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Proceedings Papers

Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength

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Bryan Tunon, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111951
https://doi.org/10.1115/IPACK2023-111951
View Paper titled, Study of Flow-Dependent Characteristics of HFE 7500 Coolant Dielectric Strength
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Topics: Coolants, Flow (Dynamics), Human failure events, Fluids, Electrodes, Needles, Cooling, Pressure, Electronics, Gages
Proceedings Papers

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

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Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A005, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97412
https://doi.org/10.1115/IPACK2022-97412
View Paper titled, Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics
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Topics: Chemical vapor deposition, Coatings, Cooling, Density, Electrodes, Electronics, Fluids, Ionization, Thermal resistance
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

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Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74107
https://doi.org/10.1115/IPACK2017-74107
View Paper titled, Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection

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Yichao Yang, Zhili Hao
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A010, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48133
https://doi.org/10.1115/IPACK2015-48133
View Paper titled, A Microfluidic-Based Tactile Sensor for 3-DOF Force/Torque Detection
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Topics: Microfluidics, Tactile sensors, Torque, Transducers, Microchannels, Electrolytes, Computer numerical control machine tools, Electrodes, Engineering prototypes, Lithography
Proceedings Papers

Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach

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A. Baniya, S. Thapa, E. Borquist, D. Bailey, D. Wood, G. Dutta, P. Arumugam, J. Glawe, C. Kevil, L. Weiss
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T05A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48491
https://doi.org/10.1115/IPACK2015-48491
View Paper titled, Lab-on-a-Chip Device for Hydrogen Sulfide Sensing in Biomedical and Environmental Applications Using Electrochemical Approach
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Topics: Biomedicine, Hydrogen, Electrodes, Oxidation, Blood, Calibration, Chemistry, Diseases, Plasma desorption mass spectrometry, Plasmas (Ionized gases)
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

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Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

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Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73130
https://doi.org/10.1115/IPACK2013-73130
View Paper titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density
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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion
Proceedings Papers

Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

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Akihiro Hirata, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A011, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73171
https://doi.org/10.1115/IPACK2013-73171
View Paper titled, Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls
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Topics: Electrodes, Lead-free solders, Tin, Plating baths, Shear (Mechanics), Solders, Intermetallic compounds, Melting, Nickel plating
Proceedings Papers

A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions

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Stephen H. Taylor, Suresh V. Garimella
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A051, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73283
https://doi.org/10.1115/IPACK2013-73283
View Paper titled, A Capacitance-Based Technique for Characterization of Dielectric Interfaces Using a Grid of Electrode Junctions
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Topics: Capacitance, Electrodes, Junctions, Electric fields, Design, Sensors, Circuits, Dimensions, Fracture (Materials), Network models
Proceedings Papers

Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application

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Ryou Kikuchi, Ikuo Shohji, Yuta Saitoh, Norio Nemoto, Tsuyoshi Nakagawa, Nobuaki Ebihara, Fusao Iwase
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 667-672, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52025
https://doi.org/10.1115/IPACK2011-52025
View Paper titled, Effect of Aging on Tensile Properties and Microstructures of Eutectic Sn-Pb Solder With Small Amounts of Au and Pd for Aerospace Application
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Topics: Aerospace industry, Solders, Tensile strength, Tin, Elongation, Brittleness, Electrodes, Mechanical properties
Proceedings Papers

Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode

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Takahiro Kano, Ikuo Shohji, Tetsuyuki Tsuchida, Toshikazu Ookubo
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 663-666, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52024
https://doi.org/10.1115/IPACK2011-52024
View Paper titled, Effect of Thickness of Pd Plating Layer on Shear Strength of Lead-Free Solder Ball Joint With Electroless Ni/Pd/Au Plated Electrode
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Topics: Electrodes, Lead-free solders, Plating, Shear strength, Shear (Mechanics), Tin, Reliability, Solders
Proceedings Papers

Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld

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Hironori Tohmyoh, Tomochika Tanaka, Masato Fujimori, Masumi Saka
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 709-712, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52071
https://doi.org/10.1115/IPACK2011-52071
View Paper titled, Joule Heat Welding of Thin Metallic Wires and Thermoelectric Effects Around Dissimilar Metal Weld
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Topics: Heat, Joules, Metals, Thermoelectricity, Welding, Wire, Temperature, Circuits, Electrodes
Proceedings Papers

Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology

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Han-Jung Wang, Hung-An Deng, Shih-Ying Chiang, Kuo-Ning Chiang
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 401-407, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52201
https://doi.org/10.1115/IPACK2011-52201
View Paper titled, Thin Film Residual Stress Assessment of MEMS Microphone Using Process Modeling Technology
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Topics: Microelectromechanical systems, Microphones, Modeling, Stress, Thin films, Finite element analysis, Aluminum, Deformation, Polysilicon, Residual stresses
Proceedings Papers

Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

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Hiroki Yanamori, Takuma Kobayashi, Masaki Omiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 417-424, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52259
https://doi.org/10.1115/IPACK2011-52259
View Paper titled, Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor
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Topics: Actuators, Metallic composites, Microelectromechanical systems, Polymers, Sensors, Electrodes, Electric fields, Membranes, Temperature, Composite materials
Proceedings Papers

Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component

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Kanji Takagi, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1-8, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89019
https://doi.org/10.1115/InterPACK2009-89019
View Paper titled, Reflow Process Simulation for Dispersion Evaluation of Solder Joint Shape on Chip Component
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Topics: Process simulation, Shapes, Solder joints, Reliability, Electronic components, Manufacturing, Simulation, Surface tension, Crack propagation, Design
Proceedings Papers

Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films

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Toshiaki Tanaka, Aiko Sato, Hitoshi Asano, Mitsuru Takenaga
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 517-520, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89058
https://doi.org/10.1115/InterPACK2009-89058
View Paper titled, Resonant Tunneling Peaks Appeared in the Current: Voltage Characteristics for Polymeric Thin Films
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Topics: Chain, Electric fields, Electrodes, Film thickness, Glass, Irradiation (Radiation exposure), Microscopy, Polymer films, Resonance, Silicon
Proceedings Papers

In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures

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Hiroki Kishi, Takuya Sasaki, Nobuki Ueta, Ken Suzuki, Hideo Miura
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 239-245, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89145
https://doi.org/10.1115/InterPACK2009-89145
View Paper titled, In-Line Evaluation Method of the Intrinsic Stress of Thin Films Used for Transistor Structures
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Topics: Evaluation methods, Stress, Thin films, Transistors, Gates (Closures), Electrodes, Finite element methods, Manufacturing, Stress concentration, Focused ion beams
Proceedings Papers

Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad

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Feng Gao, Jianmin Qu, Matthew Yao
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 543-547, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89099
https://doi.org/10.1115/InterPACK2009-89099
View Paper titled, Electronic Structure and Contact Resistance at the Interface Between Carbon Nanotubes and Copper Pad
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Topics: Carbon nanotubes, Contact resistance, Copper, Electron configuration, Density, Electrodes, Electrons, Density functional theory, Electrical properties, Electronics
Proceedings Papers

Manipulation of Thin Metallic Wires by Joule Heat Joining

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Hironori Tohmyoh, Hironao Takeda, M. A. Salam Akanda, Masumi Saka
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 563-567, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89122
https://doi.org/10.1115/InterPACK2009-89122
View Paper titled, Manipulation of Thin Metallic Wires by Joule Heat Joining
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Topics: Heat, Joining, Joules, Wire, Electrical properties, Electrodes, Electromagnetic actuators, Heating, Microelectromechanical systems, Nanoelectromechanical systems
Proceedings Papers

Novel Miniature DMFC With Monolithic Si Electrodes

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Masanori Hayase, Yosuke Saito
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 459-462, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89143
https://doi.org/10.1115/InterPACK2009-89143
View Paper titled, Novel Miniature DMFC With Monolithic Si Electrodes
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Topics: Direct methanol fuel cells, Electrodes, Catalysts, Plating, Semiconductor wafers, Energy generation, Engineering prototypes, Fuels, Metals, Methanol