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Proceedings Papers

Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution

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Vibin Shalom Simon, Saket Karajgikar, Veerendra Mulay, Sai Abhideep Pundla, Krishna Bhavana Sivaraju, Gautam Gupta, Pratik Bansode, Dereje Agonafer
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112078
https://doi.org/10.1115/IPACK2023-112078
View Paper titled, Energy Analysis of Rear Door Heat Exchangers in Data Centers With Spatial Workload Distribution
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Topics: Cooling, Data centers, Doors, Heat exchangers
Proceedings Papers

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

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Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97494
https://doi.org/10.1115/IPACK2022-97494
View Paper titled, Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center
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Topics: Cooling, Data centers, Density, Doors, Heat exchangers
Proceedings Papers

Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure

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Kourosh Nemati, Husam A. Alissa, Mohammad I. Tradat, Bahgat Sammakia
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74148
https://doi.org/10.1115/IPACK2017-74148
View Paper titled, Transient Thermal Performance of Rear Door Heat Exchanger in Local Contained Environment During Water Side Failure
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Topics: Doors, Failure, Heat exchangers, Transients (Dynamics), Water, Cooling, Data centers, Temperature, Density, Flow (Dynamics)
Proceedings Papers

Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems

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Tianyi Gao, Marcelo del Valle, Alfonso Ortega, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A043, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48377
https://doi.org/10.1115/IPACK2015-48377
View Paper titled, Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Computer simulation, Flow (Dynamics), Temperature, Coolers
Proceedings Papers

Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems

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Marcelo del Valle, Alfonso Ortega
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A021, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48375
https://doi.org/10.1115/IPACK2015-48375
View Paper titled, Experimental Characterization of the Transient Response of Air/Water Crossflow Heat Exchangers for Data Center Cooling Systems
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Topics: Cooling systems, Data centers, Experimental characterization, Heat exchangers, Transients (Dynamics), Water, Flow (Dynamics), Temperature, Circuits, Cooling
Proceedings Papers

Understanding the True Total Cost of Ownership of Water Cooling for Data Centers

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Dustin W. Demetriou, Vinod Kamath, Howard Mahaney
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A013, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48152
https://doi.org/10.1115/IPACK2015-48152
View Paper titled, Understanding the True Total Cost of Ownership of Water Cooling for Data Centers
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Topics: Cooling, Data centers, Water, Construction, Density, Doors, Energy dissipation, Heat, Heat exchangers, Innovation
Proceedings Papers

Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers

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Tianyi Gao, Emad Samadiani, Bahgat Sammakia, Roger Schmidt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73101
https://doi.org/10.1115/IPACK2013-73101
View Paper titled, Comparative Thermal and Energy Analysis of a Hybrid Cooling Data Center With Rear Door Heat Exchangers
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Topics: Cooling, Data centers, Doors, Energy consumption, Heat exchangers
Proceedings Papers

Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units

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Tianyi Gao, Emad Samadiani, Roger Schmidt, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73196
https://doi.org/10.1115/IPACK2013-73196
View Paper titled, Dynamic Analysis of Hybrid Cooling Data Centers Subjects to the Failure of CRAC Units
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Topics: Cooling, Data centers, Dynamic analysis, Failure, Cooling systems, Water, Doors, Emergencies, Heat exchangers, Temperature
Proceedings Papers

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

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Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A021, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73090
https://doi.org/10.1115/IPACK2013-73090
View Paper titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Water, Heat, Stress, Cooling, Disks, Electronics, Flow (Dynamics), Heat exchangers, Motor drives
Proceedings Papers

Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures

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Madhusudan Iyengar, Roger Schmidt, Vinod Kamath, Bejoy Kochuparambil
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 617-622, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52207
https://doi.org/10.1115/IPACK2011-52207
View Paper titled, Experimental Characterization of Server Rack Energy Use at Elevated Ambient Temperatures
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Topics: Energy consumption, Experimental characterization, Server racks, Temperature, Doors, Heat exchangers, Data centers, Stress, Algorithms, Cooling
Proceedings Papers

Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger

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Vikneshan Sundaralingam, Pramod Kumar, Yogendra Joshi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 489-496, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52114
https://doi.org/10.1115/IPACK2011-52114
View Paper titled, Server Heat Load Based CRAC Fan Controller Paired With Rear Door Heat Exchanger
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Topics: Control equipment, Doors, Heat, Heat exchangers, Stress, Cooling, Data centers, Air conditioning, Blades, Computer software
Proceedings Papers

An Overview of the Power 775 Supercomputer Water Cooling System

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Michael J. Ellsworth, Jr., Gary F. Goth, Randy J. Zoodsma, Amilcar Arvelo, Levi A. Campbell, William J. Anderl
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 221-229, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52130
https://doi.org/10.1115/IPACK2011-52130
View Paper titled, An Overview of the Power 775 Supercomputer Water Cooling System
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Topics: Cooling systems, Water, Heat, Stress, Cooling, Disks, Heat exchangers, Doors, Electronics, Energy efficiency
Proceedings Papers

Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits

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Srujan Gondipalli, Bahgat Sammakia, Siddarth Bhopte, Roger Schmidt, Madhusudan K. Iyengar, Bruce Murray
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 841-850, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89203
https://doi.org/10.1115/InterPACK2009-89203
View Paper titled, Optimization of Cold Aisle Isolation Designs for a Data Center With Roofs and Doors Using Slits
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Topics: Data centers, Doors, Optimization, Roofs, Temperature, Air flow, Ceilings, Heat, Computers, Coolers
Proceedings Papers

Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines

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Roger Schmidt, Madhusudan Iyengar
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 851-862, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89212
https://doi.org/10.1115/InterPACK2009-89212
View Paper titled, Server Rack Rear Door Heat Exchanger and the New ASHRAE Recommended Environmental Guidelines
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Topics: Doors, Heat exchangers, Server racks, Water
Proceedings Papers

Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center

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Michael K. Patterson, Don Atwood, John G. Miner
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 1009-1014, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89358
https://doi.org/10.1115/InterPACK2009-89358
View Paper titled, Evaluation of Air-Side Economizer Use in a Compute-Intensive Data Center
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Topics: Data centers, Cooling, Cooling systems, Energy consumption, Temperature control, Air conditioning, Design, Doors, Engineers, Heating
Proceedings Papers

IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design

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Roger Schmidt, Mike Ellsworth, Madhu Iyengar, Gary New
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 863-873, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89213
https://doi.org/10.1115/InterPACK2009-89213
View Paper titled, IBM’s POWER6 High Performance Water Cooled Cluster at NCAR: Infrastructure Design
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Topics: Design, Doors, Water
Proceedings Papers

Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger

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Roger Schmidt, Richard C. Chu, Mike Ellsworth, Madhu Iyengar, Don Porter, Vinod Kamath, Bret Lehman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 663-673, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73468
https://doi.org/10.1115/IPACK2005-73468
View Paper titled, Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger
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Topics: Data centers, Doors, Heat exchangers, Temperature, Water