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Proceedings Papers

Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A032, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143310
https://doi.org/10.1115/IPACK2024-143310
View Paper titled, Sequential High Humidity and Isothermal Evolution of UF-Substrate Interface
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Topics: Damage, Delamination, Displacement, Failure, Fracture (Materials), High temperature, Reliability, Stress
Proceedings Papers

Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces

Pradeep Lall, Padmanava Choudhury, Aathi Pandurangan, Madhu Kasturi
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A031, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-143308
https://doi.org/10.1115/IPACK2024-143308
View Paper titled, Hygrothermal Aging Evolution of Non-PFAS FCBGA Interfaces
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Topics: Copper, Delamination, Diseases, Displacement, Electronics, Fracture (Materials), High temperature, Liver, Reliability, Stress
Proceedings Papers

Quick Turn Methodology for High Temperature Solder Fatigue Reliability

Matthew Norris, David Huitink
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A020, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113999
https://doi.org/10.1115/IPACK2023-113999
View Paper titled, Quick Turn Methodology for High Temperature Solder Fatigue Reliability
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Topics: Fatigue, High temperature, Lead-free solders, Reliability, Solders, Cycles, Failure, Geometry, Temperature, Thermal shock
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
https://doi.org/10.1115/IPACK2022-97440
View Paper titled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
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Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
https://doi.org/10.1115/IPACK2020-2676
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)
Proceedings Papers

Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration

Paul Paret, Joshua Major, Douglas DeVoto, Sreekant Narumanchi, Yansong Tan, Guo-Quan Lu
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8276
https://doi.org/10.1115/IPACK2018-8276
View Paper titled, Mechanical Characterization Study of Sintered Silver Pastes Bonded in a Double-Lap Configuration
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Topics: Silver, Particulate matter, Pressure, Collaboration, Displacement, Electronics, Energy gap, High pressure (Physics), High temperature, Manufacturing
Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74017
https://doi.org/10.1115/IPACK2017-74017
View Paper titled, An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow
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Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

CMUTs in Permanent Contact Operation for High Output Pressure

Min-Chieh Ho, Maik Hoffmann, Alexander Unger, Kwan Kyu Park, Mario Kupnik, Butrus T. Khuri-Yakub
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T07A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48733
https://doi.org/10.1115/IPACK2015-48733
View Paper titled, CMUTs in Permanent Contact Operation for High Output Pressure
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Topics: Pressure, Transducers, Acoustics, Cavities, Ultrasonic transducers, Bonding, Cycles, Deflection, Displacement, High temperature
Proceedings Papers

Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application

Hideo Koguchi, Tomiya Maekawa, Chonlada Luangarpa
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T03A005, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48381
https://doi.org/10.1115/IPACK2015-48381
View Paper titled, Investigation on Singular Fields at the Vertex of Interface in Piezoelectric Material Joints and its Application
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Topics: Piezoelectric materials, Density, Displacement, Stress, Stress singularity, Compression, Corners (Structural elements)
Proceedings Papers

An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball

Sai Sudharsanan Paranjothy, Ganesh Subbarayan, Dae Young Jung, Bahgat G. Sammakia
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48653
https://doi.org/10.1115/IPACK2015-48653
View Paper titled, An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball
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Topics: Constitutive equations, Copper, Displacement, Finite element analysis, Fracture (Materials), Fracture (Process), Bonding, Electrical properties, High temperature, Modeling
Proceedings Papers

LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation

Pradeep Lall, Junchao Wei
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48785
https://doi.org/10.1115/IPACK2015-48785
View Paper titled, LED Chip Deformation Measurement During the Operation Using the X-Ray CT Digital Volume Correlation
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Topics: Computerized tomography, Deformation, Displacement, Computation, Electron configuration, Electronics, Heat, Interferometry, Light-emitting diodes, Shapes
Proceedings Papers

A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface

David Samet, Abhishek Kwatra, Suresh K. Sitaraman
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A012, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48447
https://doi.org/10.1115/IPACK2015-48447
View Paper titled, A Compliance-Based Approach to Study Fatigue Crack Propagation for a Copper-Epoxy Interface
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Topics: Copper, Epoxy adhesives, Epoxy resins, Fatigue cracks, Fracture (Materials), Crack propagation, Fatigue, Cycles, Design, Displacement
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73245
https://doi.org/10.1115/IPACK2013-73245
View Paper titled, A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface

Hayato Izumi, Ryota Mukaiyama, Nobuyuki Shishido, Shoji Kamiya
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T06A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73324
https://doi.org/10.1115/IPACK2013-73324
View Paper titled, Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
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Topics: Hydrogen, Mechanical properties, Silicon crystals, Silicon, Atoms, Boiling, Boron, Deformation, Plasticity, Stress
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73112
https://doi.org/10.1115/IPACK2013-73112
View Paper titled, Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing

J. D. Hoffman, B. A. Dow, R. D. Lorenz
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A015, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73269
https://doi.org/10.1115/IPACK2013-73269
View Paper titled, Integration of Point Field Detectors Within Power Electronic Packages to Achieve Multifunctional Sensing
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Topics: Electronic packages, Sensors, Design, Displacement, Finite element analysis, Semiconductors (Materials), Temperature, Currents, Eddies (Fluid dynamics), Eddy currents (Electricity)
Proceedings Papers

Multiphysics Simulation of RF-MEMS With Quantified Uncertainties

Lin Sun, Hojin Kim, Alejandro Strachan, Sanjay R. Mathur, Jayathi Y. Murthy
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A007, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73175
https://doi.org/10.1115/IPACK2013-73175
View Paper titled, Multiphysics Simulation of RF-MEMS With Quantified Uncertainties
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Topics: Microelectromechanical systems, Simulation, Uncertainty, Deformation, Chaos, Complex systems, Damping, Displacement, Electrostatics, Fluids
Proceedings Papers

Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection

Abhishek Tambat, Hung-Yun Lin, Ian Claydon, Ganesh Subbarayan, Dae-Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 317-323, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52237
https://doi.org/10.1115/IPACK2011-52237
View Paper titled, Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection
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Topics: Dielectric materials, Fracture (Materials), Modeling, Failure, Fracture (Process), Fracture toughness, Boundary-value problems, Computer-aided design, Crack propagation, Displacement
Proceedings Papers

Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 247-255, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52144
https://doi.org/10.1115/IPACK2011-52144
View Paper titled, Simulation of Thermal Positioning in Micro- and Nano-Scale Bridge Structures
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Topics: Bridges (Structures), Convection, Heat conduction, Nanoscale phenomena, Simulation, Displacement, Pressure, Silicon, Cooling, Diamonds