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Proceedings Papers

Transient and Steady State Thermal Response of a System With Thermoelectric Coolers

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Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74015
https://doi.org/10.1115/IPACK2017-74015
View Paper titled, Transient and Steady State Thermal Response of a System With Thermoelectric Coolers
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Topics: Steady state, Thermoelectric coolers, Transients (Dynamics), Thermal resistance, Eigenfunctions, Eigenvalues, Insulation, Thermal systems
Proceedings Papers

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure

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Hideo Koguchi, Kazuhisa Hoshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 149-156, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52065
https://doi.org/10.1115/IPACK2011-52065
View Paper titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in 3D Joint Structure
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Topics: Joining, Resins, Silicon, Bonding, Boundary element methods, Eigenvalues, Stress concentration, Stress singularity, Delamination, Density
Proceedings Papers

Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method

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Toru Ikeda, Hiroshi Hirai, Mitsutoshi Abe, Masatsugu Chiba, Noriyuki Miyazaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 463-471, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52073
https://doi.org/10.1115/IPACK2011-52073
View Paper titled, Stress Intensity Factor Analysis of an Interfacial Corner Between Piezoelectric Bimaterials in a Two Dimensional Structure Using the H -Integral Method
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Topics: Corners (Structural elements), Stress, Anisotropy, Piezoelectric materials, Eigenvalues, Electronic packages, Finite element methods, Microelectromechanical systems, Eigenfunctions, Failure
Proceedings Papers

Band Gap Properties of Piezoelectric/Viscous Liquid Phononic Crystals

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Yi-Ze Wang, Kazuaki Inaba, Feng-Ming Li, Kikuo Kishimoto
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 175-178, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52098
https://doi.org/10.1115/IPACK2011-52098
View Paper titled, Band Gap Properties of Piezoelectric/Viscous Liquid Phononic Crystals
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Topics: Energy gap, Phononic crystals, Damping, Eigenvalues
Proceedings Papers

Numerical Solutions of Poisson Equation by the CIP-Basis Set Method

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Daisuke Shibata, Takayuki Utsumi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 91-98, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89150
https://doi.org/10.1115/InterPACK2009-89150
View Paper titled, Numerical Solutions of Poisson Equation by the CIP-Basis Set Method
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Topics: Poisson equation, Waves, Polynomials, Computers, Crystals, Density, Eigenvalues, Electron configuration, Electrons, Errors
Proceedings Papers

Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints

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Hideo Koguchi, Masato Nakajima
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 717-727, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89091
https://doi.org/10.1115/InterPACK2009-89091
View Paper titled, Evaluation of the Bonding Strength at the Three-Dimensional Vertex in Silicon-Resin Joints
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Topics: Bonding, Resins, Silicon, Stress, Thermal stresses, Boundary element methods, Delamination, Materials properties, Stress concentration, Cooling
Proceedings Papers

Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses

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Hideo Koguchi, Takashi Taniguchi
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 863-872, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33592
https://doi.org/10.1115/IPACK2007-33592
View Paper titled, Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses
Open the PDF for Evaluation of Interface Strength at the 3D-Corner in Si-Resin Joint Considering Residual Thermal Stresses in another window
Topics: Corners (Structural elements), Resins, Thermal stresses, Stress singularity, Bonding, Boundary element methods, Materials properties, Residual stresses, Cooling, Delamination