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Proceedings Papers

Molecular Dynamics Investigation of Water Behavior Through Nanopores

Kimia Montazeri, Penghui Cao, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2699
https://doi.org/10.1115/IPACK2020-2699
View Paper titled, Molecular Dynamics Investigation of Water Behavior Through Nanopores
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Topics: Density, Molecular dynamics, Nanopores, Water, Nanoscale phenomena, Dimensions, Dynamics (Mechanics), Energy storage, Engineering systems and industry applications, Fluids
Proceedings Papers

Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings

Quang N. Pham, Youngjoon Suh, Bowen Shao, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6307
https://doi.org/10.1115/IPACK2019-6307
View Paper titled, Boiling Heat Transfer Using Spatially-Variant and Uniform Microporous Coatings
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Topics: Boiling, Bubbles, Coatings, Dynamics (Mechanics), Heat transfer, Pool boiling, Flow (Dynamics), Thermal management, Cooling, Design
Proceedings Papers

Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger

Omri Tayyara, Kshitij Gupta, Carlos Da Silva, Miad Nasr, Amir Assadi, Olivier Trescases, Cristina H. Amon
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A012, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6434
https://doi.org/10.1115/IPACK2019-6434
View Paper titled, Effects of Cooling Architecture and PCB Layout Co-Design on the Concurrent Thermal and Electrical Performance of an On-Board Electric Vehicle Charger
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Topics: Cooling, Design, Electric vehicles, Vehicles, Circuits, Density, Dynamics (Mechanics), Energy dissipation, Engineering prototypes, Engineering simulation
Proceedings Papers

Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics

James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6440
https://doi.org/10.1115/IPACK2019-6440
View Paper titled, Integrated Optical Probing of the Thermal Dynamics of Wide Bandgap Power Electronics
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Topics: Dynamics (Mechanics), Electron mobility, Electronics, Energy gap, Gallium nitride, Heating, Imaging, Temperature measurement, Thermoreflectance, Transistors
Proceedings Papers

Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating

Tatiana Zolotoukhina
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A003, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48297
https://doi.org/10.1115/IPACK2015-48297
View Paper titled, Thermal Conductivity of Phonon Modes in Graphene Nanoribbon at Localized High Heating
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Topics: Graphene, Heating, Phonons, Thermal conductivity, Transients (Dynamics), Equilibrium (Physics), High temperature, Density, Dispersion relations, Dynamics (Mechanics)
Proceedings Papers

Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels

Mirco Magnini, John R. Thome
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48033
https://doi.org/10.1115/IPACK2015-48033
View Paper titled, Use of Two-Phase CFD Simulations to Develop a Boiling Heat Transfer Prediction Method for Slug Flow Within Microchannels
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Topics: Boiling, Computational fluid dynamics, Engineering simulation, Heat transfer, Microchannels, Simulation, Slug flows, Bubbles, Evaporation, Flow (Dynamics)
Proceedings Papers

Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation

Abhijit Dasgupta, Ed Habtour, Raman Sridharan, Elaine Lin
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48709
https://doi.org/10.1115/IPACK2015-48709
View Paper titled, Durability of Large Electronic Components Undergoing Multi-Axial Vibratory Excitation
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Topics: Durability, Electronic components, Excitation, Testing, Circuits, Printed circuit boards, Degrees of freedom, Dynamics (Mechanics), Vibration, Damage
Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48655
https://doi.org/10.1115/IPACK2015-48655
View Paper titled, DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids
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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73264
https://doi.org/10.1115/IPACK2013-73264
View Paper titled, Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness

Susmita Dash, Niru Kumari, Mercy Dicuangco, Suresh V. Garimella
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 685-692, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52046
https://doi.org/10.1115/IPACK2011-52046
View Paper titled, Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces With Hierarchical Roughness
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Topics: Manufacturing, Surface roughness, Drops, Microscale devices, Dynamics (Mechanics), Etching, Robustness, Wetting
Proceedings Papers

Dynamics of Droplet Motion Under Electrowetting Actuation

S. Ravi Annapragada, Susmita Dash, Suresh V. Garimella, Jayathi Y. Murthy
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 693-701, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52061
https://doi.org/10.1115/IPACK2011-52061
View Paper titled, Dynamics of Droplet Motion Under Electrowetting Actuation
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Topics: Drops, Dynamics (Mechanics), Shapes, Transients (Dynamics), Fluids, Physics, Steady state, Surface tension, Water
Proceedings Papers

Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime

Ryan P. Anderson, Alfonso Ortega
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 229-237, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89020
https://doi.org/10.1115/InterPACK2009-89020
View Paper titled, Experiments and Modeling of a Liquid Droplet Transported by a Gas Stream Impinging on a Heated Surface: Single Phase Regime
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Topics: Drops, Modeling, Heat transfer coefficients, Sprays, Air flow, Convection, Cooling, Dynamics (Mechanics), Evaporation, Flow (Dynamics)
Proceedings Papers

Microgap Cooling Technique Based on Evaporation of Thin Liquid Films

D. V. Zaitsev, O. A. Kabov
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 545-551, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89318
https://doi.org/10.1115/InterPACK2009-89318
View Paper titled, Microgap Cooling Technique Based on Evaporation of Thin Liquid Films
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Topics: Cooling, Evaporation, Lubrication theory, Flow (Dynamics), Liquid films, Gas flow, Shear (Mechanics), Water, Critical heat flux, Dynamics (Mechanics)
Proceedings Papers

Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics

Yogen Utturkar, Mehmet Arik, Tunc Icoz
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 973-984, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89322
https://doi.org/10.1115/InterPACK2009-89322
View Paper titled, Thermal Characteristics of a Synthetic Jet Integrated Heat Sink Design for Air-Cooled Electronics
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Topics: Design, Electronics, Heat sinks, Cooling, Air jets, Computer simulation, Condensation, Dynamics (Mechanics), Electronic systems, Energy dissipation
Proceedings Papers

Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center

Ratnesh Sharma, Rocky Shih, Chandrakant Patel, John Sontag
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 851-857, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33700
https://doi.org/10.1115/IPACK2007-33700
View Paper titled, Application of Exploratory Data Analysis (EDA) Techniques to Temperature Data in a Conventional Data Center
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Topics: Data centers, Temperature, Cooling, Thermal management, Density, Energy consumption, Sensors, Surges, Air flow, Calibration
Proceedings Papers

Quantitative Characterization of Microsystem Dynamics

Ryszard J. Pryputniewicz, Emily J. Pryputniewicz
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 37-42, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33503
https://doi.org/10.1115/IPACK2007-33503
View Paper titled, Quantitative Characterization of Microsystem Dynamics
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Topics: Dynamics (Mechanics), Microelectromechanical systems, Stress
Proceedings Papers

Electronic Board/System Nonlinearity Characterization for Dynamic Analysis

Frank Z. Liang, Wade Hezeltine, Richard L. Williams
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1493-1497, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73277
https://doi.org/10.1115/IPACK2005-73277
View Paper titled, Electronic Board/System Nonlinearity Characterization for Dynamic Analysis
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Topics: Dynamic analysis, Dynamics (Mechanics), Finite element model, Lumber, Random vibration, Shock (Mechanics), Vibration tests
Proceedings Papers

Effect of Reflow Parameters on Solder Wetting

Suk Chae Kang, Daniel F. Baldwin
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 177-182, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35193
https://doi.org/10.1115/IPACK2003-35193
View Paper titled, Effect of Reflow Parameters on Solder Wetting
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Topics: Solders, Wetting, Temperature, Constitutive equations, Cooling, Dynamics (Mechanics), Electronics, Manufacturing, Metals, Temperature profiles