://doi.org/10.1115/IPACK2015-48744
View Paper titled, Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir
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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation
Proceedings Papers

Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages

Lutz Meinshausen, Ming Liu, Tae-Kyu Lee, Indranath Dutta, Li Li
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48124
https://doi.org/10.1115/IPACK2015-48124
View Paper titled, Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
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Topics: Reliability, Silicon, Finite element analysis, Finite element model, Shear stress, Temperature, Copper, Creep, Diffusion (Physics), Electrodiffusion
Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48655
https://doi.org/10.1115/IPACK2015-48655
View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders
Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48197
https://doi.org/10.1115/IPACK2015-48197
View Paper titled, Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity
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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
https://doi.org/10.1115/IPACK2013-73130
View Paper titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion