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Proceedings Papers

Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects

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Souvik Chakraborty, Debabrata Mondal, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2024, ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A020, October 8–10, 2024
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2024-141356
https://doi.org/10.1115/IPACK2024-141356
View Paper titled, Effect of Die Parameters on the Thermomechanical Performance of PBGA Packages With Hybrid SAC-LTS Interconnects
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Topics: Dimensions, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Fatigue life, Finite element analysis, Solders, Boundary-value problems, Design, Energy consumption
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

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Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97437
https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
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Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning

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Pradeep Lall, Tony Thomas, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A019, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74066
https://doi.org/10.1115/IPACK2021-74066
View Paper titled, Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning
Open the PDF for Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning in another window
Topics: Solders, Temperature, Vibration, Failure, Signals, Service life (Equipment), Time series, Complex systems, Dimensions, Maintenance
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

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Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-72975
https://doi.org/10.1115/IPACK2021-72975
View Paper titled, Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure
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Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter

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Shreyas Rao, Abhijit Chakravarty, Dharmesh Jani
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73253
https://doi.org/10.1115/IPACK2021-73253
View Paper titled, BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter
Open the PDF for BER Illusion Methodology: A Novel, Open Sourced and Scalable Approach to Troubleshooting High Radix Photonics Interconnects in a Modern Hyperscale Datacenter in another window
Topics: Dimensions, Errors, Failure, Failure analysis, Flow (Dynamics), Manufacturing, Optical interconnections, Optics, Photonics, Resolution (Optics)
Proceedings Papers

Molecular Dynamics Investigation of Water Behavior Through Nanopores

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Kimia Montazeri, Penghui Cao, Yoonjin Won
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2699
https://doi.org/10.1115/IPACK2020-2699
View Paper titled, Molecular Dynamics Investigation of Water Behavior Through Nanopores
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Topics: Density, Molecular dynamics, Nanopores, Water, Nanoscale phenomena, Dimensions, Dynamics (Mechanics), Energy storage, Engineering systems and industry applications, Fluids
Proceedings Papers

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application

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Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A007, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2581
https://doi.org/10.1115/IPACK2020-2581
View Paper titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application
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Topics: MOSFET transistors, Risk assessment, Traction, Temperature, Failure, Reliability, Capacitors, Risk, Boundary-value problems, Cycles
Proceedings Papers

Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)

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Robert Carroll, Carlos Gutierrez, Leila Choobineh, Robert Geer
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6514
https://doi.org/10.1115/IPACK2019-6514
View Paper titled, Fabrication Steps and Thermal Modeling of Three-Dimensional Asynchronous Field Programmable Gate Array (3D-AFPGA)
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Topics: Gates (Closures), Manufacturing, Modeling, Temperature, Computer simulation, Delays, Density, Design, Dimensions, Energy consumption
Proceedings Papers

Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions

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Maxim Serebreni, Patrick McCluskey, David Hillman, Nathan Blattau, Craig Hillman
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8338
https://doi.org/10.1115/IPACK2018-8338
View Paper titled, Experimental and Numerical Investigation of Underfill Materials on Thermal Cycle Fatigue of Second Level Solder Interconnects Under Mean Temperature Conditions
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Topics: Cycles, Fatigue, Solders, Temperature, Solder joints, Ball-Grid-Array packages, Ball-Grid-Array packaging, Coatings, Dimensions, Electronic products
Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

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Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8350
https://doi.org/10.1115/IPACK2018-8350
View Paper titled, Thermal Characterization of Si BEOL Microelectronic Structures
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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties
Proceedings Papers

Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics

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Pradeep Lall, Hao Zhang, Rahul Lall
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74232
https://doi.org/10.1115/IPACK2017-74232
View Paper titled, Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics
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Topics: Biometry, Design, Flexible electronics, Sensors, Electronics, Manufacturing, Reliability, Thermal stresses, Biomedicine, Copper
Proceedings Papers

Advanced Cooling of 3D ICs With Nanoparticle Packings

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Anil Yuksel, Paul S. Ho, Jayathi Murthy
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74137
https://doi.org/10.1115/IPACK2017-74137
View Paper titled, Advanced Cooling of 3D ICs With Nanoparticle Packings
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Topics: Cooling, Nanoparticles, Packings (Cushioning), Energy dissipation, Heat, Thermal management, Dimensions, High temperature, Phonons, Polaritons
Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

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L. M. Boteler, S. M. Miner
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74130
https://doi.org/10.1115/IPACK2017-74130
View Paper titled, Power Packaging Thermal and Stress Model for Quick Parametric Analyses
Open the PDF for Power Packaging Thermal and Stress Model for Quick Parametric Analyses in another window
Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering
Proceedings Papers

Peel-and-Stick Sensors Powered by Directed RF Energy

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Christopher Lalau-Keraly, George Daniel, Joseph Lee, David Schwartz
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74150
https://doi.org/10.1115/IPACK2017-74150
View Paper titled, Peel-and-Stick Sensors Powered by Directed RF Energy
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Topics: Sensors, Building management systems, Design, Dimensions, Energy harvesting, Flexible electronics, Signals, Temperature
Proceedings Papers

Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling

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Daniel Bae, Raphael Mandel, Michael Ohadi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A024, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74158
https://doi.org/10.1115/IPACK2017-74158
View Paper titled, Effect of Bonding Structure and Heater Design on Performance Enhancement of FEEDS Embedded Manifold-Microchannel Cooling
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Topics: Bonding, Cooling, Design, Manifolds, Microchannels, Heat flux, Electronics, Fluids, Manufacturing, Computational fluid dynamics
Proceedings Papers

PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads

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Pradeep Lall, Tony Thomas
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74239
https://doi.org/10.1115/IPACK2017-74239
View Paper titled, PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads
Open the PDF for PCA and ICA Based Prognostic Health Monitoring of Electronic Assemblies Subjected to Simultaneous Temperature-Vibration Loads in another window
Topics: Stress, Temperature, Vibration, Failure, Signals, Time-frequency analysis, Algorithms, Independent component analysis, Dimensions, Filtration
Proceedings Papers

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

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Joon Hong Boo, Hyun Gon Kim, Chang Woo Han
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74095
https://doi.org/10.1115/IPACK2017-74095
View Paper titled, The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick
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Topics: Computer cooling, Heat pipes, Stress, Thermal resistance, Fluids, Wire screens, Containers, Cooling, Copper, Density
Proceedings Papers

Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding

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Ah-Young Park, S. B. Park
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A066, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48042
https://doi.org/10.1115/IPACK2015-48042
View Paper titled, Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding
Open the PDF for Design Guideline to Improve Thermal Management of 3D Package Using Cu-to-Cu Direct Bonding in another window
Topics: Bonding, Design, Thermal management, Finite element analysis, Packaging, Solders, Dimensions, Energy consumption, Heat transfer, Integrated circuits
Proceedings Papers

A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force

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Hsien-Chin Su
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A002, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48151
https://doi.org/10.1115/IPACK2015-48151
View Paper titled, A Miniature Double Oscillating-Fan Cooling System Using Electromagnetic Force
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Topics: Cooling systems, Electromagnetic force, Cooling, Blades, Dimensions, Electromagnets, Bearings, Design, Energy consumption, Engines
Proceedings Papers

Thermally-Optimum Design of GaN-on-SiC HEMT

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Caleb A. Holloway, Avram Bar-Cohen
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A052, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48119
https://doi.org/10.1115/IPACK2015-48119
View Paper titled, Thermally-Optimum Design of GaN-on-SiC HEMT
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Topics: Design, Gallium nitride, Temperature, Geometry, Heat, Interfacial thermal resistance, Junctions, Thermal resistance, Cooling, Dimensions