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Proceedings Papers

Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model

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Husam A. Alissa, Kourosh Nemati, Bahgat Sammakia, Mark Seymour, Ken Schneebeli, Roger Schmidt
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A016, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48234
https://doi.org/10.1115/IPACK2015-48234
View Paper titled, Experimental and Numerical Characterization of a Raised Floor Data Center Using Rapid Operational Flow Curves Model
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Topics: Data centers, Flow (Dynamics), Modeling, Computational fluid dynamics, Pressure, Tiles, Boundary-value problems, Cooling, Dimensions, Ducts
Proceedings Papers

Improved Cooling of Electromagnetics by Directed Airflow

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Scott Downing, Adam Fain, Pradip Majumdar
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A052, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73286
https://doi.org/10.1115/IPACK2013-73286
View Paper titled, Improved Cooling of Electromagnetics by Directed Airflow
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Topics: Air flow, Cooling, Electromagnetic force, Electromagnetism, Computational fluid dynamics, Testing, Shapes, Aircraft, Computer simulation, Dimensions
Proceedings Papers

Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment

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Yasushi Nishino, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 341-346, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89103
https://doi.org/10.1115/InterPACK2009-89103
View Paper titled, Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment
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Topics: Cooling, Dimensions, Electronic equipment, Clearances (Engineering), Copper, Flow (Dynamics), Temperature, Ducts, Particulate matter, Transparency
Proceedings Papers

Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct

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Frank Fan Wang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 211-216, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33070
https://doi.org/10.1115/IPACK2007-33070
View Paper titled, Force Air Cooled Electronic Equipment Under Loss of Cooling Condition With Blocked Air Duct
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Topics: Cooling, Ducts, Electronic equipment, Design, Aerospace industry, Air flow, Buoyancy, Computational fluid dynamics, Electronics, Failure
Proceedings Papers

Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures

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Jesse VanEngelenhoven, Gary L. Solbrekken, Karl J. L. Geisler
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 801-809, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33641
https://doi.org/10.1115/IPACK2007-33641
View Paper titled, Thermal Performance Maps for Forced Air Cooling of Ruggedized Electronics Enclosures
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Topics: Cooling, Electronics, Heat, Ducts, Heat transfer, Manufacturing, Pressure drop, Air flow, Boundary-value problems, Energy dissipation
Proceedings Papers

Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels

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Y. L. Hao, Y.-X. Tao
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 449-459, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35224
https://doi.org/10.1115/IPACK2003-35224
View Paper titled, Numerical Calculation of Heat Transfer Coefficient of Liquid Flow With NPCM in Microchannels
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Topics: Flow (Dynamics), Heat transfer coefficients, Microchannels, Heat transfer, Laminar flow, Particulate matter, Computational fluid dynamics, Computer simulation, Computers, Ducts
Proceedings Papers

Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks

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Ralph L. Webb, Jin Wook Paek
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 699-704, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35354
https://doi.org/10.1115/IPACK2003-35354
View Paper titled, Entrance and Exit Losses for Developing Flow in Plain Fin Heat Sinks
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Topics: Flow (Dynamics), Heat sinks, Pressure drop, Ducts, Errors, Heat exchangers, Plates (structures)
Proceedings Papers

Low-Profile Synthetic Jet Cooling for Portable Computers

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Raghav Mahalingam, Ari Glezer
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 147-151, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35069
https://doi.org/10.1115/IPACK2003-35069
View Paper titled, Low-Profile Synthetic Jet Cooling for Portable Computers
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Topics: Computers, Cooling, Cavities, Ejectors, Fluids, Channel flow, Diaphragms (Mechanical devices), Diaphragms (Structural), Ducts, Electronic systems